Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.
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MT25QU01GBBB8E12-0AUTTR
Micron Technology
FLASH; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Programming Voltage (V): 1.8; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
e1
FLASH
260
1.8
TIN SILVER COPPER
30
MT25QU02GCBB8E12-0AUTTR
FLASH; Maximum Time At Peak Reflow Temperature (s): 30; Programming Voltage (V): 1.8; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
MT25QU256ABA8E12-0AUTTR
MT25QU256ABA8E12-0AUTTR by Micron Technology is a 32MX8 NOR flash memory with 166 MHz clock frequency, suitable for SPI serial applications. Operating at 1.8V, it offers 100000 Write/Erase cycles and has a compact size of 6mm x 8mm, making it ideal for automotive electronics and IoT devices.
166 MHz
20
100000 Write/Erase Cycles
R-PBGA-B24
8 mm
268435456 bit
8
1
24
33554432 words
32M
SYNCHRONOUS
125 Cel
-40 Cel
32MX8
PLASTIC/EPOXY
TBGA
BGA24,5X5,40
RECTANGULAR
GRID ARRAY, THIN PROFILE
SERIAL
NOT SPECIFIED
AEC-Q100
1.2 mm
SPI
.00018 Amp
35 mA
2 V
1.7 V
YES
CMOS
BALL
1 mm
BOTTOM
NOR TYPE
6 mm
HARDWARE/SOFTWARE
MT25QU256ABA8ESF-0AATTR
FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V; Minimum Operating Temperature: -40 Cel;
R-PDSO-G16
10.3 mm
16
105 Cel
SOP
SOP16,.4
SMALL OUTLINE
2.65 mm
.00012 Amp
GULL WING
1.27 mm
DUAL
7.5 mm
MT28EW256ABA1HPN-0SITTR
FLASH; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 9 mm; Nominal Supply Voltage / Vsup (V): 3;
70 ns
R-PBGA-B56
9 mm
256
56
16777216 words
16M
ASYNCHRONOUS
85 Cel
16MX16
3-STATE
VFBGA
BGA56,8X8,32
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PARALLEL
3
128K
.000135 Amp
50 mA
3.6 V
2.7 V
.8 mm
7 mm
.00006 ms
MT28EW256ABA1LPN-0SITTR
FLASH; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Width: 7 mm; Maximum Standby Current: .000135 Amp;
MT29F1G01AAADDH4-ITX:DTR
FLASH; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Programming Voltage (V): 2.7;
2.7
Tin/Silver/Copper (Sn/Ag/Cu)
MT35XL01GBBA1G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm; Serial Bus Type: SPI;
133 MHz
1073741824 bit
134217728 words
128M
128MX8
HARDWARE
MT35XL01GBBA1G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Terminal Finish: TIN SILVER COPPER;
MT35XL01GBBA2G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE; Maximum Seated Height: 1.2 mm;
MT35XL01GBBA2G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Endurance: 100000 Write/Erase Cycles; Maximum Operating Temperature: 85 Cel;
MT35XL02GCBA1G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 268435456 words; Maximum Time At Peak Reflow Temperature (s): 30;
2147483648 bit
268435456 words
256M
256MX8
MT35XL02GCBA2G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; Write Protection: HARDWARE;
MT35XL256ABA1G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Terminal Finish: TIN SILVER COPPER;
MT35XL256ABA2G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Width: 8; Maximum Time At Peak Reflow Temperature (s): 30;
MT35XL512ABA1G12-0AATTR
MT35XL512ABA1G12-0AATTR by Micron Technology is a 64MX8 NOR type flash memory with a density of 536870912 bits. It operates at a voltage range of 2.7V to 3.6V and has a max clock frequency of 133 MHz. This flash memory is commonly used in automotive applications due to its AEC-Q100 screening level and high endurance of 100000 write/erase cycles.
536870912 bit
67108864 words
64M
64MX8
MT35XL512ABA1G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B24; Minimum Operating Temperature: -40 Cel;
MT35XL512ABA2G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 67108864 words; Surface Mount: YES;
MT35XL512ABA2G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Operating Mode: SYNCHRONOUS;
MT35XU01GBBA1G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit; No. of Words Code: 128M;
200 MHz
MT35XU01GBBA1G12-0AUTTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Length: 8 mm; Terminal Form: BALL;
MT35XU01GBBA1G12-0SITTR
MT35XU01GBBA1G12-0SITTR by Micron Technology is a 128MX8 NOR flash memory with 1.8V supply voltage, operating at up to 200MHz clock frequency. It features hardware write protection and offers 100000 write/erase cycles. Ideal for SPI serial applications requiring high endurance and fast data access in a compact GRID ARRAY package.
MT35XU01GBBA2G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Width: 6 mm; Technology: CMOS;
MT35XU01GBBA2G12-0AUTTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Width: 6 mm; Package Equivalence Code: BGA24,5X5,40;
MT35XU01GBBA2G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; No. of Words Code: 128M;
MT35XU02GCBA1G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B24; Terminal Pitch: 1 mm;
MT35XU02GCBA1G12-0AUTTR
Micron Technology's MT35XU02GCBA1G12-0AUTTR is a 256MX8 NOR flash memory with 200 MHz clock frequency, 1.8V programming voltage, and 100K write/erase cycles. It operates in serial mode via SPI bus, suitable for automotive applications due to AEC-Q100 screening and -40 to 125°C temperature range.
MT35XU02GCBA1G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Maximum Operating Temperature: 85 Cel;
MT35XU02GCBA2G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 268435456 words; Maximum Clock Frequency (fCLK): 200 MHz;
MT35XU02GCBA2G12-0AUTTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20; Operating Mode: SYNCHRONOUS;
MT35XU02GCBA2G12-0SITTR
Micron Technology's MT35XU02GCBA2G12-0SITTR is a 256MX8 NOR type flash memory with a memory density of 2Gb. It operates at a max clock frequency of 200MHz and has a min data retention time of 20 years. This flash memory is commonly used in applications that require high-speed, non-volatile storage such as automotive, industrial, and consumer electronics.
MT35XU256ABA1G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Supply Voltage (Vsup): 1.7 V;
MT35XU256ABA1G12-0AUTTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 2 V; Package Body Material: PLASTIC/EPOXY;
MT35XU256ABA2G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V; Endurance: 100000 Write/Erase Cycles;
MT35XU256ABA2G12-0AUTTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Screening Level: AEC-Q100;
MT35XU512ABA1G12-0AATTR
Micron Technology's MT35XU512ABA1G12-0AATTR is a 64MX8 NOR flash memory with 67108864 words. Operating at 200 MHz, it has a supply voltage range of 1.7V to 2V and endurance of 100000 cycles. Ideal for automotive applications due to AEC-Q100 screening level and -40°C to 105°C operating temperature range.
MT35XU512ABA1G12-0AUTTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Terminal Form: BALL;
MT35XU512ABA2G12-0AATTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Width: 6 mm;
MT35XU512ABA2G12-0AUTTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; Surface Mount: YES;
MT35XU512ABA2G12-0SITTR
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V; Package Equivalence Code: BGA24,5X5,40;
IS25WP512M-RHLE-TR
Integrated Silicon Solution
FLASH; Programming Voltage (V): 1.8; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MT25QL02GCBB8E12-0AATTR
FLASH; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Programming Voltage (V): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
MTFC32GAPALBH-IT
Micron Technology's MTFC32GAPALBH-IT is a 32GX8 NAND flash memory with 3-STATE output, operating at up to 200 MHz. It features a thin profile grid array package suitable for industrial applications. With a wide temperature range (-40 to 85°C) and high memory density (274877906944 bit), it is ideal for demanding environments requiring fast data storage and retrieval.
R-PBGA-B153
13 mm
274877906944 bit
FLASH CARD
153
34359738368 words
32G
32GX8
TFBGA
BGA153,14X14,20
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
INDUSTRIAL
.5 mm
NAND TYPE
11.5 mm
IS22TF32G-JCLA2
IS22TF32G-JCLA2 by Integrated Silicon Solution is a 32GX8 TLC NAND flash memory with 3.3V programming voltage, 200 MHz clock frequency, and 105°C max operating temp. Ideal for applications requiring high-speed data storage in automotive electronics due to AEC-Q100 screening level and compact grid array package design.
3.3
.00003 Amp
55 mA
TLC NAND TYPE
IS25WP512M-RMLA3-TR
FLASH; Programming Voltage (V): 1.8;
MT29F8G08ABABAWP-ITX:B
Micron Technology's MT29F8G08ABABAWP-ITX:B is an 8Gb SLC NAND flash memory with 3.3V supply voltage, operating from -40 to 85°C. It has a memory density of 8.58 Gb and is suitable for industrial applications requiring high reliability and performance in a surface-mount package.
NO
R-PDSO-G48
e3
8589934592 bit
48
1073741824 words
1G
1GX8
MATTE TIN
SLC NAND TYPE
MTFC8GAKAJCN-1MWT
MTFC8GAKAJCN-1MWT by Micron Technology is a 8GX8 MLC NAND flash memory with 68719476736 bit density. It operates at 3.3V, has a temperature range of -25 to 85 °C, and uses synchronous mode. Ideal for applications requiring high memory capacity in compact devices.
ALSO AVAILABE WITH TAPE AND REEL
68719476736 bit
8589934592 words
8G
-25 Cel
8GX8
OPEN-DRAIN
OTHER
MLC NAND TYPE
MTFC4GACAJCN-1MWT
MTFC4GACAJCN-1MWT by Micron Technology is a 4GX8 MLC NAND flash memory with 3.3V supply voltage, operating at -25 to 85 °C. It features a grid array package style, open-drain output, and very thin profile for applications requiring high-density storage in compact devices.
34359738368 bit
4294967296 words
4G
4GX8
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