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TRF2436RTB

Texas Instruments

TRF2436RTB by Texas Instruments

TRF2436RTB by Texas Instruments is a 40-terminal telecom IC with 3.3V supply voltage, operating b/w -20 to 85°C. It comes in a square chip carrier package style, suitable for telecom circuit applications requiring surface mount technology and a terminal pitch of 0.5mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,907 parts In-Stock

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8,907

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Digiode

USA . 1,379 parts In-Stock

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1,379

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 356 parts In-Stock

1+ parts

$11.826

100+ parts

-

1k+ parts

$12.226

10k+ parts

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356

$11.826

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$12.226

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AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$13.088

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398

$13.088

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ChromeModa Solutions

Germany . 3,130 parts In-Stock

1+ parts

$13.288

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$10.896

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3,130

$13.288

$10.896

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IDEA Electronic Components Group

UK . 553 parts In-Stock

1+ parts

$13.288

100+ parts

$12.624

1k+ parts

$11.959

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553

$13.288

$12.624

$11.959

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Ampacity Inc.

Singapore . 1,564 parts In-Stock

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$227.000

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1,564

$227.000

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Semicontronic

India . 1,335 parts In-Stock

1+ parts

$865.000

100+ parts

$843.375

1k+ parts

$839.050

10k+ parts

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1,335

$865.000

$843.375

$839.050

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One Stop Electronics

USA . 832 parts In-Stock

1+ parts

$979.000

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832

$979.000

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Corphita

USA . 3,661 parts In-Stock

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3,661

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DigiPath Technology Company

USA . 698 parts In-Stock

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$11.980

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698

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$11.980

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Corohmni

South Africa . 349 parts In-Stock

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349

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Overview

Elevate your telecom interface with the TRF2436RTB by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for various telecommunications applications. This sleek and compact package offers customers unrivaled value and benefits, making it an essential component for any telecom project. Say goodbye to technical headaches and hello to seamless communication with the TRF2436RTB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs.

Package Shape: SQUARE

Square package shape provides a compact and space-efficient design for the product.

No. of Terminals: 40

High number of terminals enable connectivity and functionality for various telecom applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient thermal management and space savings.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures functionality even in extreme cold environments.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections for the product.

Maximum Seated Height: 0.9 mm

Low maximum seated height enables a slim and compact overall product design.

Width: 6 mm

6mm width allows for easy integration into various system configurations.

Length: 6 mm

6mm length contributes to the overall compactness and space efficiency of the product.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of lead-related issues and enhances product safety.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuit applications, ensuring optimal performance in telecommunication systems.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V allows for compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and connectivity for efficient circuit design.

Technical Specifications

Other Function Telecom Interface ICs TRF2436RTB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

TRF2436RTB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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