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ADS58J64IRRHT

Texas Instruments

ADS58J64IRRHT by Texas Instruments

Texas Instruments ADS58J64IRRHT is a 72-terminal telecom IC with max analog input of 2V. Operating b/w -40 to 85°C, it's ideal for industrial applications requiring a nominal voltage of 1.15V. This surface-mount chip carrier supports quad terminal position and nickel palladium gold finish.

Median Price

$552.531

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,572 parts In-Stock

1+ parts

$552.531

100+ parts

$500.136

1k+ parts

$476.320

10k+ parts

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1,572

$552.531

$500.136

$476.320

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,158 parts In-Stock

1+ parts

$524.904

100+ parts

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2,158

$524.904

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Vyrian

USA . 6,864 parts In-Stock

1+ parts

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6,864

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 185 parts In-Stock

1+ parts

$2.084

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-

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185

$2.084

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Northwest PG Solutions

USA . 713 parts In-Stock

1+ parts

$2.292

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713

$2.292

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Parana Technologies

USA . 1,577 parts In-Stock

1+ parts

$12.387

100+ parts

-

1k+ parts

$12.826

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1,577

$12.387

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$12.826

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AZTECH Wire

Italy . 1,121 parts In-Stock

1+ parts

$13.160

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1,121

$13.160

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DigiPath Technology Company

USA . 1,512 parts In-Stock

1+ parts

$13.640

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1,512

$13.640

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ChromeModa Solutions

Germany . 1,538 parts In-Stock

1+ parts

$13.918

100+ parts

$11.413

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1,538

$13.918

$11.413

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IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$13.918

100+ parts

$13.222

1k+ parts

$12.526

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789

$13.918

$13.222

$12.526

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Corphita

USA . 528 parts In-Stock

1+ parts

$497.278

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528

$497.278

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Overview

Discover the ultimate solution for your telecom interface needs with the ADS58J64IRRHT by Texas Instruments. This high-quality IC offers unparalleled performance and reliability, thanks to the renowned manufacturer's expertise in cutting-edge technology. Ideal for a wide range of applications, this product provides exceptional value to customers seeking seamless connectivity and efficiency. Upgrade your systems with the ADS58J64IRRHT and experience the benefits of top-tier telecom circuit technology.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount on PCBs without the need for additional hardware, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Efficient use of space on the PCB, allowing for a compact design.

No. of Terminals: 72

Provides ample connectivity options for versatile applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Ensures operation in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable electrical connections and corrosion resistance.

Maximum Analog Input: 2 V

Supports a wide range of input signals for flexibility in signal processing.

Peak Reflow Temperature: 260 °C

Can withstand high-temperature soldering processes for assembly.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring optimal performance in such use cases.

Nominal Supply Voltage: 1.15 V

Operates at a low voltage for energy efficiency.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture, ensuring reliability in humid environments.

Technical Specifications

Other Function Telecom Interface ICs ADS58J64IRRHT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Maximum Analog Input:

2 V

JESD-30 Code:

R-XQCC-N72

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ADS58J64IRRHT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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