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MCIMX6S5DVM10ADR

NXP Semiconductors

MCIMX6S5DVM10ADR by NXP Semiconductors

MCIMX6S5DVM10ADR by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 1.35-1.5V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.

Median Price

$34.765

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 500 parts In-Stock

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$34.765

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500

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$34.765

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$26.762

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300

$26.762

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Vyrian

USA . 5,318 parts In-Stock

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Anansix

USA . 1,639 parts In-Stock

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TME

Poland . 500 parts In-Stock

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$40.660

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500

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$40.660

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Digiode

USA . 141 parts In-Stock

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141

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Distributors (Availability)

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AZTECH Wire

Italy . 529 parts In-Stock

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$19.770

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529

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Ampacity Inc.

Singapore . 276 parts In-Stock

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$24.650

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276

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Netroflash

USA . 2,000 parts In-Stock

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$26.762

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$25.423

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$24.888

2,000

$26.762

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$25.423

$24.888

Microchip USA

USA . 2,000 parts In-Stock

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$69.246

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$69.246

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UNI Independent Distributors

Spain . 5,150 parts In-Stock

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Corphita

USA . 1,704 parts In-Stock

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Glotronic Ltd.

UK . 400 parts In-Stock

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Overview

Unleash the power of innovation with the MCIMX6S5DVM10ADR by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers cutting-edge solutions for various applications in the Other Function uPs,uCs & Peripheral ICs category. This product offers unmatched value and benefits, providing customers with superior performance and reliability. Whether you're looking to enhance your designs or streamline your processes, the MCIMX6S5DVM10ADR is the perfect choice for your next project. Elevate your creations with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 1.5 V

Suitable for low power applications, making it energy efficient.

Package Shape: SQUARE

Helps in optimizing space on the circuit board, ensuring efficient utilization of available area.

No. of Terminals: 624

Provides flexibility for connecting to various components and peripherals, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables high density integration and efficient signal routing, resulting in enhanced performance.

Minimum Supply Voltage: 1.35 V

Allows for operation in low voltage conditions, expanding the range of compatible power sources.

Maximum Operating Temperature: 95 °C

Ensures stable performance even in high temperature environments, making it suitable for various applications.

Minimum Operating Temperature: 0 °C

Can operate in cold temperature conditions, ensuring reliability in different operating environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Facilitates easy placement and soldering during assembly, improving the overall manufacturing process.

Maximum Seated Height: 1.6 mm

Low profile design helps in optimizing space and reducing overall height of the product.

Width: 21 mm

Compact size enables easy integration into various electronic devices, saving space.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering and bonding during assembly, enhancing product reliability.

Peak Reflow Temperature °C: 260

Suitable for reflow soldering process, ensuring secure connections and reliability.

Length: 21 mm

Compact size facilitates easy integration and space-saving in electronic devices.

Peripheral IC Type: SoC

Integration of multiple functions into a single IC, reducing the need for external components and simplifying design.

Technology: CMOS

Low power consumption and high noise immunity, making it energy efficient and reliable.

Terminal Form: BALL

Allows for easy soldering and secure connections, improving overall product reliability.

Terminal Pitch: 0.8 mm

Fine pitch design enables high density integration and efficient signal routing, enhancing overall performance.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, ensuring long-term reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S5DVM10ADR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6S5DVM10ADR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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