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CY8C6244AZI-S4D82

Infineon Technologies

CY8C6244AZI-S4D82 by Infineon Technologies

Infineon's CY8C6244AZI-S4D82 is a 64-terminal SoC with CMOS technology. Operating b/w -40 to 85 °C, it supports supply voltage range of 1.7-3.6 V. Ideal for applications requiring low profile and fine pitch package styles in surface mount configurations.

Median Price

$4.264

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 320 parts In-Stock

1+ parts

-

100+ parts

$3.790

1k+ parts

$3.390

10k+ parts

$3.190

320

-

$3.790

$3.390

$3.190

Verical

USA . 320 parts In-Stock

1+ parts

-

100+ parts

$4.737

1k+ parts

$4.237

10k+ parts

$3.987

320

-

$4.737

$4.237

$3.987

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 558 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

558

$4.000

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$6.308

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$6.308

-

-

-

Vyrian

USA . 8,813 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,813

-

-

-

-

Flip Electronics

USA . 6,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,080

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 320 parts In-Stock

1+ parts

$3.580

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$3.580

-

-

-

Corphita

USA . 922 parts In-Stock

1+ parts

$3.789

100+ parts

-

1k+ parts

-

10k+ parts

-

922

$3.789

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.308

100+ parts

-

1k+ parts

$5.993

10k+ parts

$5.866

1,000

$6.308

-

$5.993

$5.866

Continental Prestige Electronics

USA . 890 parts In-Stock

1+ parts

$6.308

100+ parts

-

1k+ parts

-

10k+ parts

$6.182

890

$6.308

-

-

$6.182

AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$17.335

100+ parts

-

1k+ parts

-

10k+ parts

-

312

$17.335

-

-

-

Aztec Data Supply Inc.

USA . 13,477 parts In-Stock

1+ parts

$32.687

100+ parts

-

1k+ parts

-

10k+ parts

-

13,477

$32.687

-

-

-

Modulus Dynamics

Lithuania . 4,782 parts In-Stock

1+ parts

$65.078

100+ parts

$62.475

1k+ parts

$59.872

10k+ parts

-

4,782

$65.078

$62.475

$59.872

-

Corohmni

South Africa . 75 parts In-Stock

1+ parts

$76.462

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$76.462

-

-

-

Argo Parts USA

USA . 4,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,249

-

-

-

-

Overview

Experience unmatched quality and innovation with the CY8C6244AZI-S4D82 by Infineon Technologies. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, delivering superior performance and reliability. With a wide range of applications, this product is designed to meet all your needs with its advanced features and functionalities. Elevate your projects with the value and benefits that this product offers, providing you with a seamless experience like never before. Choose excellence, choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and cost-effective, making this product suitable for small and portable electronic devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, improving overall production efficiency.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power input, increasing its versatility in different applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB real estate and facilitates easier PCB layout design.

Minimum Operating Temperature: -40 °C

The product can operate in extremely low temperatures, making it suitable for use in various environments and applications.

Peripheral IC Type: SoC

Being a System-on-Chip (SoC), this product integrates multiple functions into a single chip, reducing the need for external components and saving space on the PCB.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8C6244AZI-S4D82 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

SoC

Trade Compliance

CY8C6244AZI-S4D82 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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