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SoC Other Function uPs,uCs & Peripheral ICs 174

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX6Y1DVK05AA by NXP Semiconductors

MCIMX6Y1DVK05AA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

SoC

MCIMX6Y1DVM05AA by NXP Semiconductors

MCIMX6Y1DVM05AA

NXP Semiconductors

MCIMX6Y1DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w 0-95°C, with supply voltage ranging from 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y2DVM05AA by NXP Semiconductors

MCIMX6Y2DVM05AA

NXP Semiconductors

MCIMX6Y2DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating b/w 0-95°C, it supports a supply voltage range of 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

EFR32MG1V132F256GM32-C0R by Silicon Labs

EFR32MG1V132F256GM32-C0R

Silicon Labs

EFR32MG1V132F256GM32-C0R by Silicon Labs is a 32-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.85 to 3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.

S-XQCC-N32

5 mm

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.85 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

5 mm

SoC

ATWILC1000B-MU-Y by Microchip Technology

ATWILC1000B-MU-Y

Microchip Technology

ATWILC1000B-MU-Y by Microchip Technology is a SoC peripheral IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85 °C and has a nominal voltage of 1.1 V. Ideal for applications requiring low-profile, surface-mount solutions with CMOS technology.

S-XQCC-N40

5 mm

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.1 V

YES

CMOS

MATTE TIN

NO LEAD

.4 mm

QUAD

5 mm

SoC

EFR32FG1P131F256GM48-C0R by Silicon Labs

EFR32FG1P131F256GM48-C0R

Silicon Labs

EFR32FG1P131F256GM48-C0R by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.85-3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.

S-XQCC-N48

7 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.85 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SoC

EFR32FG1P131F256GM48-C0 by Silicon Labs

EFR32FG1P131F256GM48-C0

Silicon Labs

SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N48;

S-XQCC-N48

7 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.85 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SoC

EFR32FG1V131F256GM48-C0 by Silicon Labs

EFR32FG1V131F256GM48-C0

Silicon Labs

EFR32FG1V131F256GM48-C0 by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.85-3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.

S-XQCC-N48

7 mm

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.85 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SoC

MCIMX6Y2CVM05AA by NXP Semiconductors

MCIMX6Y2CVM05AA

NXP Semiconductors

MCIMX6Y2CVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates in industrial temperature range (-40 to 105°C) and supports CMOS technology. With a supply voltage range of 1.275V to 1.5V, it is suitable for various applications requiring high-performance microcontrollers.

S-PBGA-B289

14 mm

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y2CVM08AA by NXP Semiconductors

MCIMX6Y2CVM08AA

NXP Semiconductors

MCIMX6Y2CVM08AA by NXP Semiconductors is an industrial-grade SoC with CMOS technology. It operates b/w -40 to 105 °C and has a max supply voltage of 1.5 V. With 289 terminals in a square package, it's ideal for applications requiring low-profile, fine-pitch grid arrays.

S-PBGA-B289

14 mm

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.325 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6DP4AVT8AB by NXP Semiconductors

MCIMX6DP4AVT8AB

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AB by NXP Semiconductors

MCIMX6DP6AVT8AB

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Y2CVK08AB by NXP Semiconductors

MCIMX6Y2CVK08AB

NXP Semiconductors

MCIMX6Y2CVK08AB by NXP Semiconductors is a 272-terminal SoC with CMOS technology, operating b/w -40 to 105 °C. It has a low profile, fine pitch grid array package and supports surface mount installation. Ideal for applications requiring uPs/uCs & Peripheral ICs in compact designs.

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.325 V

YES

CMOS

BALL

.5 mm

BOTTOM

40

9 mm

SoC

10AS066H2F34I1HG by Intel

10AS066H2F34I1HG

Intel

Intel 10AS066H2F34I1HG is a SoC with 1152 terminals in a grid array package. It operates b/w -40°C to 100°C, utilizing TSMC technology. Ideal for applications requiring high performance and compact design due to its small form factor of 35x35mm and ball terminal pitch of 1mm.

S-PBGA-B1152

35 mm

1152

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

GRID ARRAY

3.35 mm

YES

TSMC

BALL

1 mm

BOTTOM

35 mm

SoC

MCIMX6X4AVM08AC by NXP Semiconductors

MCIMX6X4AVM08AC

NXP Semiconductors

MCIMX6X4AVM08AC by NXP Semiconductors is a SoC with 529 terminals, operating b/w -40 to 125 °C. It has a low profile grid array package style and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B529

e1

19 mm

3

529

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.5 V

1.275 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

SoC

MCIMX6Y1DVK05AB by NXP Semiconductors

MCIMX6Y1DVK05AB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

BALL

.5 mm

BOTTOM

40

9 mm

SoC

MCIMX6Y1DVM05AB by NXP Semiconductors

MCIMX6Y1DVM05AB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B289

e1

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y2CVM05AAR by NXP Semiconductors

MCIMX6Y2CVM05AAR

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

e1

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6D4AVT08AE by NXP Semiconductors

MCIMX6D4AVT08AE

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Length: 21 mm;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D4AVT10AER by NXP Semiconductors

MCIMX6D4AVT10AER

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D4AVT10AE by NXP Semiconductors

MCIMX6D4AVT10AE

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D5EYM10AER by NXP Semiconductors

MCIMX6D5EYM10AER

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D6AVT08AER by NXP Semiconductors

MCIMX6D6AVT08AER

NXP Semiconductors

MCIMX6D6AVT08AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.35V to 1.5V, it features a fine pitch grid array package style ideal for surface mount assembly.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D6AVT08AE by NXP Semiconductors

MCIMX6D6AVT08AE

NXP Semiconductors

MCIMX6D6AVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. Operating b/w -40 to 125 °C, it has a supply voltage range of 1.35-1.5 V. Ideal for applications requiring fine-pitch grid arrays in plastic/epoxy packages.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D6AVT10AER by NXP Semiconductors

MCIMX6D6AVT10AER

NXP Semiconductors

MCIMX6D6AVT10AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.35V to 1.5V, making it ideal for automotive applications requiring high performance in compact spaces.

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6D6AVT10AE by NXP Semiconductors

MCIMX6D6AVT10AE

NXP Semiconductors

MCIMX6D6AVT10AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35-1.5 V. Ideal for applications requiring fine pitch grid array packages in surface mount technology.

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q4AVT10AER by NXP Semiconductors

MCIMX6Q4AVT10AER

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q4AVT10AE by NXP Semiconductors

MCIMX6Q4AVT10AE

NXP Semiconductors

MCIMX6Q4AVT10AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35V to 1.5V. Ideal for applications requiring fine pitch grid array package style and surface mount compatibility.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q6AVT10AER by NXP Semiconductors

MCIMX6Q6AVT10AER

NXP Semiconductors

MCIMX6Q6AVT10AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.35V to 1.5V and peak reflow temp of 260C, it's ideal for various uP/uC functions in surface-mount designs.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6Q6AVT10AE by NXP Semiconductors

MCIMX6Q6AVT10AE

NXP Semiconductors

MCIMX6Q6AVT10AE by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a grid array package. It operates b/w -40 to 125 °C and supports supply voltages from 1.35V to 1.5V. Ideal for applications requiring high-performance processing in compact electronic devices.

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6X1EVO10AC by NXP Semiconductors

MCIMX6X1EVO10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

MCIMX6X3EVN10AC by NXP Semiconductors

MCIMX6X3EVN10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

MCIMX6X3EVO10AC by NXP Semiconductors

MCIMX6X3EVO10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Length: 17 mm;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

MCIMX6X4EVM10AC by NXP Semiconductors

MCIMX6X4EVM10AC

NXP Semiconductors

MCIMX6X4EVM10AC by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 529 terminals. It operates b/w -20 to 105°C and has a supply voltage range of 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B529

e1

19 mm

3

529

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

SoC

MIMXRT1061CVL5A by NXP Semiconductors

MIMXRT1061CVL5A

NXP Semiconductors

The NXP Semiconductors MIMXRT1061CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with a supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SoC

LS1046AXE8Q1A by NXP Semiconductors

LS1046AXE8Q1A

NXP Semiconductors

LS1046AXE8Q1A by NXP Semiconductors is a 780-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high performance in a compact form factor.

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SoC

MIMXRT1064CVL5A by NXP Semiconductors

MIMXRT1064CVL5A

NXP Semiconductors

The NXP MIMXRT1064CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

10 mm

SoC

MIMX8MN6DVTJZAA by NXP Semiconductors

MIMX8MN6DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

EFR32FG13P232F512GM48-D by Silicon Labs

EFR32FG13P232F512GM48-D

Silicon Labs

SoC; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260;

e3

2

260

MATTE TIN

40

SoC

10AS057K2F40E1HG by Intel

10AS057K2F40E1HG

Intel

10AS057K2F40E1HG by Intel is a Square GRID ARRAY package with 1517 terminals, operating b/w 0-100°C. It features SoC technology from TSMC, with a terminal pitch of 1mm. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B1517

40 mm

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517,39X39,40

SQUARE

GRID ARRAY

3.5 mm

YES

TSMC

BALL

1 mm

BOTTOM

40 mm

SoC

MIMXRT106ACVL5B by NXP Semiconductors

MIMXRT106ACVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT106ACVL5B is a low-profile, fine-pitch SoC with 196 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. Ideal for applications requiring high-performance uPs and uCs in compact designs.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

10 mm

SoC

MIMXRT1062CVL5B by NXP Semiconductors

MIMXRT1062CVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT1062CVL5B is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.15-1.26V. Ideal for applications requiring high-performance microcontrollers in compact designs.

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SoC

MIMX8MM5DVTLZCA by NXP Semiconductors

MIMX8MM5DVTLZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

Tin/Silver (Sn/Ag)

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM5DVTLZDA by NXP Semiconductors

MIMX8MM5DVTLZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

Tin/Silver (Sn/Ag)

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MGM220PC22HNA2 by Silicon Labs

MGM220PC22HNA2

Silicon Labs

Silicon Labs' MGM220PC22HNA2 is a SoC with 31 terminals, operating at -40 to 105°C. It has a supply voltage range of 1.8-3.8V and compact dimensions of 12.9mm x 15mm, suitable for IoT applications requiring low power consumption and high reliability in surface-mount designs.

ALSO OPERATES WITH 2.2VMIN SUPPLY IN REGULATION MODE

R-XXMA-N31

15 mm

3

31

105 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.4 mm

3.8 V

1.8 V

3 V

YES

CMOS

NO LEAD

1.2 mm

UNSPECIFIED

12.9 mm

SoC

MIMXRT1064CVL5B by NXP Semiconductors

MIMXRT1064CVL5B

NXP Semiconductors

NXP Semiconductors' MIMXRT1064CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating from -40 to 105 °C, it supports a supply voltage range of 1.15-1.26 V for industrial applications requiring high performance and reliability.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

10 mm

SoC

MIMX8MQ6DVAJZIB by NXP Semiconductors

MIMX8MQ6DVAJZIB

NXP Semiconductors

SoC; JESD-609 Code: e2; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER;

e2

3

260

TIN SILVER

40

SoC

MIMXRT1175CVM8A by NXP Semiconductors

MIMXRT1175CVM8A

NXP Semiconductors

The NXP MIMXRT1175CVM8A is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.1-1.15 V. Its grid array package has 289 terminals and measures 14x14 mm, making it suitable for various embedded applications.

S-PBGA-B289

14 mm

3

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.15 V

1.1 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

14 mm

SoC