Loading...

MTFC32GAPALBH-IT

Micron Technology

MTFC32GAPALBH-IT by Micron Technology

Micron Technology's MTFC32GAPALBH-IT is a 32GX8 NAND flash memory with 3-STATE output, operating at up to 200 MHz. It features a thin profile grid array package suitable for industrial applications. With a wide temperature range (-40 to 85°C) and high memory density (274877906944 bit), it is ideal for demanding environments requiring fast data storage and retrieval.

Median Price

$22.948

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,017 parts In-Stock

1+ parts

-

100+ parts

$22.948

1k+ parts

$22.520

10k+ parts

-

1,017

-

$22.948

$22.520

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$25.020

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$25.020

-

-

-

Vyrian

USA . 2,817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,817

-

-

-

-

Cyclops Electronics Ltd

UK . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Digiode

USA . 594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

594

-

-

-

-

Netsource Technology, Inc.

USA . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

499

-

-

-

-

Sensible Micro Corp

USA . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

400

-

-

-

-

Conversion2

USA . 201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

201

-

-

-

-

HZD GmbH

Germany . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

J2 Sourcing AB

Sweden . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

SPM Sales

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

ComSIT Distribution GmbH

Germany . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Speed Components Ltd

Israel . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 172 parts In-Stock

1+ parts

$2.485

100+ parts

-

1k+ parts

-

10k+ parts

-

172

$2.485

-

-

-

Aztec Data Supply Inc.

USA . 4,501 parts In-Stock

1+ parts

$4.540

100+ parts

-

1k+ parts

-

10k+ parts

-

4,501

$4.540

-

-

-

Semicontronic

India . 685 parts In-Stock

1+ parts

$19.510

100+ parts

$19.022

1k+ parts

$18.925

10k+ parts

-

685

$19.510

$19.022

$18.925

-

AZTECH Wire

Italy . 1,003 parts In-Stock

1+ parts

$22.080

100+ parts

-

1k+ parts

-

10k+ parts

-

1,003

$22.080

-

-

-

Continental Prestige Electronics

USA . 5,963 parts In-Stock

1+ parts

$23.585

100+ parts

-

1k+ parts

-

10k+ parts

$23.113

5,963

$23.585

-

-

$23.113

Ampacity Inc.

Singapore . 2,934 parts In-Stock

1+ parts

$42.450

100+ parts

-

1k+ parts

-

10k+ parts

-

2,934

$42.450

-

-

-

Microchip USA

USA . 313 parts In-Stock

1+ parts

$95.404

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$95.404

-

-

-

Infinite Electronics LLP (Excess)

. 10,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,880

-

-

-

-

iBuyXS LLC

. 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Argo Parts USA

USA . 4,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,160

-

-

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

RC Electronics

USA . 921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

921

-

-

-

-

A-Z Elektronik GmbH

Germany . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

Corphita

USA . 522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

522

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$24.520

1k+ parts

$23.769

10k+ parts

$23.269

50

-

$24.520

$23.769

$23.269

Overview

Elevate your device's performance with the MTFC32GAPALBH-IT by Micron Technology. As a leader in flash memory technology, Micron ensures top-tier quality and reliability in their products. This flash memory module is versatile, offering fast data transfer speeds and ample storage capacity for a wide range of applications. Experience seamless operation and improved efficiency with this innovative solution. Upgrade your device today with Micron's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the flash memory, making it suitable for various environments.

Surface Mount: YES

Enables easy and secure installation on circuit boards.

Operating Mode: SYNCHRONOUS

Ensures synchronized data transfers for efficient performance.

Maximum Operating Temperature: 85 °C

Allows the flash memory to operate reliably even in high-temperature conditions.

Organization: 32GX8

Offers a high organization capacity for storing large amounts of data efficiently.

Output Characteristics: 3-STATE

Provides flexibility in data output control for enhanced functionality.

Minimum Operating Temperature: -40 °C

Ensures the flash memory can handle low-temperature environments without issues.

Technology: CMOS

Utilizes efficient CMOS technology for low power consumption and high performance.

Memory Density: 274877906944 bit

Offers high memory density for storing a large amount of data in a compact space.

Memory IC Type: FLASH CARD

Specifically designed as a flash memory card for convenient storage and transfer of data.

Technical Specifications

Flash Memory MTFC32GAPALBH-IT attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

200 MHz

JESD-30 Code:

R-PBGA-B153

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

274877906944 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

153

No. of Words:

34359738368 words

No. of Words Code:

32G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32GX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA153,14X14,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

2.7

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NAND TYPE

Width:

11.5 mm

Trade Compliance

MTFC32GAPALBH-IT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20