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MIMX8MN3DVPIZAA

NXP Semiconductors

MIMX8MN3DVPIZAA by NXP Semiconductors

The NXP Semiconductors MIMX8MN3DVPIZAA is a SoC with CMOS technology, featuring 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and compact design in various electronic devices.

Median Price

$17.175

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 168 parts In-Stock

1+ parts

$14.800

100+ parts

$10.710

1k+ parts

-

10k+ parts

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168

$14.800

$10.710

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-

Mouser Electronics

USA . 336 parts In-Stock

1+ parts

$19.550

100+ parts

$13.170

1k+ parts

$12.640

10k+ parts

-

336

$19.550

$13.170

$12.640

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DigiKey

USA . 169 parts In-Stock

1+ parts

$19.550

100+ parts

$14.574

1k+ parts

$12.641

10k+ parts

-

169

$19.550

$14.574

$12.641

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Element14

Singapore . 168 parts In-Stock

1+ parts

$26.120

100+ parts

$19.890

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-

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168

$26.120

$19.890

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Verical

USA . 2,352 parts In-Stock

1+ parts

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$11.339

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2,352

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$11.339

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Future Electronics

Canada . 168 parts In-Stock

1+ parts

-

100+ parts

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$10.900

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168

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$10.900

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$15.470

100+ parts

-

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55

$15.470

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Digiode

USA . 2,985 parts In-Stock

1+ parts

$21.945

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2,985

$21.945

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Vyrian

USA . 6,624 parts In-Stock

1+ parts

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6,624

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TME

Poland . 2,352 parts In-Stock

1+ parts

-

100+ parts

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$11.390

10k+ parts

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2,352

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-

$11.390

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Anansix

USA . 1,815 parts In-Stock

1+ parts

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1,815

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NAC Semi

USA . 336 parts In-Stock

1+ parts

-

100+ parts

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$17.890

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336

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$17.890

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IBS Electronics

USA . 168 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$15.287

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168

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-

$15.287

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 741 parts In-Stock

1+ parts

$11.915

100+ parts

-

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741

$11.915

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Continental Prestige Electronics

USA . 6,842 parts In-Stock

1+ parts

$15.470

100+ parts

-

1k+ parts

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10k+ parts

$15.160

6,842

$15.470

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-

$15.160

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$15.470

100+ parts

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1,000

$15.470

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Ampacity Inc.

Singapore . 90 parts In-Stock

1+ parts

$19.640

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90

$19.640

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Corohmni

South Africa . 1,054 parts In-Stock

1+ parts

$20.016

100+ parts

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1,054

$20.016

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Corphita

USA . 4,197 parts In-Stock

1+ parts

$20.790

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4,197

$20.790

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Microchip USA

USA . 1,935 parts In-Stock

1+ parts

$49.379

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1,935

$49.379

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Argo Parts USA

USA . 2,750 parts In-Stock

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2,750

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UNI Independent Distributors

Spain . 571 parts In-Stock

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571

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Overview

Discover the cutting-edge MIMX8MN3DVPIZAA by NXP Semiconductors, a top-tier manufacturer known for superior quality and reliability. This innovative product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering endless possibilities for applications. With a package body material of PLASTIC/EPOXY and a sleek square shape, this device boasts 306 terminals for seamless connectivity. From its wide operating temperature range to its low supply voltage requirements, the MIMX8MN3DVPIZAA delivers unparalleled value and performance. Experience the next level of technology with this remarkable SoC peripheral IC – unleash your creativity and drive efficiency with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the chip inside, ensuring a longer lifespan of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic devices, making this product easier to integrate into systems.

Maximum Supply Voltage: 1 V

Operates within a safe voltage range, reducing the risk of damage to the product or connected components.

Package Shape: SQUARE

Square shape allows for more efficient use of space on the circuit board, making it ideal for compact designs.

No. of Terminals: 306

High number of terminals allows for a greater level of connectivity and functionality in the device.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments, making it suitable for a wide range of applications and settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Nominal Supply Voltage: 0.95 V

Operates at a voltage level that provides a good balance between performance and power efficiency.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MN3DVPIZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B306

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

306

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA306,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.01 mm

Maximum Supply Voltage:

1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MN3DVPIZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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