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AX5042-1-TW30

Onsemi

AX5042-1-TW30 by Onsemi

AX5042-1-TW30 by Onsemi is a telecom IC with CMOS technology, operating at -40 to 85 °C. It has 28 terminals in a square chip carrier package style, with Ni/Pd/Au terminal finish. This IC supports data rates up to 0.25 Mbps and is ideal for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,573 parts In-Stock

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Digiode

USA . 789 parts In-Stock

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789

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Distributors (Availability)

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Native Components

USA . 462 parts In-Stock

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$6.778

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462

$6.778

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AZTECH Wire

Italy . 229 parts In-Stock

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$14.090

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QUARKTWIN TECHNOLOGY LTD

USA . 22,356 parts In-Stock

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TANS Electronics

Latvia . 5,242 parts In-Stock

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Kulean Microsystems

USA . 3,580 parts In-Stock

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SupplyDigital Components

Austria . 2,247 parts In-Stock

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Problanco Electronics

Mexico . 2,121 parts In-Stock

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Corphita

USA . 941 parts In-Stock

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UHIMA Technologies

Türkiye . 695 parts In-Stock

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695

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Northwest PG Solutions

USA . 445 parts In-Stock

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Corohmni

South Africa . 227 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the AX5042-1-TW30. This innovative telecom interface IC offers a wide range of applications, ensuring seamless performance in various industries. The AX5042-1-TW30 provides exceptional value with its advanced technology, high efficiency, and industrial-grade temperature range. Trust Onsemi for cutting-edge solutions that deliver unmatched benefits and advantages to elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto PCBs, making installation and production processes more streamlined and cost-effective.

Package Shape: SQUARE

The square package shape provides a compact footprint, allowing for efficient use of space on the PCB and optimizing the overall design layout.

No. of Terminals: 28

With 28 terminals, this product offers versatility in connectivity options and can support various input/output configurations, making it suitable for a wide range of telecom applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding industrial environments where temperature fluctuations may occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C provides flexibility in usage scenarios and ensures functionality in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish materials such as nickel, palladium, and gold enhances conductivity, corrosion resistance, and overall reliability of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that this product is designed to withstand harsh operating conditions, making it a dependable choice for industrial telecom applications.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides compatibility with a wide range of power sources and ensures stable and efficient operation of the telecom interface IC.

Data Rate: 0.25 Mbps

With a data rate of 0.25 Mbps, this product can facilitate smooth and reliable data transmission in telecom applications, enabling high-speed communication with minimal latency.

Technical Specifications

Other Function Telecom Interface ICs AX5042-1-TW30 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e4

Length:

5 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AX5042-1-TW30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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