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HVQCCN Cellphone ICs 184

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
SI4710-B30-GM by Silicon Labs

SI4710-B30-GM

Silicon Labs

SI4710-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20 to 85°C, ideal for RF and baseband circuits. With CMOS technology and 3.3V supply voltage, it's perfect for compact telecom applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4711-B30-GMR by Silicon Labs

SI4711-B30-GMR

Silicon Labs

SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4711-B30-GM by Silicon Labs

SI4711-B30-GM

Silicon Labs

SI4711-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. It features RF and baseband circuit technology, suitable for cellphone applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4712-B30-GMR by Silicon Labs

SI4712-B30-GMR

Silicon Labs

SI4712-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, utilizing CMOS technology and requiring 3.3V supply voltage. This RF and baseband circuit is ideal for compact mobile devices due to its very thin profile and small dimensions of 3mm x 3mm.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4713-B30-GMR by Silicon Labs

SI4713-B30-GMR

Silicon Labs

SI4713-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this CMOS technology IC has a compact size of 3x3mm and terminal pitch of 0.5mm.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4713-B30-GM by Silicon Labs

SI4713-B30-GM

Silicon Labs

SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SKY73420-11 by Skyworks Solutions

SKY73420-11

Skyworks Solutions

SKY73420-11 by Skyworks Solutions is a 36-terminal cellphone IC with a square package shape and 0.9mm seated height. It features RF and baseband circuit for telecom applications, operates at 5V supply voltage, and has a terminal pitch of 0.5mm. Ideal for compact devices requiring high-performance RF capabilities.

S-XQCC-N36

6 mm

1

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.9 mm

5 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

CC2591RGVRG4 by Texas Instruments

CC2591RGVRG4

Texas Instruments

CC2591RGVRG4 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. This RF front end circuit has a max supply current of 4mA, making it ideal for industrial telecom applications.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC2591RGVTG4 by Texas Instruments

CC2591RGVTG4

Texas Instruments

RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

ADF4360-9BCPZRL by Analog Devices

ADF4360-9BCPZRL

Analog Devices

Analog Devices' ADF4360-9BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features a square package shape, matte tin finish, and industrial temperature grade. Ideal for baseband circuits in telecom applications due to its compact size (4x4mm) and low profile (1mm).

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-9BCPZ by Analog Devices

ADF4360-9BCPZ

Analog Devices

Analog Devices' ADF4360-9BCPZ is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuits, it features matte tin finish and very thin profile for industrial telecom applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

AD8366ACPZ-R7 by Analog Devices

AD8366ACPZ-R7

Analog Devices

AD8366ACPZ-R7 by Analog Devices is a Cellphone IC with 2 functions, operating at -40 to 85 °C. It features a square package style, 32 terminals, and matte tin finish. Ideal for telecom applications as a baseband circuit with a nominal voltage of 5V.

S-XQCC-N32

e3

5 mm

3

2

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

1 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

MAX2306EGI by Maxim Integrated

MAX2306EGI

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

240

3/3.3

Not Qualified

.9 mm

Other Telecom ICs

.0415 mA

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

20

5 mm

MAX2902EGI by Maxim Integrated

MAX2902EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7/4.5

Not Qualified

.9 mm

Other Telecom ICs

4.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2904EGI by Maxim Integrated

MAX2904EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7/4.5

Not Qualified

.9 mm

Other Telecom ICs

4.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2361EGM by Maxim Integrated

MAX2361EGM

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N48

e0

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

Not Qualified

1 mm

Other Telecom ICs

.09 mA

2.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

7 mm

MAX9982ETP by Maxim Integrated

MAX9982ETP

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX1958ETP by Maxim Integrated

MAX1958ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

3.6 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX1959ETP by Maxim Integrated

MAX1959ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

3.6 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX2046ETJ-T by Maxim Integrated

MAX2046ETJ-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

e0

5 mm

1

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2010ETI-T by Maxim Integrated

MAX2010ETI-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5

Not Qualified

.8 mm

Other Telecom ICs

.0121 mA

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

ADF4360-7BCPZRL by Analog Devices

ADF4360-7BCPZRL

Analog Devices

Analog Devices' ADF4360-7BCPZRL is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-8BCPZRL by Analog Devices

ADF4360-8BCPZRL

Analog Devices

Analog Devices' ADF4360-8BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85 °C.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

MAX5865ETM-T by Maxim Integrated

MAX5865ETM-T

Maxim Integrated

MAX5865ETM-T by Maxim Integrated is a 48-terminal cellphone IC with 2 channels. It operates b/w -40 to 85°C, offering an output voltage of up to 3V in OFFSET BINARY code. Ideal for RF and baseband circuits, this CMOS technology chip has a compact square package style suitable for telecom applications.

1.5 V

DIFFERENTIAL

S-XQCC-N48

e0

7 mm

2

1

48

85 Cel

-40 Cel

VOLTAGE

OFFSET BINARY

3 V

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8,3.3

Not Qualified

8

.8 mm

Codecs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

7 mm

AD8340ACPZ-WP by Analog Devices

AD8340ACPZ-WP

Analog Devices

AD8340ACPZ-WP by Analog Devices is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a supply voltage of 5V and max current draw of 0.15mA. This RF and baseband circuit technology is ideal for industrial telecom applications requiring very thin profile components.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.15 mA

5 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

ADF4360-0BCPZ by Analog Devices

ADF4360-0BCPZ

Analog Devices

Analog Devices' ADF4360-0BCPZ is a 24-terminal cellphone IC with 3.3V supply, operating from -40 to 85°C. It features BICMOS tech, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact square chip carrier package style.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-0BCPZRL by Analog Devices

ADF4360-0BCPZRL

Analog Devices

Analog Devices' ADF4360-0BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package style with a very thin profile for industrial use.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-1BCPZ by Analog Devices

ADF4360-1BCPZ

Analog Devices

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-2BCPZ by Analog Devices

ADF4360-2BCPZ

Analog Devices

Analog Devices' ADF4360-2BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-3BCPZ by Analog Devices

ADF4360-3BCPZ

Analog Devices

ADF4360-3BCPZ by Analog Devices is a cellphone IC with a square package shape and 24 terminals. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.3 V. This IC is commonly used in baseband circuit applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-3BCPZRL by Analog Devices

ADF4360-3BCPZRL

Analog Devices

Analog Devices ADF4360-3BCPZRL is a 24-terminal cellphone IC with 3.3V power supply, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in industrial telecom applications due to its compact square chip carrier package style.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-3BCPZRL7 by Analog Devices

ADF4360-3BCPZRL7

Analog Devices

Analog Devices' ADF4360-3BCPZRL7 is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, -40 to 85°C temperature range, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-4BCPZ by Analog Devices

ADF4360-4BCPZ

Analog Devices

Analog Devices' ADF4360-4BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial settings.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-4BCPZRL by Analog Devices

ADF4360-4BCPZRL

Analog Devices

Analog Devices' ADF4360-4BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85°C.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-5BCPZ by Analog Devices

ADF4360-5BCPZ

Analog Devices

Analog Devices' ADF4360-5BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, BICMOS technology, and -40 to 85 °C operating temperature range. It features a square package shape, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-6BCPZ by Analog Devices

ADF4360-6BCPZ

Analog Devices

Analog Devices' ADF4360-6BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85 °C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-6BCPZRL7 by Analog Devices

ADF4360-6BCPZRL7

Analog Devices

Analog Devices' ADF4360-6BCPZRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C, suitable for baseband circuits in industrial telecom applications due to its compact square package and low profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

CC1020RUZR by Texas Instruments

CC1020RUZR

Texas Instruments

The Texas Instruments CC1020RUZR is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

S-PQCC-N32

e4

7 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.27SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

7 mm

CC1020RUZ by Texas Instruments

CC1020RUZ

Texas Instruments

The Texas Instruments CC1020RUZ is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

S-PQCC-N32

e4

7 mm

3

1

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.27SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

7 mm

CC1101RTKG3 by Texas Instruments

CC1101RTKG3

Texas Instruments

CC1101RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8-3.6V. It features a square shape, nickel palladium gold finish, and industrial temperature grade suitable for RF and baseband circuits. This chip carrier has a very thin profile, measures 4x4mm in size, and can withstand peak reflow temperatures up to 260°C in surface mount applications.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

CC1101RTKRG3 by Texas Instruments

CC1101RTKRG3

Texas Instruments

CC1101RTKRG3 by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8/3.6V. This RF and baseband circuit is ideal for industrial telecom applications due to its compact size and surface-mount capability.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

CC2420-RTB1 by Texas Instruments

CC2420-RTB1

Texas Instruments

CC2420-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and CMOS technology. This chip carrier has a square shape, very thin profile, and nickel palladium gold finish for industrial-grade applications.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8,1.8/3.3

Not Qualified

.9 mm

Other Telecom ICs

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

CC2420-RTR1 by Texas Instruments

CC2420-RTR1

Texas Instruments

CC2420-RTR1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and CMOS technology. Ideal for telecom applications, this surface-mount chip carrier has a compact square package style with nickel palladium gold finish.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8,1.8/3.3

Not Qualified

.9 mm

Other Telecom ICs

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

ADF7025BCPZ by Analog Devices

ADF7025BCPZ

Analog Devices

Analog Devices' ADF7025BCPZ is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85 °C, with power supplies of 2.5/3.3V. Ideal for baseband circuits, it has a very thin profile and matte tin finish for industrial telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm

CC2420Z-RTB1 by Texas Instruments

CC2420Z-RTB1

Texas Instruments

CC2420Z-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating temperature range of -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuit for telecom applications, and CMOS technology. The package style includes chip carrier and heat sink/slug, making it suitable for industrial use in compact devices.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8,1.8/3.3

Not Qualified

.9 mm

Other Telecom ICs

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

ADF7021-VBCPZ-RL by Analog Devices

ADF7021-VBCPZ-RL

Analog Devices

Analog Devices' ADF7021-VBCPZ-RL is a cellphone IC with 48 terminals in a square chip carrier package. It operates at -40 to 85 °C, with a supply voltage of 3V. Ideal for RF and baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grades.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

ADF7021-VBCPZ by Analog Devices

ADF7021-VBCPZ

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

TRF3702IRHCG4 by Texas Instruments

TRF3702IRHCG4

Texas Instruments

TRF3702IRHCG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square chip carrier package suitable for surface mounting.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,32

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.17 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.8 mm

QUAD

30

4 mm