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STA8088GA

STMicroelectronics

STA8088GA by STMicroelectronics

STA8088GA by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a -40 °C to 85°C operating temp range. It has a compact 7mm x 7mm square package with 56 terminals and operates at a nominal voltage of 1.2V. Ideal for space-constrained designs, it supports advanced CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,495 parts In-Stock

1+ parts

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4,495

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Vyrian

USA . 2,917 parts In-Stock

1+ parts

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2,917

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Anansix

USA . 1,858 parts In-Stock

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1,858

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,287 parts In-Stock

1+ parts

$12.680

100+ parts

-

1k+ parts

$11.412

10k+ parts

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2,287

$12.680

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$11.412

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AZTECH Wire

Italy . 535 parts In-Stock

1+ parts

$16.560

100+ parts

-

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535

$16.560

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MKK Technologies

India . 727 parts In-Stock

1+ parts

$23.845

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727

$23.845

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DigiPath Technology Company

USA . 727 parts In-Stock

1+ parts

$23.845

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727

$23.845

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Parana Technologies

USA . 2,016 parts In-Stock

1+ parts

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100+ parts

$15.161

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2,016

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$15.161

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RC Electronics

USA . 1,645 parts In-Stock

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1,645

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Corphita

USA . 1,432 parts In-Stock

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1,432

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Kepictronics

USA . 963 parts In-Stock

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963

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Overview

Elevate your telecom solutions with the STA8088GA by STMicroelectronics—where cutting-edge quality meets unmatched reliability. Designed for industrial applications, this sleek surface-mount IC offers exceptional performance in extreme temperatures while maintaining durability and efficiency. Trust in STMicroelectronics' renowned expertise to enhance your projects, ensuring seamless connectivity and superior functionality that translate into real-world benefits for your customers.

Feature Benefit Bullets

Surface Mount: YES

Allows for a compact design and efficient use of PCB space, making it suitable for modern electronic devices.

Package Shape: SQUARE

The square shape enables efficient thermal dissipation and makes layout easier in multi-chip configurations.

No. of Terminals: 56

Provides ample connectivity options for various applications, facilitating complex circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combines a thin profile with heat management features, ideal for high-density applications where space is a premium.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, ensuring reliability and performance under high temperature conditions.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold environments, enhancing its versatility for various industrial applications.

Terminal Finish: MATTE TIN

Provides excellent solderability and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: QUAD

Offers a balanced arrangement that enhances electrical and thermal performance, reducing potential interference.

Maximum Seated Height: 0.9 mm

The low profile design accommodates space-constrained applications while maintaining performance.

Width: 7 mm

Standard width facilitates compatibility with various PCB designs, making it easy to integrate into existing systems.

Maximum Time At Peak Reflow Temperature: 40 s

Optimized for efficient soldering processes, reducing manufacturing time while ensuring robust connections.

Peak Reflow Temperature: 260 °C

The high reflow temperature ensures compatibility with a variety of solder types and enhances durability.

Length: 7 mm

Standard length aids in streamlined integration into diverse applications without requiring custom PCB layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications where performance and durability under varying temperatures are crucial.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, making it efficient for telecom applications.

Terminal Form: NO LEAD

Enhances reliability and manufacturability while supporting environmental regulations concerning lead use.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance in communication systems.

Nominal Supply Voltage: 1.2 V

Low operating voltage contributes to energy efficiency, reducing overall power consumption in devices.

Terminal Pitch: 0.4 mm

Fine pitch allows for more compact designs, accommodating high-density applications and improving system performance.

Moisture Sensitivity Level (MSL): 3

Offers a balance of performance and handling requirements, providing some flexibility in manufacturing and storage.

Technical Specifications

Other Function Telecom Interface ICs STA8088GA attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

STA8088GA Telecommunications trade compliance attributes, and parameters.

ECCN

7A994

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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