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ADS58J63IRMPR

Texas Instruments

ADS58J63IRMPR by Texas Instruments

Texas Instruments ADS58J63IRMPR is a telecom IC with 10000 Mbps data rate. It operates at -40 to 85 °C, with power supplies of 1.9V and 3V. The chip carrier package style has a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.

Median Price

$550.211

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,115 parts In-Stock

1+ parts

$550.211

100+ parts

$498.036

1k+ parts

$474.320

10k+ parts

-

2,115

$550.211

$498.036

$474.320

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,739 parts In-Stock

1+ parts

$522.700

100+ parts

-

1k+ parts

-

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2,739

$522.700

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Vyrian

USA . 4,277 parts In-Stock

1+ parts

-

100+ parts

-

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4,277

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Chip Stock

USA . 305 parts In-Stock

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-

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305

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 366 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

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366

$0.780

-

-

-

Northwest PG Solutions

USA . 1,215 parts In-Stock

1+ parts

$0.858

100+ parts

-

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-

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1,215

$0.858

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-

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Parana Technologies

USA . 2,306 parts In-Stock

1+ parts

$14.600

100+ parts

$1,355.873

1k+ parts

$13.140

10k+ parts

-

2,306

$14.600

$1,355.873

$13.140

-

AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$14.920

100+ parts

-

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754

$14.920

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DigiPath Technology Company

USA . 759 parts In-Stock

1+ parts

$16.077

100+ parts

$14.791

1k+ parts

-

10k+ parts

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759

$16.077

$14.791

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-

ChromeModa Solutions

Germany . 5,814 parts In-Stock

1+ parts

$16.405

100+ parts

$13.452

1k+ parts

-

10k+ parts

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5,814

$16.405

$13.452

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IDEA Electronic Components Group

UK . 1,125 parts In-Stock

1+ parts

$16.405

100+ parts

$15.585

1k+ parts

$14.764

10k+ parts

-

1,125

$16.405

$15.585

$14.764

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Corphita

USA . 1,047 parts In-Stock

1+ parts

$495.190

100+ parts

-

1k+ parts

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1,047

$495.190

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Lixinc

USA . 16,415 parts In-Stock

1+ parts

-

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16,415

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A-Z Elektronik GmbH

Germany . 7,013 parts In-Stock

1+ parts

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7,013

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Alle Elektronik GmbH

Germany . 4,675 parts In-Stock

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4,675

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Kepictronics

USA . 42 parts In-Stock

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42

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Overview

Unlock the power of high-quality telecom interface ICs with the ADS58J63IRMPR by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-of-the-line products that exceed expectations. This versatile chip carrier boasts a very thin profile and a wide range of applications, making it an essential component for various industries. From its reliable performance to its innovative design, the ADS58J63IRMPR offers customers unparalleled value, benefits, and advantages. Upgrade your projects with this cutting-edge solution and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes it easy to integrate into electronic devices, saving space and simplifying manufacturing processes.

Power Supplies (V): 1.9,3

Support for multiple power supply voltages allows for flexibility in design and compatibility with various systems.

No. of Terminals: 72

High number of terminals provide a wide range of connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles offer options for different applications and help optimize thermal management and space constraints.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in demanding environments.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes this product suitable for use in harsh industrial settings.

Data Rate: 10000 Mbps

High data rate capability enables fast and efficient communication, ideal for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ADS58J63IRMPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Maximum Analog Input:

2 V

Data Rate:

10000 Mbps

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC72,.39SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

ADS58J63IRMPR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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