Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT29F64G08AMCBBH2-12:B
Micron Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 8589934592 words;
R-PBGA-B100
e1
18 mm
68719476736 bit
FLASH
8
1
100
8589934592 words
8G
SYNCHRONOUS
70 Cel
0 Cel
8GX8
PLASTIC/EPOXY
TBGA
RECTANGULAR
GRID ARRAY, THIN PROFILE
PARALLEL
260
2.7
1.2 mm
3.6 V
2.7 V
3.3
YES
CMOS
COMMERCIAL
Tin/Silver/Copper (Sn/Ag/Cu)
BALL
1 mm
BOTTOM
30
SLC NAND TYPE
12 mm
MT29F64G08AMCBBH2-12IT:B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; Organization: 8GX8;
85 Cel
-40 Cel
INDUSTRIAL
MT29F64G08AJABAWP-IT:B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
20 ns
NO
R-PDSO-G48
e3
18.4 mm
16K
48
ASYNCHRONOUS
TSOP1
TSSOP48,.8,20
SMALL OUTLINE, THIN PROFILE
4K
3/3.3
Not Qualified
512K
.00005 Amp
Flash Memories
50 mA
MATTE TIN
GULL WING
.5 mm
DUAL
MT29F16G08ABACAWP-ITZ:C
MT29F16G08ABACAWP-ITZ:C by Micron Technology is a 3.3V SLC NAND Flash Memory with 2GX8 organization, operating from -40 to 85 °C. It has a memory density of 17179869184 bit and is suitable for industrial applications requiring reliable, high-speed data storage in compact devices.
17179869184 bit
2147483648 words
2G
2GX8
MT29F2G08ABBEAHC:ETR
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
R-PBGA-B63
13 mm
2147483648 bit
63
268435456 words
256M
256MX8
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.8
1.95 V
1.7 V
TIN SILVER COPPER
.8 mm
10.5 mm
MTFC16GJVEC-4MIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 169; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
R-PBGA-B169
FLASH CARD
169
14 mm
RC28F128P33TF60A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16;
60 ns
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
TOP
R-PBGA-B64
e0
10 mm
134217728 bit
16
4,127
64
8388608 words
8M
8MX16
TFBGA
BGA64,8X8,40
GRID ARRAY, THIN PROFILE, FINE PITCH
245
2.5/3,3
3
16K,64K
.002 Amp
28 mA
2.3 V
NOR TYPE
8 mm
PC28F128P33TF60A
Micron Technology's PC28F128P33TF60A is a 3V NOR flash memory with 8Mx16 organization, operating from -40 to 85°C. It features a page size of 8 words, sector sizes of 16K and 64K words, and a memory density of 134217728 bits. Ideal for industrial applications requiring fast access times and low standby current.
MTFDDAK240MAV-1AE12ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: SMA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
R-XSMA-N22
100.45 mm
2061584302080 bit
FLASH MODULE
22
257698037760 words
240G
240GX8
3-STATE
UNSPECIFIED
SMA
MICROELECTRONIC ASSEMBLY
SERIAL
5
7 mm
5.5 V
4.5 V
NO LEAD
SINGLE
MLC NAND TYPE
69.85 mm
MT29F1G08ABCHC:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.65 V;
1073741824 bit
134217728 words
128M
128MX8
1.65 V
MT29F1G08ABCHCET:C
Micron Technology's MT29F1G08ABCHCET:C is a 128MX8 SLC NAND flash memory with 1073741824 bit density. Operating at 1.8V, it offers industrial-grade temperature range of -40 to 85 °C. With parallel interface and very thin profile, it suits applications requiring high-speed data storage in compact devices.
MT29F1G16ABCHC:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
67108864 words
64M
64MX16
MT29F1G16ABCHCET:C
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Type: SLC NAND TYPE;
N25Q128A13EV740
FLASH; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Type: NOR TYPE; Minimum Supply Voltage (Vsup): 2.7 V;
108 MHz
X-XUUC-N
128MX1
DIE
UNCASED CHIP
NOT SPECIFIED
UPPER
MT29F2G08ABAEAWP-ITX:E
Micron Technology's MT29F2G08ABAEAWP-ITX:E is a 256MX8 SLC NAND flash memory with 2147483648 bit density. Operating at 3.3V, it has an industrial temperature grade of -40 to 85 °C. Suitable for parallel applications due to its CMOS technology and 0.5mm terminal pitch.
Matte Tin (Sn)
MT28GU01GAAA1EGC-0SIT
MT28GU01GAAA1EGC-0SIT by Micron Technology is a 64MX16 Flash Memory with 1073741824 bit memory density. Operating at 1.8V, it offers a max access time of 96ns in industrial temperature grade applications. Featuring synchronous operation and parallel interface, this thin profile GRID ARRAY package is suitable for various high-performance embedded systems.
96 ns
AEC-Q100
2 V
MT28GU01GAAA2EGC-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
MT28GU256AAA1EGC-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Width: 8 mm;
268435456 bit
16777216 words
16M
16MX16
MT28GU256AAA2EGC-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B64;
MT28GU512AAA2EGC-0SIT
536870912 bit
33554432 words
32M
32MX16
JS28F00AP33EFA
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
105 ns
IT ALSO OPERATES IN ASYNCHRONOUS MODE
R-PDSO-G56
56
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
JS28F00AP33TFA
Micron Technology's JS28F00AP33TFA is a 64MX16 Flash Memory with 1073741824 bit memory density. Operating at 3V, it has a max access time of 105ns and supports industrial temperature grade. Ideal for applications requiring high-speed data storage in compact devices.
TOP BOOT; IT ALSO OPERATES IN ASYNCHRONOUS MODE
JS28F512P33BFD
Micron Technology's JS28F512P33BFD is a 32MX16 flash memory with 536MB density. Operating at 3V, it offers fast access time of 105ns in industrial temperatures. With parallel interface and bottom boot block, it suits applications requiring high-speed data storage.
BOTTOM BOOT; IT ALSO OPERATES IN ASYNCHRONOUS MODE
JS28F512P33EFA
JS28F512P33EFA by Micron Technology is a NOR flash memory with 32MX16 organization, 536MB density, and 105ns access time. It operates at 3V, has a temperature range of -40 to 85°C, and is suitable for industrial applications requiring high-speed parallel memory access.
31 mA
JS28F512P33TFA
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Boot Block: TOP;
PC28F00AP33EFA
Micron Technology's PC28F00AP33EFA is a 64MX16 Flash Memory with 67108864 words. Operating at 3V, it offers fast access time of 95ns in industrial temperatures. Its parallel interface and thin profile make it ideal for high-speed data storage applications.
95 ns
PC28F00BP33EFA
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
100 ns
128MX16
PC28F512P33BFD
Micron Technology's PC28F512P33BFD is a 32MX16 flash memory with 33554432 words. It operates at 3V, has a memory width of 16 bits, and offers fast access time of 95 ns. Ideal for industrial applications requiring high-density memory in a compact GRID ARRAY package.
PC28F512P33EFA
Micron Technology's PC28F512P33EFA is a 32MX16 Flash Memory with 33554432 words. Operating at 3V, it offers a memory density of 536870912 bits and operates in industrial temperature grade. With a parallel interface and synchronous mode, it is ideal for applications requiring high-speed data storage and retrieval.
PC28F512P33TFA
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MTFC32GJDDQ-4MIT
Micron Technology's MTFC32GJDDQ-4MIT is a 32GB MLC NAND flash memory with 100 terminals in a low-profile grid array package. Operating at 3.3V, it is ideal for industrial applications requiring high-density storage in compact spaces. With CMOS technology and ball terminal form, it offers reliable performance for various flash card solutions.
LBGA
GRID ARRAY, LOW PROFILE
1.4 mm
M25P128-VME6GB
Micron Technology's M25P128-VME6GB is a 16MX8 NOR flash memory with 134217728 bit density. Operating at 3V, it offers 10000 write/erase cycles and SPI serial bus interface. Ideal for industrial applications requiring high endurance and reliable data storage in compact form factor.
50 MHz
20
10000 Write/Erase Cycles
R-PDSO-N8
16MX8
HVSON
SOLCC8,.3
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SPI
.0001 Amp
20 mA
1.27 mm
6 mm
HARDWARE/SOFTWARE
MT29F1G08ABADAWP-IT:D
Micron Technology's MT29F1G08ABADAWP-IT:D is a 3.3V SLC NAND flash memory with 128Mx8 organization, operating in industrial temperature range. It features 2K page size, 128K sector size, and parallel interface. Ideal for applications requiring fast access times and high memory density.
25 ns
1K
2K
128K
35 mA
TIN
MT29F1G08ABADAWP-ITX:D
Micron Technology's MT29F1G08ABADAWP-ITX:D is a 128Mx8 SLC NAND flash memory with 3.3V programming voltage, operating in industrial temperature range. It features 2K page size, 128K sector size, and parallel interface. Ideal for applications requiring high-speed data storage and retrieval in harsh environments.
MT29F1G08ABBDAH4-IT:D
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
11 mm
BGA63,10X12,32
9 mm
MT29F64G08AFAAAWP-IT:A
Micron Technology's MT29F64G08AFAAAWP-IT:A is an 8GX8 MLC NAND flash memory with 3.3V supply, 8K page size, and 1M sector size. It operates in industrial temperature range (-40 to 85 °C) and has a parallel interface. Ideal for applications requiring high-density non-volatile memory with fast access times.
8K
1M
.00001 Amp
Tin (Sn)
N25Q00AA11G1240E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: LBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;
R-PBGA-B24
24
1073741824 words
1G
1GX1
1.3 mm
MTFDDAK120MAV-1AE12ABYY
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: DIE; Package Shape: RECTANGULAR; Length: 100.5 mm;
R-XUUC-N22
100.5 mm
MTFDDAK480MAV-1AE12ABYY
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
MTFDDAK960MAV-1AE12ABYY
MTFDDAT120MAV-1AE12ABYY
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP;
R-XUUC-N52
50.8 mm
52
3.7 mm
29.85 mm
MTFDDAT240MAV-1AE12ABYY
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: DIE; Package Shape: RECTANGULAR; Width: 29.85 mm;
MTFC16GJDEC-4MIT
Micron Technology's MTFC16GJDEC-4MIT is a 16GX8 MLC NAND flash memory with 137.4Gb density, operating at 52MHz clock frequency. It features a very thin profile grid array package suitable for industrial applications requiring high-speed data storage and retrieval.
52 MHz
137438953472 bit
17179869184 words
16G
16GX8
BGA169,14X28,20
MT29F8G08ABABAWP-IT:B
Micron Technology's MT29F8G08ABABAWP-IT:B is a 3.3V SLC NAND flash memory with 1GX8 organization, 2K sectors, and 4K page size. It operates in industrial temperatures (-40 to 85 °C) with 100000 write/erase cycles endurance. Ideal for applications requiring high-density parallel memory storage.
10
100000 Write/Erase Cycles
8589934592 bit
1GX8
MT29F16G08ADACAH4-IT:C
MT29F16G08ADACAH4-IT:C by Micron Technology is a 3.3V SLC NAND flash memory with 2GX8 organization, 4K page size, and 256K sector size. It operates in industrial temperature range (-40 to 85 °C) and has a parallel interface. Ideal for applications requiring fast access times and high memory density.
256K
N25Q256A13E1241E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Width: 1;
256MX1
N25Q256A83E1241E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
N25Q256A83E1241F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Organization: 256MX1;
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