Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MIMXRT1171CVM8A
NXP Semiconductors
The NXP Semiconductors MIMXRT1171CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
S-PBGA-B289
14 mm
3
289
105 Cel
-40 Cel
PLASTIC/EPOXY
LFBGA
BGA289,17X17,32
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1.52 mm
1.15 V
1.1 V
YES
CMOS
BALL
.8 mm
BOTTOM
40
SoC
MIMXRT1172CVM8A
NXP Semiconductors' MIMXRT1172CVM8A is a low-profile, fine-pitch SoC with 289 terminals. Operating b/w -40 to 105°C, it supports a supply voltage range of 1.1-1.15V. Ideal for applications requiring high-performance uPs/uCs in compact form factors.
MIMXRT1173CVM8A
NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
MCIMX6Y2CVM05ABR
MCIMX6Y2CVM05ABR by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating at -40 to 105°C, it supports a voltage range of 1.275-1.5V and features tin silver copper terminal finish. Ideal for industrial applications requiring high-performance computing in compact spaces.
e1
1.32 mm
1.5 V
1.275 V
INDUSTRIAL
TIN SILVER COPPER
MCIMX534AVP8C2
MCIMX534AVP8C2 by NXP Semiconductors is a 529-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.05V to 1.15V, it features a fine pitch grid array package style for surface mount assembly.
S-PBGA-B529
19 mm
529
125 Cel
FBGA
BGA529,23X23,32
GRID ARRAY, FINE PITCH
AEC-Q100
1.85 mm
1.05 V
AUTOMOTIVE
MIMX8MN5DVPIZCA
SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 306; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B306
11 mm
306
95 Cel
0 Cel
TFBGA
BGA306,21X21,20
GRID ARRAY, THIN PROFILE, FINE PITCH
1.01 mm
1 V
.9 V
.95 V
OTHER
.5 mm
MIMX8MN3DVPIZAA
The NXP Semiconductors MIMX8MN3DVPIZAA is a SoC with CMOS technology, featuring 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and compact design in various electronic devices.
MIMX8MN1DVPIZAA
The NXP Semiconductors MIMX8MN1DVPIZAA is a SoC with 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and low power consumption in compact electronic devices.
MIMX8MN5DVPIZDA
NRF52832-QFAB-T
Nordic Semiconductor Asa
NRF52832-QFAB-T by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mountable ICs in compact designs.
S-XQCC-N48
6 mm
48
85 Cel
UNSPECIFIED
HVQCCN
LCC48,.24SQ,16
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.9 mm
3.6 V
1.7 V
3 V
NO LEAD
.4 mm
QUAD
S6J32HELTNSC2D000
Infineon Technologies
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP216,1.02SQ,16;
S-PQFP-G216
24 mm
216
HLFQFP
QFP216,1.02SQ,16
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
AEC-Q100; TS 16949
1.7 mm
1.3 V
1.2 V
GULL WING
S6J32JELSNSC20000
SoC; Terminal Form: GULL WING; No. of Terminals: 216; Package Code: HLFQFP; Package Shape: SQUARE; Width: 24 mm;
S6J32JEKSNSE20000
SoC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: HLFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH;
S-PQFP-G208
28 mm
208
QFP208,1.2SQ,20
MCIMX6S5DVM10ADR
MCIMX6S5DVM10ADR by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 1.35-1.5V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.
S-PBGA-B624
21 mm
624
BGA624,25X25,32
1.6 mm
1.35 V
MCIMX6U5DVM10ADR
MCIMX6U5DVM10ADR by NXP Semiconductors is a SoC with 624 terminals, operating at 0-95°C. It has a supply voltage range of 1.35-1.5V and uses CMOS technology. This IC is suitable for applications requiring low profile, fine pitch grid array packages in surface mount configurations.
1.4 V
DRA829VMTGBALFRQ1
Texas Instruments
DRA829VMTGBALFRQ1 by Texas Instruments is a SoC with 827 terminals in a grid array package. It operates b/w -40 to 125 °C with supply voltage range of 0.76V to 0.84V. This IC is designed for automotive applications meeting AEC-Q100 standards.
S-PBGA-B827
827
BGA827,29X29,32
250
2.8 mm
2000 rpm
.84 V
.76 V
.8 V
EFR32MG24A410F1536IM40-B
Silicon Labs
SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Length: 5 mm;
S-XQCC-N40
5 mm
LCC40,.2SQ,16
3.8 V
1.71 V
EFR32MG24A010F1024IM48-BR
SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .4 mm;
EFR32MG24A420F1536IM48-B
EFR32MG24A420F1536IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
EFR32MG24B010F1024IM48-B
EFR32MG24B010F1024IM48-B by Silicon Labs is a SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71-3.8 V. Ideal for applications requiring low-profile, surface-mount chips in Other Function uPs,uCs & Peripheral ICs category.
EFR32MG24B010F1536IM48-B
EFR32MG24B010F1536IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
EFR32MG24B020F1024IM48-B
EFR32MG24B020F1024IM48-B by Silicon Labs is a SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. With 48 terminals in a square package, it's ideal for IoT and wireless applications.
EFR32MG24A021F1024IM40-BR
SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
EFR32MG24B020F1536IM40-B
EFR32MG24B020F1536IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring compact design and high performance in IoT devices.
EFR32MG24A010F1024IM48-B
EFR32MG24A010F1024IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
LS1023AXE7QQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Width: 21 mm;
S-PBGA-B621
621
BGA621,25X25,32
2.07 mm
1.03 V
.97 V
30
CY8C6244AZI-S4D82
Infineon's CY8C6244AZI-S4D82 is a 64-terminal SoC with CMOS technology. Operating b/w -40 to 85 °C, it supports supply voltage range of 1.7-3.6 V. Ideal for applications requiring low profile and fine pitch package styles in surface mount configurations.
S-PQFP-G64
10 mm
64
HQFP64,.47SQ,20
1.8 V
CY8C6244LQQ-S4D92
SoC; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .4 mm;
S-XQCC-N68
8 mm
68
LCC68,.32SQ,16
1 mm
CY8C6244LQI-S4D62
SoC; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 3.6 V;
CY8C6244AZI-S4D83
SoC; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
S-PQFP-G80
12 mm
80
LFQFP
QFP80,.55SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
CY8C6244AZQ-S4D93
SoC; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 3.6 V;
CY8C6244AZI-S4D12
SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH;
CY8C6244AZI-S4D62
CY8C6244AZI-S4D62 by Infineon: 64-terminal SoC with CMOS tech, 1.7-3.6V supply, -40 to 85°C temp range. Ideal for applications requiring low-profile, fine-pitch ICs in plastic/epoxy packages.
CY8C6244LQI-S4D82
SoC; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
CY8C6244AZQ-S4D92
SoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
CY8C6244LQI-S4D12
SoC; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
EFR32BG24B210F1024IM48-BR
EFR32BG24B210F1024IM48-BR by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
EFR32BG24A010F1024IM40-BR
EFR32BG24A010F1024IM40-BR by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount ICs in various electronic devices.
EFR32BG24A010F1024IM48-BR
EFR32BG24A010F1024IM48-BR by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125°C, with supply voltage range of 1.71-3.8V. Ideal for applications requiring compact design and low power consumption.
EFR32BG24A020F1024IM40-BR
EFR32BG24A020F1024IM40-BR by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
EFR32BG24A020F1024IM48-BR
EFR32BG24A020F1024IM48-BR by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71-3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
EFR32BG24B220F1024IM48-BR
EFR32BG24B220F1024IM48-BR by Silicon Labs is a SoC with 48 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 1.71V to 3.8V and comes in a square chip carrier package style. Ideal for IoT devices, wearables, and smart home applications due to its compact size and low power consumption.
MIMX8DL1AVNFZBA
SoC; Terminal Form: BALL; No. of Terminals: 388; Package Shape: SQUARE; Terminal Position: BOTTOM; Peak Reflow Temperature (C): 260;
S-PBGA-B388
15 mm
388
MPFS250T-1FCVG484E
Microchip Technology
The Microchip Technology MPFS250T-1FCVG484E is a SoC peripheral IC with CMOS technology. It operates b/w 0°C to 100°C, with a supply voltage range of 0.97V to 1.03V. This grid array IC, measuring 19mm x 19mm, is ideal for applications requiring fine pitch and surface mount capabilities.
ALSO OPERATES AT 1.05V NOMINAL SUPPLY
S-PBGA-B484
484
100 Cel
BGA484,22X22,32
2.92 mm
MPFS250TFCVG484E
MPFS250TFCVG484E by Microchip Tech features 484 terminals, operates b/w 0-100°C, and has a supply voltage range of 0.97-1.03V. This SoC peripheral IC in a grid array package is ideal for applications requiring fine pitch technology and CMOS design.
MPFS250TFCVG484I
Microchip Technology's MPFS250TFCVG484I is a 484-terminal SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. The grid array package is square-shaped, measuring 19mm x 19mm, suitable for various uPs and uCs applications.
MPFS250TS-1FCVG484I
MPFS250TS-1FCVG484I by Microchip: 484-terminal SoC IC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97V to 1.03V. Ideal for applications requiring fine pitch grid array package style in plastic/epoxy material.
AM6254ATCGHAALW
AM6254ATCGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-density integration in a compact form factor.
S-PBGA-B425
13 mm
425
VFBGA
BGA425,25X25,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.89 mm
.79 V
.715 V
.75 V
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