Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.
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MTFDDAK240MBD-2AK12ITYY
Micron Technology
Micron Technology's MTFDDAK240MBD-2AK12ITYY is a 240GX8 MLC NAND flash module with 2061584302080 bit memory density. Operating at 5V, it has an industrial temperature grade and serial interface. Ideal for applications requiring high-speed data storage in compact microelectronic assemblies.
R-XSMA-N22
100.45 mm
2061584302080 bit
FLASH MODULE
8
1
22
257698037760 words
240G
ASYNCHRONOUS
85 Cel
-40 Cel
240GX8
UNSPECIFIED
RECTANGULAR
MICROELECTRONIC ASSEMBLY
SERIAL
5
7.2 mm
5.5 V
4.5 V
NO
CMOS
INDUSTRIAL
NO LEAD
SINGLE
MLC NAND TYPE
69.85 mm
MTFDDAK256MBD-1AK12ITYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Type: MLC NAND TYPE; Technology: CMOS;
2199023255552 bit
274877906944 words
256G
256GX8
MT28FW02GBBA1LPC-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Length: 13 mm;
105 ns
R-PBGA-B64
13 mm
2147483648 bit
FLASH
16
64
134217728 words
128M
105 Cel
128MX16
PLASTIC/EPOXY
LBGA
GRID ARRAY, LOW PROFILE
PARALLEL
NOT SPECIFIED
3
AEC-Q100
1.4 mm
3.6 V
2.7 V
YES
BALL
1 mm
BOTTOM
11 mm
MT29F2G08ABBEAH4:ETR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
R-PBGA-B63
e1
63
268435456 words
256M
70 Cel
0 Cel
256MX8
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.8
1.95 V
1.7 V
COMMERCIAL
TIN SILVER COPPER
.8 mm
SLC NAND TYPE
9 mm
MT29F2G16ABDHC:DTR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
1.65 V
10.5 mm
MTFDDAK032SBD-1AH12ITYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Memory Width: 8;
LENGTH_MAX
R-XSMA-X22
274877906944 bit
34359738368 words
32G
32GX8
MTFDDAT064SBD-1AK12ITYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: DIMM; Package Shape: RECTANGULAR; Length: 50.8 mm;
R-XDMA-N52
50.8 mm
549755813888 bit
52
68719476736 words
64G
64GX8
DIMM
3.3
2.4 mm
3.46 V
3.14 V
DUAL
29.85 mm
IS25LQ040B-JKLE-TR
Integrated Silicon Solution
IS25LQ040B-JKLE-TR by Integrated Silicon Solution is a 4Mbit Flash Memory with synchronous operation at up to 104MHz. It features a small outline package, operates in industrial temperature range (-40°C to 105°C), and has a supply voltage of 2.3V to 3.6V. Ideal for applications requiring high-speed data storage in compact electronic devices.
104 MHz
R-PDSO-N8
6 mm
4194304 bit
4194304 words
4M
SYNCHRONOUS
4MX1
HVSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
2.3 V
1.27 mm
5 mm
MT29F1G08ABADAWP-IT:DTR
Micron Technology's MT29F1G08ABADAWP-IT:DTR is a 128MX8 SLC NAND flash memory with 1073741824-bit density. Operating at 3.3V, it has an industrial temperature grade and supports parallel mode. With a compact form factor of 18.4mm x 12mm x 1.2mm, it is ideal for high-performance embedded applications requiring reliable non-volatile storage.
R-PDSO-G48
e3
18.4 mm
1073741824 bit
48
128MX8
TSOP1
SMALL OUTLINE, THIN PROFILE
260
1.2 mm
Tin (Sn)
GULL WING
.5 mm
30
12 mm
MT29F1G08ABADAWP-ITX:DTR
Micron Technology's MT29F1G08ABADAWP-ITX:DTR is a 128MX8 SLC NAND flash memory with 1073741824 bit density. Operating at 3.3V, it has an industrial temperature grade and supports asynchronous mode. This rectangular package with 48 terminals is suitable for various applications requiring high-speed parallel memory access.
MATTE TIN
MT29F2G08AADWP:DTR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Type: SLC NAND TYPE;
MT29F2G16ABDHC-ET:DTR
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.65 V;
MT29F4G01AAADDHC-ITX:DTR
Micron Technology's MT29F4G01AAADDHC-ITX:DTR is a 3.3V SLC NAND Flash Memory with 4294967296-bit density, operating at up to 50MHz clock frequency. Ideal for industrial applications, it features a very thin profile grid array package and operates in synchronous mode.
50 MHz
4294967296 bit
4294967296 words
4G
4GX1
M25P40-VMN6TPBATR
Micron Technology's M25P40-VMN6TPBATR is a NOR type Flash Memory with 512Kx8 organization, operating at 50 MHz clock frequency. It has a supply voltage range of 2.3V to 3.6V and is suitable for industrial temperature grade applications. The memory density is 4Mb, making it ideal for high-performance serial data storage solutions.
R-PDSO-G8
4.9 mm
524288 words
512K
512KX8
SOP
SMALL OUTLINE
1.75 mm
2.7
NOR TYPE
3.9 mm
MT29F16G08ABACAWP-ITZ:CTR
Micron Technology's MT29F16G08ABACAWP-ITZ:CTR is a 3.3V SLC NAND Flash Memory with 2GX8 organization, operating from -40 to 85 °C. It features a small outline package, parallel interface, and industrial temperature grade suitable for embedded systems and data storage applications.
17179869184 bit
2147483648 words
2G
2GX8
MT29F1G01AAADDH4-IT:DTR
Micron Technology's MT29F1G01AAADDH4-IT:DTR is a 3.3V SLC NAND Flash Memory with 1073741824-bit memory density. Operating at up to 50MHz, it features a very thin profile grid array package and is suitable for industrial applications requiring high-speed synchronous operation.
1073741824 words
1G
1GX1
MT29F1G08ABADAH4:DTR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
MT29F2G08ABAEAWP-ITX:ETR
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Technology: CMOS;
N25Q128A23BSF40E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 108 MHz;
108 MHz
R-PDSO-G16
10.3 mm
134217728 bit
16777216 words
16M
16MX8
2.65 mm
7.5 mm
MT29F2G08ABAEAH4-ITX:ETR
Micron Technology's MT29F2G08ABAEAH4-ITX:ETR is a 256MX8 SLC NAND flash memory with 2147483648-bit density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Suitable for applications requiring high-speed parallel memory access in compact devices.
MTFC16GAKAECN-4MIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
R-PBGA-B153
137438953472 bit
FLASH CARD
153
17179869184 words
16G
16GX8
11.5 mm
MTFC16GAKAENA-4MIT
Micron Technology's MTFC16GAKAENA-4MIT is a 16GX8 flash memory with 17179869184 words capacity. Operating in synchronous mode, it has a temperature range of -40 to 85 °C and supports parallel programming. With a compact rectangular shape and thin profile, it is ideal for industrial applications requiring high memory density and fast data access.
R-PBGA-B100
18 mm
100
TBGA
GRID ARRAY, THIN PROFILE
Tin/Silver/Copper (Sn/Ag/Cu)
14 mm
MTFC32GAKAENA-4MIT
Micron Technology's MTFC32GAKAENA-4MIT is a 32GX8 flash memory with 274877906944 bit density. Operating in synchronous mode, it has a temperature range of -40 to 85 °C and supports parallel programming. With a compact rectangular shape and thin profile, this flash card is ideal for industrial applications requiring high-speed data storage.
MTFC64GAKAEEY-4MIT
MTFC64GAKAEEY-4MIT by Micron Technology is a 64GX8 MLC NAND flash memory with 549755813888 bit density. Operating in industrial temperature range (-40 to 85 °C), it features synchronous operation, thin profile grid array package, and 153 terminals for parallel communication. Ideal for high-density storage applications requiring fast data access and reliability.
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
IS21ES04G-JCLI
IS21ES04G-JCLI by Integrated Silicon Solution is a 4GX8 Flash Memory with 3.3V programming voltage and 85°C max operating temp. Ideal for industrial applications, it features a very thin profile grid array package with 153 terminals and operates in synchronous mode.
34359738368 bit
4GX8
10
IS21ES04G-JQLI
IS21ES04G-JQLI by Integrated Silicon Solution is a 4GX8 flash memory with 34359738368 bit density. Operating at 3.3V, it offers synchronous mode and industrial temperature grade suitability. With a package size of 18mm x 14mm, this low-profile grid array memory chip is ideal for high-performance applications requiring parallel data processing.
IS21ES08G-JCLI
IS21ES08G-JCLI by Integrated Silicon Solution is a 3.3V synchronous flash memory with 8GX8 organization, operating at up to 200MHz clock frequency. Ideal for industrial applications, this MLC NAND type memory offers a memory density of 68719476736 bits and features a very thin profile grid array package with fine pitch terminals.
200 MHz
68719476736 bit
8589934592 words
8G
8GX8
3-STATE
BGA153,14X14,20
IS21ES16G-JCLI
IS21ES16G-JCLI by Integrated Silicon Solution is a 16GX8 Flash Memory with synchronous operation and a max clock frequency of 200 MHz. It has a memory density of 137438953472 bit and is suitable for industrial applications.
IS21ES32G-JCLI
IS21ES32G-JCLI by Integrated Silicon Solution is a 32GX8 MLC NAND flash memory with 3-STATE output, operating at up to 200 MHz. It features a very thin profile grid array package suitable for industrial applications requiring high memory density and a wide operating temperature range from -40°C to 85°C.
IS22ES04G-JCLA1
IS22ES04G-JCLA1 by Integrated Silicon Solution is a 4GX8 flash memory with 3.3V programming voltage and operates synchronously at -40 to 85°C. With a package style of GRID ARRAY, it's ideal for industrial applications requiring high memory density and reliability in harsh environments.
N25Q032A13EF4A0FTR
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 108 MHz;
4 mm
33554432 bit
33554432 words
32M
125 Cel
32MX1
.6 mm
AUTOMOTIVE
3 mm
MT25QL256ABA8E12-1SAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Width: 8;
133 MHz
R-PBGA-B24
8 mm
268435456 bit
24
32MX8
MT25QL256ABA8E14-1SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MT25QL256ABA8ESF-MSIT
Micron Technology's MT25QL256ABA8ESF-MSIT is a 32MX8 flash memory IC with 268Mbit density. It operates at 133MHz clock frequency, suitable for industrial applications. With synchronous operation and serial interface, it offers fast data transfer in a small outline package.
MTFDHAL1T2MCF-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Operating Mode: SYNCHRONOUS; Organization: 1200GX8; No. of Words Code: 1.2T; Terminal Form: UNSPECIFIED;
SOLID STATE DRIVE
R-XXMA-X
1.2T
55 Cel
1200GX8
3.564 V
3.036 V
NAND TYPE
MTFDHAL1T6MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 55 Cel; Organization: 1600GX8; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Nominal Supply Voltage / Vsup (V): 3.3;
1.6T
1600GX8
MTFDHAL2T4MCF-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Style (Meter): MICROELECTRONIC ASSEMBLY; No. of Functions: 1; Maximum Operating Temperature: 55 Cel; Additional Features: SOLID STATE DRIVE;
2.4T
2400GX8
MTFDHAL3T2MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Nominal Supply Voltage / Vsup (V): 3.3; Additional Features: SOLID STATE DRIVE; Minimum Supply Voltage (Vsup): 3.036 V; Minimum Operating Temperature: 0 Cel;
3.2T
3200GX8
MTFDHAL800MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Additional Features: SOLID STATE DRIVE; Type: NAND TYPE; No. of Functions: 1; Maximum Operating Temperature: 55 Cel;
800G
800GX8
MTFDHAX1T2MCF-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Additional Features: SOLID STATE DRIVE; Memory Width: 8; Maximum Supply Voltage (Vsup): 3.564 V; Minimum Operating Temperature: 0 Cel;
MTFDHAX1T6MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 55 Cel; Minimum Supply Voltage (Vsup): 3.036 V; Organization: 1600GX8;
MTFDHAX2T4MCF-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; JESD-30 Code: R-XXMA-X; No. of Functions: 1; Memory Width: 8; Nominal Supply Voltage / Vsup (V): 3.3;
MTFDHAX3T2MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Operating Mode: SYNCHRONOUS; Type: NAND TYPE; No. of Functions: 1; Terminal Position: UNSPECIFIED;
MTFDHAX800MCE-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED; Technology: CMOS; Minimum Supply Voltage (Vsup): 3.036 V;
MT29F1G16ABBEAHC:E
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
67108864 words
64M
64MX16
IS34ML01G084-TLI
IS34ML01G084-TLI by Integrated Silicon Solution is a 128MX8 SLC NAND flash memory with 134217728 words. Operating at 3.3V, it has a temperature range of -40 to 85 °C and uses parallel interface technology. Ideal for industrial applications requiring high-density memory in a small outline package.
TIN
SFSD4096N2BM1TO-E-GE-2A1-STD
Swissbit Ag
SFSD4096N2BM1TO-E-GE-2A1-STD by Swissbit Ag is a 4GX8 MLC NAND flash memory with a memory density of 34.3Gb. It operates at a max clock frequency of 100MHz and has a min operating temperature of -25°C, making it suitable for various applications requiring high-speed data storage in harsh environments.
100 MHz
R-XUUC-N8
15 mm
-25 Cel
DIE
UNCASED CHIP
1.1 mm
OTHER
UPPER
SFSD4096N3BM1TO-I-GE-2B1-STD
Swissbit Ag's SFSD4096N3BM1TO-I-GE-2B1-STD is a 4GX8 MLC NAND flash memory chip with 4294967296 words capacity. Operating at 100 MHz, it has a voltage range of 2.7V to 3.6V and temperature tolerance from -40°C to 85°C. Ideal for industrial applications requiring high-density, serial memory solutions in compact form factors.
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