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TLK2500IRCP

Texas Instruments

TLK2500IRCP by Texas Instruments

TLK2500IRCP by Texas Instruments is a telecom interface IC with 64 terminals, operating at temperatures from -40 to 85°C. It has power supplies of 2.5V and 3.3V, consuming a max current of 0.135mA. This IC is ideal for telecom circuits in industrial applications due to its compact square package design and surface-mount capability.

Median Price

$22.830

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 892 parts In-Stock

1+ parts

-

100+ parts

$19.750

1k+ parts

$17.670

10k+ parts

$16.630

892

-

$19.750

$17.670

$16.630

DigiKey

USA . 892 parts In-Stock

1+ parts

-

100+ parts

$22.830

1k+ parts

-

10k+ parts

-

892

-

$22.830

-

-

Verical

USA . 892 parts In-Stock

1+ parts

-

100+ parts

$24.688

1k+ parts

$22.087

10k+ parts

$20.788

892

-

$24.688

$22.087

$20.788

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,285 parts In-Stock

1+ parts

$20.852

100+ parts

-

1k+ parts

-

10k+ parts

-

3,285

$20.852

-

-

-

Vyrian

USA . 4,703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,703

-

-

-

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ComSIT Distribution GmbH

Germany . 110 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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110

-

-

-

-

ComSIT USA

USA . 110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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110

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,357 parts In-Stock

1+ parts

$15.582

100+ parts

-

1k+ parts

$15.958

10k+ parts

-

2,357

$15.582

-

$15.958

-

IDEA Electronic Components Group

UK . 615 parts In-Stock

1+ parts

$17.508

100+ parts

$16.633

1k+ parts

$15.757

10k+ parts

-

615

$17.508

$16.633

$15.757

-

ChromeModa Solutions

Germany . 520 parts In-Stock

1+ parts

$17.508

100+ parts

$14.357

1k+ parts

-

10k+ parts

-

520

$17.508

$14.357

-

-

Corphita

USA . 1,454 parts In-Stock

1+ parts

$19.755

100+ parts

-

1k+ parts

-

10k+ parts

-

1,454

$19.755

-

-

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DigiPath Technology Company

USA . 673 parts In-Stock

1+ parts

-

100+ parts

$15.785

1k+ parts

-

10k+ parts

-

673

-

$15.785

-

-

Kepictronics

USA . 274 parts In-Stock

1+ parts

-

100+ parts

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274

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Overview

Elevate your telecom system with the TLK2500IRCP by Texas Instruments. This high-quality telecom interface IC offers unparalleled performance and reliability, backed by the reputable manufacturer, Texas Instruments. With a wide range of applications in the telecommunications industry, this product provides exceptional value to customers looking for seamless connectivity and efficient data transmission. Upgrade your system today with the TLK2500IRCP and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to impact, making the product suitable for a variety of environments.

Surface Mount: YES

Facilitates easy installation and PCB assembly, reducing time and effort required for integration.

Power Supplies (V): 2.5,3.3

Supports multiple voltage options, offering flexibility in power requirements for different applications.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components and systems.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Offers versatile packaging options to suit different space and thermal constraints in various designs.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, increasing product reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, making it suitable for a wide range of applications.

Terminal Position: QUAD

Provides a quad terminal configuration, enhancing ease of connection and reducing setup complexity.

Width: 10 mm

Compact width dimensions allow for space-efficient integration in various system layouts.

Length: 10 mm

Compact length dimensions enable versatile placement options in electronic designs.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions, ensuring robust performance in demanding environments.

Terminal Form: GULL WING

Gull wing terminals offer secure soldering connections for reliable signal transmission.

Maximum Supply Current: 0.135 mA

Low supply current requirement for efficient power consumption, suitable for energy-efficient applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance in communication systems.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent operation, meeting the power needs of the telecom interface IC.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on PCBs, maximizing space utilization in compact designs.

Technical Specifications

Other Function Telecom Interface ICs TLK2500IRCP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.135 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TLK2500IRCP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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