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AX5042-1-TA05

Onsemi

AX5042-1-TA05 by Onsemi

The Onsemi AX5042-1-TA05 is a Telecom Interface IC with 28 terminals in a square chip carrier package. It operates b/w -40 °C to 85°C, suitable for industrial applications. This CMOS technology IC has a nominal voltage of 2.5V and terminal finish of Ni/Pd/Au, making it ideal for telecom circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,351 parts In-Stock

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Digiode

USA . 546 parts In-Stock

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546

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Native Components

USA . 457 parts In-Stock

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$6.669

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457

$6.669

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AZTECH Wire

Italy . 291 parts In-Stock

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$16.980

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QUARKTWIN TECHNOLOGY LTD

USA . 15,535 parts In-Stock

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Problanco Electronics

Mexico . 8,338 parts In-Stock

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SupplyDigital Components

Austria . 6,675 parts In-Stock

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TANS Electronics

Latvia . 5,527 parts In-Stock

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Kulean Microsystems

USA . 3,755 parts In-Stock

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Northwest PG Solutions

USA . 2,208 parts In-Stock

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Corphita

USA . 2,076 parts In-Stock

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UHIMA Technologies

Türkiye . 346 parts In-Stock

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Corohmni

South Africa . 58 parts In-Stock

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Overview

Enhance your telecom interfaces with the AX5042-1-TA05 by Onsemi, a top-of-the-line solution that guarantees reliability and performance. Onsemi is known for its cutting-edge technology and commitment to excellence, ensuring that their products meet the highest standards. This versatile IC is ideal for various applications in the telecom industry, offering customers value, efficiency, and seamless functionality. Upgrade your systems with the AX5042-1-TA05 and experience the benefits of superior quality and innovation.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and quick installation on PCBs, saving time and effort during production.

No. of Terminals: 28

Provides a sufficient number of connection points for versatile functionality and connectivity options.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of temperature conditions, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the device.

Nominal Supply Voltage: 2.5 V

Operates at a standard voltage level, making it compatible with a wide range of systems and power sources.

Technical Specifications

Other Function Telecom Interface ICs AX5042-1-TA05 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AX5042-1-TA05 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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