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ADS58J89IRGCT

Texas Instruments

ADS58J89IRGCT by Texas Instruments

Texas Instruments ADS58J89IRGCT is a 64-terminal telecom IC with a data rate of 5000 Mbps. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. It features a max analog input of 2V and terminal finish in nickel palladium gold, making it ideal for high-speed communication systems.

Median Price

$394.144

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,573 parts In-Stock

1+ parts

$339.757

100+ parts

$307.539

1k+ parts

$292.894

10k+ parts

-

2,573

$339.757

$307.539

$292.894

-

Rochester

USA . 2,000 parts In-Stock

1+ parts

$350.350

100+ parts

$329.330

1k+ parts

$308.310

10k+ parts

-

2,000

$350.350

$329.330

$308.310

-

Verical

USA . 2,000 parts In-Stock

1+ parts

$437.938

100+ parts

$411.663

1k+ parts

$385.387

10k+ parts

-

2,000

$437.938

$411.663

$385.387

-

DigiKey

USA . 2,000 parts In-Stock

1+ parts

$437.940

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$437.940

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 208 parts In-Stock

1+ parts

$322.769

100+ parts

-

1k+ parts

-

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208

$322.769

-

-

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Vyrian

USA . 84 parts In-Stock

1+ parts

$339.757

100+ parts

-

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-

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84

$339.757

-

-

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DigiKey Marketplace

USA . 2,000 parts In-Stock

1+ parts

$423.100

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

$423.100

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,972 parts In-Stock

1+ parts

$2.808

100+ parts

-

1k+ parts

-

10k+ parts

-

1,972

$2.808

-

-

-

Parana Technologies

USA . 1,090 parts In-Stock

1+ parts

$13.289

100+ parts

$1,234.130

1k+ parts

$11.961

10k+ parts

-

1,090

$13.289

$1,234.130

$11.961

-

DigiPath Technology Company

USA . 1,237 parts In-Stock

1+ parts

$14.633

100+ parts

-

1k+ parts

-

10k+ parts

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1,237

$14.633

-

-

-

ChromeModa Solutions

Germany . 3,218 parts In-Stock

1+ parts

$14.932

100+ parts

$12.244

1k+ parts

-

10k+ parts

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3,218

$14.932

$12.244

-

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IDEA Electronic Components Group

UK . 1,125 parts In-Stock

1+ parts

$14.932

100+ parts

$14.185

1k+ parts

$13.439

10k+ parts

-

1,125

$14.932

$14.185

$13.439

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Corphita

USA . 4,484 parts In-Stock

1+ parts

$305.781

100+ parts

-

1k+ parts

-

10k+ parts

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4,484

$305.781

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-

-

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$393.720

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

$393.720

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-

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Component Stockers USA

USA . 4,319 parts In-Stock

1+ parts

$412.790

100+ parts

$391.750

1k+ parts

$314.330

10k+ parts

-

4,319

$412.790

$391.750

$314.330

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Native Components

USA . 815 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.476

10k+ parts

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815

-

-

$2.476

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A-Z Elektronik GmbH

Germany . 750 parts In-Stock

1+ parts

-

100+ parts

-

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750

-

-

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Kepictronics

USA . 712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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712

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-

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Overview

Unlock the power of cutting-edge telecommunications with the ADS58J89IRGCT by Texas Instruments. Renowned for their superior quality and innovative technology, Texas Instruments delivers excellence in every product. The ADS58J89IRGCT belongs to the category of Other Function Telecom Interface ICs, offering high-speed data transmission capabilities at 5000 Mbps. With a wide range of applications in the telecommunications industry, this chip carrier with a very thin profile provides customers with exceptional value, performance, and reliability. Experience seamless connectivity and unmatched efficiency with Texas Instruments' ADS58J89IRGCT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving time and effort during the manufacturing process.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures without compromising its functionality.

Nominal Supply Voltage: 1.8 V

Operates efficiently at a low supply voltage, leading to energy savings and improved power efficiency.

Data Rate: 5000 Mbps

High data rate capability enables fast and efficient data transmission, ideal for telecom applications that require high-speed communication.

Technical Specifications

Other Function Telecom Interface ICs ADS58J89IRGCT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Maximum Analog Input:

2 V

Data Rate:

5000 Mbps

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

ADS58J89IRGCT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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