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CC2531F128RHAT

Texas Instruments

CC2531F128RHAT by Texas Instruments

CC2531F128RHAT by Texas Instruments is a telecom IC with 40 terminals, operating b/w -40 to 125°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This chip carrier package is ideal for automotive applications due to its nickel palladium gold finish and moisture sensitivity level of 3.

Median Price

$6.168

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Chip1Stop

Japan . 230 parts In-Stock

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$1.690

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Arrow

USA . 230 parts In-Stock

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$6.168

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Texas Instruments

USA . 14,061 parts In-Stock

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$8.214

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$6.696

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$4.464

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Verical

USA . 230 parts In-Stock

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Flip Electronics

USA . 2,178 parts In-Stock

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$0.971

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Digiode

USA . 2,002 parts In-Stock

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$1.606

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Nova Conductors

Japan . 300 parts In-Stock

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$6.040

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Vyrian

USA . 5,851 parts In-Stock

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Prism Electronics

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Inventory MP

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Bristol Electronics

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Component Stockers USA

USA . 9,965 parts In-Stock

1+ parts

$0.630

100+ parts

$0.600

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$4.770

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$4.770

9,965

$0.630

$0.600

$4.770

$4.770

Ampacity Inc.

Singapore . 3,638 parts In-Stock

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$1.440

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$1.440

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Corphita

USA . 624 parts In-Stock

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$1.521

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Netroflash

USA . 500 parts In-Stock

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$6.040

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Parana Technologies

USA . 379 parts In-Stock

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$7.262

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$7.764

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ChromeModa Solutions

Germany . 3,720 parts In-Stock

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$8.159

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$6.690

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IDEA Electronic Components Group

UK . 2,210 parts In-Stock

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$8.159

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$7.343

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Corohmni

South Africa . 93 parts In-Stock

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$8.672

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$13.518

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$12.301

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$11.085

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$13.518

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AZTECH Wire

Italy . 234 parts In-Stock

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$18.110

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,685 parts In-Stock

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Glotronic Ltd.

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Alle Elektronik GmbH

Germany . 3,790 parts In-Stock

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DigiPath Technology Company

USA . 387 parts In-Stock

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Kepictronics

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Futuretech Components

Singapore . 210 parts In-Stock

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Perfect Parts

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Overview

Experience seamless connectivity and reliable performance with the CC2531F128RHAT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in their products. This Telecom Interface IC is perfect for a wide range of applications, offering unparalleled value and benefits to customers. Whether you're looking for automotive solutions or telecom circuits, this product delivers exceptional results with its advanced features and innovative design. Trust Texas Instruments to provide you with the best in class products for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this product lightweight and durable, ideal for telecommunications applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly of this IC onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape makes this IC compact and space-efficient, perfect for applications where board space is limited.

No. of Terminals: 40

With 40 terminals, this IC offers a high level of connectivity and functionality, making it versatile for a variety of telecom interface applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and compact design, making it a reliable choice for telecom applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and performance in tough environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this IC to operate in extreme cold conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy installation and connection, making it user-friendly for telecom interface applications.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm ensures a compact design and easy integration into tight spaces, ideal for telecom devices with limited room.

Width: 6 mm

The narrow width of 6mm allows for a compact footprint on circuit boards, saving space and enabling high-density packaging.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this IC is easy to solder and can withstand high-temperature reflow processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures the IC can withstand soldering processes without damage, making it reliable for manufacturing.

Length: 6 mm

The short length of 6mm contributes to the compact design of this IC, perfect for applications with space constraints.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this IC is designed to meet the rigorous temperature requirements of automotive applications, ensuring durability and reliability on the road.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and makes this IC environmentally friendly, meeting modern regulatory standards.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuit applications, this IC offers specialized features and performance tailored to the telecommunications industry.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage makes this IC compatible with a wide range of systems and power sources, adding versatility to its use.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting of this IC on circuit boards, maximizing functionality in a limited space.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC has a moderate level of moisture sensitivity, making it suitable for a variety of manufacturing and storage environments.

Technical Specifications

Other Function Telecom Interface ICs CC2531F128RHAT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC2531F128RHAT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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