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LNBH26LSPQR

STMicroelectronics

LNBH26LSPQR by STMicroelectronics

STMicroelectronics LNBH26LSPQR is a 24-terminal telecom IC with 12V supply voltage. It features a square chip carrier package, 1mm seated height, and 0.5mm terminal pitch. Ideal for telecom circuits, this IC is surface mountable and has a quad terminal position for compact applications.

Median Price

$0.650

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,764 parts In-Stock

1+ parts

$0.650

100+ parts

-

1k+ parts

-

10k+ parts

-

1,764

$0.650

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,688 parts In-Stock

1+ parts

$0.618

100+ parts

-

1k+ parts

-

10k+ parts

-

3,688

$0.618

-

-

-

Nova Conductors

Japan . 97 parts In-Stock

1+ parts

$0.963

100+ parts

-

1k+ parts

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97

$0.963

-

-

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Vyrian

USA . 6,789 parts In-Stock

1+ parts

-

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6,789

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ACDS - Activité Composants Distribution Service

France . 3,505 parts In-Stock

1+ parts

-

100+ parts

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3,505

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-

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Bristol Electronics

USA . 3,195 parts In-Stock

1+ parts

-

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3,195

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-

-

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Dan-Mar Components

USA . 3,195 parts In-Stock

1+ parts

-

100+ parts

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3,195

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-

-

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Anansix

USA . 1,837 parts In-Stock

1+ parts

-

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1,837

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,712 parts In-Stock

1+ parts

$0.550

100+ parts

$0.536

1k+ parts

$0.534

10k+ parts

-

2,712

$0.550

$0.536

$0.534

-

Ampacity Inc.

Singapore . 2,401 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

2,401

$0.550

-

-

-

Corphita

USA . 4,547 parts In-Stock

1+ parts

$0.585

100+ parts

-

1k+ parts

-

10k+ parts

-

4,547

$0.585

-

-

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Argo Parts USA

USA . 1,748 parts In-Stock

1+ parts

$0.963

100+ parts

-

1k+ parts

-

10k+ parts

-

1,748

$0.963

-

-

-

Corohmni

South Africa . 526 parts In-Stock

1+ parts

$1.165

100+ parts

-

1k+ parts

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10k+ parts

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526

$1.165

-

-

-

Continental Prestige Electronics

USA . 2,822 parts In-Stock

1+ parts

$1.380

100+ parts

$1.010

1k+ parts

$0.832

10k+ parts

-

2,822

$1.380

$1.010

$0.832

-

IDEA Electronic Components Group

UK . 514 parts In-Stock

1+ parts

$5.606

100+ parts

-

1k+ parts

$5.046

10k+ parts

-

514

$5.606

-

$5.046

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Microchip USA

USA . 5,847 parts In-Stock

1+ parts

$7.841

100+ parts

-

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10k+ parts

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5,847

$7.841

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-

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MKK Technologies

India . 2,039 parts In-Stock

1+ parts

$10.543

100+ parts

-

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10k+ parts

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2,039

$10.543

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-

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DigiPath Technology Company

USA . 2,039 parts In-Stock

1+ parts

$10.543

100+ parts

-

1k+ parts

-

10k+ parts

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2,039

$10.543

-

-

-

Aztec Data Supply Inc.

USA . 742 parts In-Stock

1+ parts

$11.800

100+ parts

-

1k+ parts

-

10k+ parts

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742

$11.800

-

-

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$14.850

100+ parts

-

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254

$14.850

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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15,000

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Lixinc

USA . 14,400 parts In-Stock

1+ parts

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14,400

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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A-Z Elektronik GmbH

Germany . 2,498 parts In-Stock

1+ parts

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2,498

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Parana Technologies

USA . 2,233 parts In-Stock

1+ parts

-

100+ parts

$6.703

1k+ parts

-

10k+ parts

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2,233

-

$6.703

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Alle Elektronik GmbH

Germany . 1,665 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,665

-

-

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Bastille Electronics

Australia . 650 parts In-Stock

1+ parts

-

100+ parts

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650

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-

Overview

Discover the cutting-edge technology of the LNBH26LSPQR by STMicroelectronics, a high-quality telecom interface IC that offers unparalleled performance and reliability. With a square package shape and 24 terminals, this surface-mount chip carrier is perfect for a wide range of applications. Whether you're looking to enhance communication systems or improve network connectivity, this innovative product delivers exceptional value and functionality. Trust STMicroelectronics to provide top-of-the-line solutions for all your telecom interface needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, making installation and production faster and more cost-effective.

Package Shape: SQUARE

Square packages are known for their efficient use of board space and can make the product more compact and space-saving.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and versatility in use, suitable for a variety of telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers thermal management through the heat sink/slugs and a thin profile for space-constrained applications.

Terminal Position: QUAD

Quad terminal positions provide better stability and support on the PCB, reducing the chances of connectivity issues and ensuring reliable operation.

Maximum Seated Height: 1 mm

With a low seated height of 1mm, this product can fit into compact spaces and slim devices, enhancing design flexibility and integration possibilities.

Width: 4 mm

A width of 4mm offers a balance between space efficiency and ease of handling during assembly, contributing to overall product usability.

Length: 4 mm

The 4mm length complements the square package shape, creating a symmetrical and uniform design for better aesthetics and alignment on the PCB.

Terminal Form: NO LEAD

No lead terminals reduce the risk of solder joint cracks, ensuring long-term reliability and robustness in telecom applications subject to frequent connectivity changes.

Telecom IC Type: TELECOM CIRCUIT

Being designed specifically for telecom circuits, this product offers optimized performance, functionality, and compatibility in telecommunication systems.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12V, this product aligns with standard power requirements in telecom applications, ensuring seamless integration and operation.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm allows for high-density mounting and facilitates fine-pitch connections, enhancing signal integrity and overall system performance.

Technical Specifications

Other Function Telecom Interface ICs LNBH26LSPQR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LNBH26LSPQR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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