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TRF2432IRTQRG3

Texas Instruments

TRF2432IRTQRG3 by Texas Instruments

TRF2432IRTQRG3 by Texas Instruments is a 56-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a square chip carrier package with matte tin finish and very thin profile, suitable for industrial applications requiring low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,873 parts In-Stock

1+ parts

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4,873

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Digiode

USA . 2,356 parts In-Stock

1+ parts

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2,356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 42 parts In-Stock

1+ parts

$9.975

100+ parts

-

1k+ parts

$10.538

10k+ parts

-

42

$9.975

-

$10.538

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ChromeModa Solutions

Germany . 6,108 parts In-Stock

1+ parts

$11.208

100+ parts

$9.191

1k+ parts

-

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6,108

$11.208

$9.191

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IDEA Electronic Components Group

UK . 1,708 parts In-Stock

1+ parts

$11.208

100+ parts

$10.648

1k+ parts

$10.087

10k+ parts

-

1,708

$11.208

$10.648

$10.087

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AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$18.641

100+ parts

-

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327

$18.641

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One Stop Electronics

USA . 1,145 parts In-Stock

1+ parts

$98.000

100+ parts

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1,145

$98.000

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A-Z Elektronik GmbH

Germany . 7,308 parts In-Stock

1+ parts

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7,308

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 1,510 parts In-Stock

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1,510

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DigiPath Technology Company

USA . 402 parts In-Stock

1+ parts

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100+ parts

$10.105

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402

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$10.105

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Kepictronics

USA . 243 parts In-Stock

1+ parts

-

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243

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Overview

Enhance your telecom projects with the TRF2432IRTQRG3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This versatile IC falls under the category of Other Function Telecom Interface ICs, making it perfect for a wide range of applications. From its durable package body material to its low power consumption and industrial temperature grade, this product offers unparalleled value, benefits, and advantages to customers looking for high-performance solutions. Elevate your designs with the TRF2432IRTQRG3 and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes.

Power Supplies (V): 3.3

Operates at a standard voltage level, making it compatible with a wide range of systems.

No. of Terminals: 56

A higher number of terminals allow for more connectivity options and functionality.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, suitable for industrial use.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance.

Width: 8 mm

The compact width of 8mm saves space and allows for more components on a PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures for a short duration during the assembly process.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards for reliable performance in harsh conditions.

Maximum Supply Current: 0.125 mA

Low supply current consumption for energy efficiency.

Technical Specifications

Other Function Telecom Interface ICs TRF2432IRTQRG3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.125 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

TRF2432IRTQRG3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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