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STA020DJTR

STMicroelectronics

STA020DJTR by STMicroelectronics

STA020DJTR by STMicroelectronics is a telecom interface IC designed for commercial applications. It features a 3.3V nominal voltage, operates b/w 0 °C to 70 °C, and has a compact 24-terminal gull-wing package. Ideal for surface mount technology in telecom devices.

Median Price

$2.780

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 965 parts In-Stock

1+ parts

$2.750

100+ parts

-

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965

$2.750

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-

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Mouser Electronics

USA . 258 parts In-Stock

1+ parts

$2.780

100+ parts

-

1k+ parts

$2.770

10k+ parts

$2.650

258

$2.780

-

$2.770

$2.650

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$3.810

100+ parts

-

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-

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1,000

$3.810

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-

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Verical

USA . 965 parts In-Stock

1+ parts

-

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10k+ parts

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965

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Distributors (In-Stock)

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Digiode

USA . 1,654 parts In-Stock

1+ parts

$2.620

100+ parts

-

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1,654

$2.620

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Vyrian

USA . 5,606 parts In-Stock

1+ parts

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5,606

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Anansix

USA . 1,470 parts In-Stock

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-

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1,470

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,935 parts In-Stock

1+ parts

$1.750

100+ parts

-

1k+ parts

-

10k+ parts

-

7,935

$1.750

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Corphita

USA . 2,637 parts In-Stock

1+ parts

$2.482

100+ parts

-

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2,637

$2.482

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IDEA Electronic Components Group

UK . 1,707 parts In-Stock

1+ parts

$16.238

100+ parts

-

1k+ parts

$14.614

10k+ parts

-

1,707

$16.238

-

$14.614

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Microchip USA

USA . 2,364 parts In-Stock

1+ parts

$22.986

100+ parts

-

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2,364

$22.986

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MKK Technologies

India . 1,742 parts In-Stock

1+ parts

$30.534

100+ parts

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1,742

$30.534

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-

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DigiPath Technology Company

USA . 1,742 parts In-Stock

1+ parts

$30.534

100+ parts

-

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10k+ parts

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1,742

$30.534

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RC Electronics

USA . 20,865 parts In-Stock

1+ parts

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20,865

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 4,718 parts In-Stock

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4,718

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Authorized Procurement Solutions

USA . 3,779 parts In-Stock

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3,779

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iodParts Technologies Inc.

India . 2,000 parts In-Stock

1+ parts

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2,000

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Perfect Parts

USA . 1,089 parts In-Stock

1+ parts

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1,089

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Parana Technologies

USA . 588 parts In-Stock

1+ parts

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100+ parts

$19.415

1k+ parts

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10k+ parts

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588

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$19.415

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Overview

Elevate your telecom applications with the STA020DJTR from STMicroelectronics, where innovation meets reliability. Crafted from high-quality materials, this interface IC excels in performance across diverse environments, ensuring seamless connectivity and enhanced signal integrity. With STMicroelectronics' reputation for excellence, you gain not just a component but a trusted partner in powering your devices with cutting-edge technology. Experience superior value and efficiency that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and efficient use of PCB space, enhancing overall circuit performance.

Package Shape: RECTANGULAR

The rectangular shape provides efficient layout in tight spaces, facilitating easier integration into existing designs.

No. of Terminals: 24

With 24 terminals, this product supports a wide range of functionalities, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced board space requirements, making it ideal for compact devices.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures reliable performance in moderately warm environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for functionality in a wide range of environments, increasing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances conductivity and provides excellent corrosion resistance, ensuring long-lasting performance.

Terminal Position: DUAL

Dual terminal position provides flexible mounting options on the PCB, simplifying the design process.

Maximum Seated Height: 2.65 mm

A maximum seated height of 2.65 mm allows for low-profile designs, making it suitable for applications with height constraints.

Width: 7.5 mm

The compact width of 7.5 mm makes it suitable for dense PCB layouts, optimizing space without compromising on functionality.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature of 260 °C supports compatibility with modern soldering techniques, ensuring robust connections.

Length: 15.4 mm

The 15.4 mm length provides a balance between functionality and space requirements, fitting a variety of designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for typical consumer applications, ensuring reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making this IC efficient for telecom applications.

Terminal Form: GULL WING

The gull wing terminal design facilitates easy soldering and reflow, improving manufacturing efficiency.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring optimal performance in communication systems.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common standard in digital circuits, making it easy to integrate into various systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easier routing on PCBs and improves manufacturability.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable handling precautions, allowing for confidence in long-term storage and reliability.

Technical Specifications

Other Function Telecom Interface ICs STA020DJTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

STA020DJTR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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