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TRF2436IRTBRG4

Texas Instruments

TRF2436IRTBRG4 by Texas Instruments

TRF2436IRTBRG4 by Texas Instruments is a 40-terminal telecom IC with 3.3V supply voltage, operating b/w -20 to 85°C. It features a square chip carrier package style and matte tin terminal finish, suitable for telecom circuit applications requiring low power consumption at 0.55mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,598 parts In-Stock

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2,598

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Digiode

USA . 598 parts In-Stock

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598

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Distributors (Availability)

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AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$11.509

100+ parts

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400

$11.509

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Parana Technologies

USA . 1,065 parts In-Stock

1+ parts

$11.741

100+ parts

$1,090.319

1k+ parts

$10.567

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1,065

$11.741

$1,090.319

$10.567

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DigiPath Technology Company

USA . 710 parts In-Stock

1+ parts

$12.928

100+ parts

$11.894

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710

$12.928

$11.894

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ChromeModa Solutions

Germany . 3,552 parts In-Stock

1+ parts

$13.192

100+ parts

$10.817

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3,552

$13.192

$10.817

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IDEA Electronic Components Group

UK . 75 parts In-Stock

1+ parts

$13.192

100+ parts

$12.532

1k+ parts

$11.873

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75

$13.192

$12.532

$11.873

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One Stop Electronics

USA . 1,568 parts In-Stock

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$476.000

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1,568

$476.000

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Semicontronic

India . 370 parts In-Stock

1+ parts

$679.000

100+ parts

$662.025

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$658.630

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370

$679.000

$662.025

$658.630

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Ampacity Inc.

Singapore . 273 parts In-Stock

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$847.000

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273

$847.000

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Corphita

USA . 4,479 parts In-Stock

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4,479

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Corohmni

South Africa . 268 parts In-Stock

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Overview

Enhance your telecom applications with the TRF2436IRTBRG4 by Texas Instruments, a top-quality Other Function Telecom Interface IC. With a reliable manufacturer like Texas Instruments, you can trust in the performance and durability of this product. Offering a wide range of benefits and advantages, this IC provides optimal functionality for your projects. Upgrade your systems with this versatile and efficient solution, delivering value and reliability to your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material provides durability and protection for the IC, ensuring reliable performance over time.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs during manufacturing.

Power Supplies (V): 3.3

The 3.3V power supply is a common and widely available voltage level, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can function effectively in various environmental conditions without overheating.

Terminal Finish: MATTE TIN

The MATTE TIN terminal finish provides good conductivity and solderability, ensuring a secure and reliable connection in the circuit.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is within the standard operating range for many telecom applications, making this IC suitable for use in such systems.

Technical Specifications

Other Function Telecom Interface ICs TRF2436IRTBRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.55 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

TRF2436IRTBRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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