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TRF2432IRTQT

Texas Instruments

TRF2432IRTQT by Texas Instruments

TRF2432IRTQT by Texas Instruments is a 56-terminal telecom IC with 3.3V supply voltage, suitable for industrial applications. It features a max operating temperature of 85°C and terminal finish in matte tin. This surface-mount chip carrier has a very thin profile and quad terminal position, making it ideal for telecom circuit designs.

Median Price

$9.500

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6,390 parts In-Stock

1+ parts

-

100+ parts

$9.500

1k+ parts

-

10k+ parts

-

6,390

-

$9.500

-

-

Rochester

USA . 6,250 parts In-Stock

1+ parts

-

100+ parts

$8.230

1k+ parts

$7.360

10k+ parts

$6.930

6,250

-

$8.230

$7.360

$6.930

Verical

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

$10.287

1k+ parts

$9.200

10k+ parts

$8.662

1,750

-

$10.287

$9.200

$8.662

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,871 parts In-Stock

1+ parts

$8.674

100+ parts

-

1k+ parts

-

10k+ parts

-

1,871

$8.674

-

-

-

Vyrian

USA . 3,094 parts In-Stock

1+ parts

$9.130

100+ parts

-

1k+ parts

-

10k+ parts

-

3,094

$9.130

-

-

-

DigiKey Marketplace

USA . 6,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,390

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Bristol Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Dan-Mar Components

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,733 parts In-Stock

1+ parts

$6.855

100+ parts

-

1k+ parts

$7.481

10k+ parts

-

1,733

$6.855

-

$7.481

-

DigiPath Technology Company

USA . 1,469 parts In-Stock

1+ parts

$7.548

100+ parts

$6.944

1k+ parts

-

10k+ parts

-

1,469

$7.548

$6.944

-

-

ChromeModa Solutions

Germany . 4,284 parts In-Stock

1+ parts

$7.702

100+ parts

$6.316

1k+ parts

-

10k+ parts

-

4,284

$7.702

$6.316

-

-

IDEA Electronic Components Group

UK . 1,900 parts In-Stock

1+ parts

$7.702

100+ parts

-

1k+ parts

$6.932

10k+ parts

-

1,900

$7.702

-

$6.932

-

Corphita

USA . 3,217 parts In-Stock

1+ parts

$8.217

100+ parts

-

1k+ parts

-

10k+ parts

-

3,217

$8.217

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Kepictronics

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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240

-

-

-

-

Overview

Experience the cutting-edge technology and superior quality of Texas Instruments with the TRF2432IRTQT. This telecom interface IC offers unmatched reliability and performance, making it ideal for a wide range of applications. From telecommunications to industrial automation, this product provides value by delivering high efficiency, precision, and durability. Trust Texas Instruments to enhance your projects with innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the IC, making it suitable for various high-performance applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides a compact form factor, making it ideal for applications where space is limited.

Power Supplies (V): 3.3

Operating at 3.3V makes this IC compatible with a wide range of systems and power sources.

No. of Terminals: 56

Having 56 terminals allows for versatile connectivity options and integration with other components in the circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold climates.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent conductivity and solderability, promoting a reliable connection.

Terminal Position: QUAD

Quad terminal position layout allows for efficient routing of signals within the circuit, optimizing performance.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm enables a slim and compact design, suitable for space-constrained applications.

Width: 8 mm

The 8mm width provides a balance between compactness and ease of handling during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can withstand the high temperatures encountered during the soldering process.

Length: 8 mm

The 8mm length complements the compact square package shape, maintaining a small overall footprint.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and promotes a more sustainable product design.

Maximum Supply Current: 0.125 mA

With a maximum supply current of 0.125mA, this IC is energy-efficient and suitable for battery-operated devices.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC offers optimized performance and reliability in telecommunications applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources, simplifying integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density packaging and efficient signal routing within the circuit.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this IC has moderate sensitivity to moisture, suitable for standard manufacturing and storage conditions.

Technical Specifications

Other Function Telecom Interface ICs TRF2432IRTQT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.125 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

TRF2432IRTQT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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