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TRF2436IRTBT

Texas Instruments

TRF2436IRTBT by Texas Instruments

TRF2436IRTBT by Texas Instruments is a 40-terminal telecom IC with 3.3V supply voltage, operating b/w -20 to 85°C. It features a square chip carrier package style and matte tin terminal finish, suitable for telecom circuit applications requiring low power consumption at 0.55mA.

Median Price

$18.320

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,380 parts In-Stock

1+ parts

-

100+ parts

$18.320

1k+ parts

-

10k+ parts

-

8,380

-

$18.320

-

-

Rochester

USA . 8,250 parts In-Stock

1+ parts

-

100+ parts

$15.850

1k+ parts

$14.180

10k+ parts

$13.340

8,250

-

$15.850

$14.180

$13.340

Verical

USA . 4,250 parts In-Stock

1+ parts

-

100+ parts

$19.813

1k+ parts

$17.725

10k+ parts

$16.675

4,250

-

$19.813

$17.725

$16.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,031 parts In-Stock

1+ parts

$16.739

100+ parts

-

1k+ parts

-

10k+ parts

-

4,031

$16.739

-

-

-

Vyrian

USA . 4,484 parts In-Stock

1+ parts

$17.620

100+ parts

-

1k+ parts

-

10k+ parts

-

4,484

$17.620

-

-

-

DigiKey Marketplace

USA . 8,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,380

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 183 parts In-Stock

1+ parts

$7.453

100+ parts

-

1k+ parts

$7.941

10k+ parts

-

183

$7.453

-

$7.941

-

DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$8.207

100+ parts

-

1k+ parts

-

10k+ parts

-

2,200

$8.207

-

-

-

IDEA Electronic Components Group

UK . 1,895 parts In-Stock

1+ parts

$8.374

100+ parts

$7.955

1k+ parts

$7.537

10k+ parts

-

1,895

$8.374

$7.955

$7.537

-

ChromeModa Solutions

Germany . 1,235 parts In-Stock

1+ parts

$8.374

100+ parts

$6.867

1k+ parts

-

10k+ parts

-

1,235

$8.374

$6.867

-

-

Corphita

USA . 4,997 parts In-Stock

1+ parts

$15.858

100+ parts

-

1k+ parts

-

10k+ parts

-

4,997

$15.858

-

-

-

Authorized Procurement Solutions

USA . 1,850,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,850,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,430

-

-

-

-

Perfect Parts

USA . 703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

703

-

-

-

-

Kepictronics

USA . 255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

255

-

-

-

-

Metaverse IC Inc.

Canada . 247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

247

-

-

-

-

Overview

Discover the innovative TRF2436IRTBT by Texas Instruments, a top-of-the-line product in the category of Other Function Telecom Interface ICs. Manufactured with precision and quality materials, this chip carrier boasts a square package shape and a very thin profile, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this telecom circuit offers unparalleled performance and reliability. Experience the benefits of seamless communication and unparalleled efficiency with the TRF2436IRTBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making it ideal for portable or mobile devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V, this product is compatible with many industry standard power sources.

No. of Terminals: 40

Having a high number of terminals allows for increased connectivity options, making it versatile for a variety of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain reliable performance.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures that this product can function effectively even in cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and electrical conductivity, enhancing the reliability of connections.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of signal paths and reduces the chance of interference, improving overall performance.

Width: 6 mm

The compact width of 6mm enables this product to be used in space-constrained applications without sacrificing functionality.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures that this product can operate reliably in a wide range of temperature conditions, suitable for commercial applications.

Technical Specifications

Other Function Telecom Interface ICs TRF2436IRTBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.55 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

TRF2436IRTBT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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