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AX5031-1-TW30

Onsemi

AX5031-1-TW30 by Onsemi

AX5031-1-TW30 by Onsemi is a CMOS telecom IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a peak reflow temperature of 260°C. Ideal for industrial applications requiring a 3V supply voltage and very thin profile design.

Median Price

$3.622

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 612 parts In-Stock

1+ parts

-

100+ parts

$3.220

1k+ parts

$2.880

10k+ parts

$2.710

612

-

$3.220

$2.880

$2.710

Verical

USA . 612 parts In-Stock

1+ parts

-

100+ parts

$4.025

1k+ parts

$3.600

10k+ parts

$3.388

612

-

$4.025

$3.600

$3.388

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,047 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

-

2,047

$3.410

-

-

-

Bristol Electronics

USA . 6 parts In-Stock

1+ parts

$5.700

100+ parts

-

1k+ parts

-

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-

6

$5.700

-

-

-

Vyrian

USA . 5,348 parts In-Stock

1+ parts

-

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-

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5,348

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,991 parts In-Stock

1+ parts

$3.231

100+ parts

-

1k+ parts

-

10k+ parts

-

1,991

$3.231

-

-

-

Corohmni

South Africa . 310 parts In-Stock

1+ parts

$3.590

100+ parts

-

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-

10k+ parts

-

310

$3.590

-

-

-

AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$20.690

100+ parts

-

1k+ parts

-

10k+ parts

-

744

$20.690

-

-

-

Native Components

USA . 936 parts In-Stock

1+ parts

$368.750

100+ parts

$361.375

1k+ parts

$357.688

10k+ parts

$354.000

936

$368.750

$361.375

$357.688

$354.000

Northwest PG Solutions

USA . 2,354 parts In-Stock

1+ parts

$405.625

100+ parts

-

1k+ parts

-

10k+ parts

-

2,354

$405.625

-

-

-

TANS Electronics

Latvia . 7,096 parts In-Stock

1+ parts

-

100+ parts

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7,096

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-

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Problanco Electronics

Mexico . 5,515 parts In-Stock

1+ parts

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5,515

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-

-

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Kulean Microsystems

USA . 2,027 parts In-Stock

1+ parts

-

100+ parts

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2,027

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-

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UHIMA Technologies

Türkiye . 512 parts In-Stock

1+ parts

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1k+ parts

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512

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-

-

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SupplyDigital Components

Austria . 409 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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409

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Overview

Discover the AX5031-1-TW30 by Onsemi, a cutting-edge Telecom Interface IC that delivers unmatched quality and reliability. Designed with precision by Onsemi, this product is perfect for a variety of applications in the telecommunications industry. With its advanced technology and industrial-grade temperature grade, the AX5031-1-TW30 ensures optimal performance in demanding environments. Experience the value and benefits of this innovative product, offering customers seamless connectivity and enhanced functionality. Choose Onsemi for superior quality and performance in every application.

Feature Benefit Bullets

Surface Mount: YES

Ease of assembly and higher reliability due to reduced number of connection points.

Package Shape: SQUARE

Optimal use of space and compact design for efficient integration.

No. of Terminals: 20

Sufficient terminals for connectivity and functionality requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Heat dissipation capabilities and thin profile for space-constrained applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments to ensure reliable operation under varying temperatures.

Nominal Supply Voltage: 3 V

Energy-efficient operation with lower voltage requirement.

Technology: CMOS

Low power consumption and efficient processing.

Technical Specifications

Other Function Telecom Interface ICs AX5031-1-TW30 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

AX5031-1-TW30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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