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MCIMX6U5DVM10ADR

NXP Semiconductors

MCIMX6U5DVM10ADR by NXP Semiconductors

MCIMX6U5DVM10ADR by NXP Semiconductors is a SoC with 624 terminals, operating at 0-95°C. It has a supply voltage range of 1.35-1.5V and uses CMOS technology. This IC is suitable for applications requiring low profile, fine pitch grid array packages in surface mount configurations.

Median Price

$36.806

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

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Verical

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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Vyrian

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Anansix

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Ampacity Inc.

Singapore . 221 parts In-Stock

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Continental Prestige Electronics

USA . 360 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$31.782

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$31.112

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Microchip USA

USA . 2,705 parts In-Stock

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$81.660

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Corphita

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Overview

Discover the groundbreaking MCIMX6U5DVM10ADR by NXP Semiconductors, a game-changer in the world of Other Function uPs,uCs & Peripheral ICs. With unparalleled quality and cutting-edge technology, NXP Semiconductors has crafted a product that exceeds all expectations. This versatile device opens up a world of possibilities in various applications, providing customers with unmatched value and benefits. Say hello to the future of electronic components with the MCIMX6U5DVM10ADR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

This feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.5 V

With a high maximum supply voltage, this IC can handle power fluctuations without being damaged, ensuring reliability.

Package Shape: SQUARE

Square shape helps in efficient space utilization on the circuit board, especially in compact electronic devices.

No. of Terminals: 624

Having a high number of terminals allows for more connections and functionalities, making it versatile for different applications.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without any performance issues, providing flexibility in usage scenarios.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the IC energy efficient and fast.

Terminal Form: BALL

Ball terminals provide reliable connections and easy soldering during installation, ensuring a secure electrical connection.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6U5DVM10ADR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6U5DVM10ADR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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