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TRF2443IPFPR

Texas Instruments

TRF2443IPFPR by Texas Instruments

TRF2443IPFPR by Texas Instruments is a telecom IC with 80 terminals, operating at 3.3V. It has a temperature range of -40 to 85°C and features a flatpack package style. Ideal for telecom circuit applications due to its industrial-grade design and nickel palladium gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,349 parts In-Stock

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6,349

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Digiode

USA . 1,837 parts In-Stock

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1,837

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Distributors (Availability)

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AZTECH Wire

Italy . 811 parts In-Stock

1+ parts

$13.255

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811

$13.255

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Parana Technologies

USA . 1,792 parts In-Stock

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$14.145

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$14.604

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1,792

$14.145

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$14.604

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DigiPath Technology Company

USA . 762 parts In-Stock

1+ parts

$15.575

100+ parts

$14.329

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762

$15.575

$14.329

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ChromeModa Solutions

Germany . 4,950 parts In-Stock

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$15.893

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$13.032

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4,950

$15.893

$13.032

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

1+ parts

$15.893

100+ parts

$15.098

1k+ parts

$14.304

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1,437

$15.893

$15.098

$14.304

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One Stop Electronics

USA . 1,186 parts In-Stock

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$224.000

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1,186

$224.000

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Lixinc

USA . 19,140 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,589 parts In-Stock

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Corphita

USA . 4,292 parts In-Stock

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Overview

Unlock the power of seamless communication with the TRF2443IPFPR by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unmatched quality and reliability. Perfect for a wide range of applications, this product is designed to elevate your connectivity experience. With its cutting-edge technology and innovative design, customers can expect superior performance and efficiency. Trust Texas Instruments to deliver excellence with the TRF2443IPFPR. Elevate your communication game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling and operation.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB assembly, saving space and reducing overall system size.

Power Supplies (V): 3.3

Operates on a standard voltage of 3.3V, making it compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 85 °C

Can operate reliably in high temperature environments, ensuring stable performance even under stress.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Temperature Grade: INDUSTRIAL

Designed to meet industrial grade standards for reliability, durability, and performance in harsh operating conditions.

Technical Specifications

Other Function Telecom Interface ICs TRF2443IPFPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TRF2443IPFPR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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