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TRF2432IRTQTG3

Texas Instruments

TRF2432IRTQTG3 by Texas Instruments

TRF2432IRTQTG3 by Texas Instruments is a 56-terminal telecom IC with 3.3V supply voltage, operating b/w -20 to 85°C. It features a square chip carrier package style and matte tin terminal finish, suitable for telecom circuit applications requiring low power consumption at 0.125mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,627 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,627

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-

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Digiode

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,963 parts In-Stock

1+ parts

$13.749

100+ parts

-

1k+ parts

$14.236

10k+ parts

-

1,963

$13.749

-

$14.236

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ChromeModa Solutions

Germany . 2,480 parts In-Stock

1+ parts

$15.448

100+ parts

$12.667

1k+ parts

-

10k+ parts

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2,480

$15.448

$12.667

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IDEA Electronic Components Group

UK . 737 parts In-Stock

1+ parts

$15.448

100+ parts

$14.676

1k+ parts

$13.903

10k+ parts

-

737

$15.448

$14.676

$13.903

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AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$17.321

100+ parts

-

1k+ parts

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10k+ parts

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512

$17.321

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One Stop Electronics

USA . 515 parts In-Stock

1+ parts

$881.000

100+ parts

-

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515

$881.000

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Corphita

USA . 2,317 parts In-Stock

1+ parts

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2,317

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DigiPath Technology Company

USA . 344 parts In-Stock

1+ parts

-

100+ parts

$13.928

1k+ parts

-

10k+ parts

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344

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$13.928

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Overview

Enhance your telecommunications systems with the TRF2432IRTQTG3 by Texas Instruments. Known for their top-quality products, Texas Instruments brings you a reliable and efficient solution for telecom interface applications. This versatile product offers customers unmatched value and benefits, making it a must-have for any telecom project. Upgrade your systems today and experience the advantages that the TRF2432IRTQTG3 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material offers good durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology makes it easier to integrate this product into electronic circuits and increases its reliability.

Power Supplies (V): 3.3

The 3.3V power supply is a common and easily accessible voltage level for various applications in the telecom industry.

No. of Terminals: 56

The high number of terminals allows for a greater range of connectivity options and functionality in the product.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand higher temperatures, making it suitable for a variety of environments.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides good corrosion resistance and ensures reliable electrical connections.

Width: 8 mm

The compact width of 8mm allows for space-saving integration of this product in telecom devices and systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures the product can withstand the soldering process during assembly without any damage.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a standard level used in many telecom applications, ensuring compatibility with existing systems.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this product has a moderate sensitivity to moisture, which is important for maintaining the product's reliability during storage and usage.

Technical Specifications

Other Function Telecom Interface ICs TRF2432IRTQTG3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.125 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

TRF2432IRTQTG3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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