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XE1203FI063TRLF

Semtech

XE1203FI063TRLF by Semtech

Semtech's XE1203FI063TRLF is a 48-terminal IC with 2.5/3.3V supplies, suitable for telecom circuits in industrial settings. With a compact square chip carrier package and low supply current of 0.075mA, it operates b/w -40 to 85°C temperatures efficiently.

Median Price

$7.840

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 800 parts In-Stock

1+ parts

$7.840

100+ parts

$3.397

1k+ parts

$3.214

10k+ parts

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800

$7.840

$3.397

$3.214

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Vyrian

USA . 8,786 parts In-Stock

1+ parts

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8,786

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Nova Conductors

Japan . 50 parts In-Stock

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50

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First Choice Components Inc.

USA . 31 parts In-Stock

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31

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$10.798

100+ parts

$9.826

1k+ parts

$8.854

10k+ parts

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350

$10.798

$9.826

$8.854

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AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$19.127

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443

$19.127

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Ampacity Inc.

Singapore . 1,121 parts In-Stock

1+ parts

$662.000

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1,121

$662.000

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Kepictronics

USA . 50,000 parts In-Stock

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50,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience seamless and reliable communication with the XE1203FI063TRLF by Semtech. Known for its exceptional quality and innovative technology, Semtech has crafted a product that exceeds expectations in the telecom industry. This versatile IC is perfect for various applications, providing customers with unparalleled value, reliability, and performance. Stay connected effortlessly with the XE1203FI063TRLF and elevate your communication experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term usage.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Package Shape: SQUARE

The square shape of the package provides a compact design for efficient use of space.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options allows for flexibility in different applications.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for various interfaces and functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient heat dissipation and compact form factor.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high heat conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes the product suitable for a wide range of environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish on terminals provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for easy installation and secure connections on circuit boards.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9 mm enables a slim profile for space-constrained applications.

Width: 7 mm

The compact width dimension of 7 mm contributes to the overall small footprint of the product.

Length: 7 mm

With a length of 7 mm, the product maintains a square shape for efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with regulations for sustainable manufacturing.

Maximum Supply Current: 0.075 mA

The low maximum supply current of 0.075 mA results in energy efficiency and minimal power consumption.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, the IC type offers optimized performance for telecommunication applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides compatibility with standard power sources for ease of integration.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting of components on circuit boards.

Technical Specifications

Other Function Telecom Interface ICs XE1203FI063TRLF attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Semtech

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

XE1203FI063TRLF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Semtech

Semtech Corporation is a high-performance semiconductor, IoT systems and Cloud connectivity service provider dedicated to delivering high quality technology solutions that enable a smarter, more connected and sustainable planet. Our global teams are dedicated to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. Since our founding in 1960 as a manufacturer of high reliability products, Semtech has grown to become a multinational technology innovator, enabling solutions that fuel a safer, more productive, more sustainable, and socially focused planet. We leverage our highly skilled teams to develop new products that solve some of the world’s most complex design challenges, making a positive and significant impact in our lives and environment.

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