Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT35XL01GBBA2G12-0AAT
Micron Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE;
133 MHz
R-PBGA-B24
e1
8 mm
1073741824 bit
FLASH
8
1
24
134217728 words
128M
SYNCHRONOUS
105 Cel
-40 Cel
128MX8
PLASTIC/EPOXY
TBGA
RECTANGULAR
GRID ARRAY, THIN PROFILE
SERIAL
260
3
AEC-Q100
1.2 mm
3.6 V
2.7 V
YES
CMOS
INDUSTRIAL
TIN SILVER COPPER
BALL
1 mm
BOTTOM
30
6 mm
MT35XL256ABA1G12-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 268435456 words;
268435456 bit
268435456 words
256M
256MX1
MT35XL256ABA2G12-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
33554432 words
32M
32MX8
MT35XL512ABA1G12-0AAT
MT35XL512ABA1G12-0AAT by Micron Technology is a 512M Flash Memory with 536870912 bit density. It operates at 133 MHz clock frequency, has a thin profile grid array package style, and supports synchronous mode. Ideal for industrial applications requiring high memory capacity and reliable performance in harsh environments.
536870912 bit
536870912 words
512M
512MX1
MT35XL512ABA2G12-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
67108864 words
64M
64MX8
MT35XU02GCBA2G12-0AUT
Micron Technology's MT35XU02GCBA2G12-0AUT is a 256MX8 flash memory IC with 1.8V supply voltage, operating at up to 200MHz clock frequency. Designed for automotive applications, it features AEC-Q100 screening level and operates in a temperature range of -40°C to 125°C.
200 MHz
2147483648 bit
125 Cel
256MX8
1.8
2 V
1.7 V
AUTOMOTIVE
MT35XU256ABA1G12-0AAT
Micron Technology's MT35XU256ABA1G12-0AAT is a 256MX1 flash memory with 268M words. Operating at 166MHz, it has a voltage range of 1.7V to 2V and withstands industrial temperatures from -40°C to 105°C. Ideal for applications requiring high-speed synchronous operation in compact devices.
166 MHz
MT35XU256ABA1G12-0AUT
Micron Technology's MT35XU256ABA1G12-0AUT is a 256MX1 flash memory with 268Mbit density. Operating at 166MHz, it has a supply voltage range of 1.7V to 2V and supports automotive applications. With AEC-Q100 screening, this synchronous memory in grid array package offers high performance in harsh environments.
MT35XU256ABA2G12-0AUT
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
MT35XU512ABA2G12-0AUT
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
MT29F4G08ABAEAH4:E
FLASH; Type: SLC NAND TYPE; JESD-609 Code: e1; Programming Voltage (V): 3.3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER;
3.3
SLC NAND TYPE
MTFC2GMDEA-0MWTA
MTFC2GMDEA-0MWTA by Micron Technology is a 2GX8 flash memory with 17179869184 bit density. Operating at 52 MHz, it has a very thin profile and fine pitch package style suitable for synchronous applications. With a voltage range of 2.7V to 3.6V, it is ideal for high-speed data storage in electronic devices.
ALSO HAVING MMC CONTROLLER
52 MHz
R-PBGA-B153
e2
13 mm
17179869184 bit
153
2147483648 words
2G
85 Cel
-25 Cel
2GX8
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PARALLEL
.8 mm
OTHER
TIN SILVER COPPER NICKEL
.5 mm
11.5 mm
MT29F2G16ABBEAH4-IT:E
MT29F2G16ABBEAH4-IT:E by Micron Technology is a 128MX16 SLC NAND flash memory with 1.8V supply, operating from -40 to 85°C. It features a 1K word page size, 64K word sector size, and parallel interface. Ideal for industrial applications requiring fast access times and low standby current.
25 ns
NO
R-PBGA-B63
11 mm
16
2K
63
ASYNCHRONOUS
128MX16
BGA63,10X12,32
1K
Not Qualified
64K
.00005 Amp
Flash Memories
20 mA
1.95 V
9 mm
MT29F1G01AAADDH4-ITX:D
Micron Technology's MT29F1G01AAADDH4-ITX:D is a 1GX1 SLC NAND flash memory with 1073741824-bit density. Operating at 3.3V, it offers synchronous mode and supports up to 50MHz clock frequency. Ideal for industrial applications requiring high-speed data storage in a compact GRID ARRAY package.
50 MHz
1073741824 words
1G
1GX1
2.7
Tin/Silver/Copper (Sn/Ag/Cu)
MTFC4GLGDQ-AITA
MTFC4GLGDQ-AITA by Micron Technology is a 4GX8 MLC NAND flash memory with 34359738368-bit density. Operating in synchronous mode, it has a low profile grid array package style and operates at industrial temperature grade. Ideal for applications requiring high memory capacity and fast data access speeds.
R-PBGA-B100
18 mm
34359738368 bit
FLASH CARD
100
4294967296 words
4G
4GX8
LBGA
GRID ARRAY, LOW PROFILE
1.4 mm
MLC NAND TYPE
14 mm
MT29F16G08ABABAWP-IT:BTR
MT29F16G08ABABAWP-IT:BTR by Micron Technology is a 3.3V SLC NAND flash memory with 2GX8 organization, operating from -40 to 85°C. It features a parallel interface, 48 terminals in a small outline package, and offers 17179869184-bit memory density. Ideal for industrial applications requiring high-speed data storage and retrieval.
R-PDSO-G48
e3
18.4 mm
48
TSOP1
SMALL OUTLINE, THIN PROFILE
Matte Tin (Sn)
GULL WING
DUAL
12 mm
PF48F4400P0VBQ0A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
88 ns
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
R-PBGA-B88
8, 510
88
32MX16
TFBGA
BGA88,8X12,32
GRID ARRAY, THIN PROFILE, FINE PITCH
4
NOT SPECIFIED
1.8,1.8/3.3
16K,64K
.000005 Amp
51 mA
NOR TYPE
PC48F4400P0VB00A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Length: 13 mm;
R-PBGA-B64
64
BGA64,8X8,40
10 mm
MT29F8G08ABACAWP-AIT:CTR
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
60000 Write/Erase Cycles
8589934592 bit
4K
1GX8
TSSOP48,.8,20
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
256K
.0001 Amp
35 mA
RC28F128J3F75F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
75 ns
134217728 bit
8388608 words
8M
8MX16
MT29F32G08ABAAAWP-IT:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Memory Density: 34359738368 bit;
20 ns
8K
3/3.3
1M
.00001 Amp
50 mA
MT29F32G08AFACAWP-ITZ:C
MT29F32G08AFACAWP-ITZ:C by Micron Technology is a 3.3V SLC NAND Flash Memory with 4GX8 organization, 8K sectors, and 4K page size. It operates in industrial temperature range (-40 to 85 °C) and has a max access time of 20 ns. Ideal for applications requiring high-speed data storage in compact devices.
512K
MT29F1G01ABAFDSF-AAT:F
Micron Technology's MT29F1G01ABAFDSF-AAT:F is a 3.3V SLC NAND Flash Memory with 1Gx1 organization, operating from -40 to 105°C. It offers 1073741824-bit memory density for industrial applications, featuring serial interface and small outline package ideal for space-constrained designs.
R-PDSO-G16
SOP
SMALL OUTLINE
MTFC4GLGDQ-AITZTR
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Width: 14 mm;
MTFC64GAPALBH-IT
MTFC64GAPALBH-IT by Micron Technology is a 64GX8 NAND flash memory with 3-STATE output, operating at up to 200 MHz. It features a thin profile grid array package suitable for industrial applications requiring high memory density and wide temperature range support from -40°C to 85°C.
549755813888 bit
68719476736 words
64G
64GX8
3-STATE
BGA153,14X14,20
1.1 mm
NAND TYPE
MTFC4GLMDQ-AITZTR
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Words: 4294967296 words;
OPEN-DRAIN
BGA100,10X17,40
MTFC64GASAONS-AAT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
1.461 mm
MTFC64GASAONS-AITESTR
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
95 Cel
MTFC16GAKAEDQ-AATTR
FLASH CARD; Programming Voltage (V): 2.7; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Gold (Au) - with Nickel (Ni) barrier;
e4
Gold (Au) - with Nickel (Ni) barrier
MT25QL256ABA1EW9-0AAT
Micron Technology's MT25QL256ABA1EW9-0AAT is a 256Mbit flash memory with synchronous operation, 133MHz clock frequency, and 3V nominal voltage. Ideal for industrial applications, it offers high memory density of 268435456 bits in a small outline package with very thin profile.
R-PDSO-N8
HVSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
NO LEAD
1.27 mm
N25Q128A13EF8A0FTR
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Density: 134217728 bit;
108 MHz
128MX1
N25Q032A13ESCA0FTR
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 33554432 words;
R-PDSO-G8
4.9 mm
33554432 bit
32MX1
1.75 mm
3.9 mm
MT29F2G16ABAEAWP:ETR
Micron Technology's MT29F2G16ABAEAWP:ETR is a 3.3V SLC NAND flash memory with 128Mx16 organization and 2147483648-bit memory density. Operating in asynchronous mode, it has a temperature range of 0-70°C and is suitable for commercial applications requiring high-speed parallel memory access.
70 Cel
0 Cel
COMMERCIAL
N25Q064A13E1240E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Width: 8;
20
COMMON
67108864 bit
8MX8
TOTEM POLE
BGA24, 5X5, 40
SPI
15 mA
HARDWARE/SOFTWARE
MTFC4GACAJCN-4MITTR
Micron Technology's MTFC4GACAJCN-4MITTR is a 4GX8 MLC NAND flash memory with 34359738368-bit density. Operating at up to 52 MHz, it features a very thin profile and fine pitch grid array package suitable for industrial applications. With a wide temperature range (-40 to 85 °C), this synchronous memory offers high performance in compact dimensions.
MTSD256AHC6MS-1WT
FLASH CARD; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
R-XUUC-N
2199023255552 bit
274877906944 words
256G
256GX8
UNSPECIFIED
DIE
UNCASED CHIP
UPPER
MTSD064AHC6MS-1WT
Micron Technology's MTSD064AHC6MS-1WT is a 64GX8 NOR type flash memory chip with 549755813888-bit density. Operating synchronously at -25 to 85 °C, it offers 68719476736 words capacity for various applications requiring high-speed serial memory solutions.
MTSD032AHC6MS-1WT
MTSD032AHC6MS-1WT by Micron Technology is a 32GX8 NOR flash memory chip with 274877906944-bit density. Operating in synchronous mode, it has a memory width of 8 and operates serially. Ideal for applications requiring high-speed data storage and retrieval at temperatures ranging from -25°C to 85°C.
274877906944 bit
34359738368 words
32G
32GX8
MTSD128AHC6MS-1WT
FLASH CARD; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Terminal Position: UPPER; Technology: CMOS;
1099511627776 bit
137438953472 words
128G
128GX8
MTFC128GAPALBH-AAT
MTFC128GAPALBH-AAT by Micron Technology is a 128GX8 NAND flash memory with 1099511627776 bit density. Operating in synchronous mode, it has a terminal pitch of 0.5 mm and supports parallel communication. This thin profile package is ideal for applications requiring high-speed data storage and retrieval at temperatures ranging from -40 to 105 °C.
MTFC16GAPALGT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 16GX8;
5
137438953472 bit
17179869184 words
16G
16GX8
BGA
MTFC8GAKAJCN-4MITTR
Micron Technology's MTFC8GAKAJCN-4MITTR is a 8GX8 MLC NAND flash memory with 68719476736 bit density. It operates in synchronous mode at up to 52 MHz clock frequency, suitable for industrial applications. The package style is grid array with very thin profile and fine pitch, making it ideal for compact electronic devices.
68719476736 bit
8589934592 words
8G
8GX8
MTFC16GAPALHT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
GRID ARRAY, VERY THIN PROFILE
MT29F8G08ADBDAH4-AAT:D
MT29F8G08ADBDAH4-AAT:D by Micron Technology is an 1GX8 SLC NAND flash memory with 105°C max and -40°C min operating temp. It offers 1073741824 words, 8589934592 bit density, and INDUSTRIAL grade. Ideal for applications requiring high reliability in harsh environments.
MT29F2G08ABAGAWP-IT:GTR
Micron Technology's MT29F2G08ABAGAWP-IT:GTR is an industrial-grade SLC NAND flash memory with 256MX8 organization, operating from -40 to 85 °C. It offers a memory density of 2147483648 bits and is suitable for applications requiring high reliability in harsh environments.
MTFDDAV480TDS-1AW1ZABYY
Micron Technology's MTFDDAV480TDS-1AW1ZABYY is a 480GX8 TLC NAND flash memory with 3.3V programming voltage. Operating in asynchronous mode, it has a memory density of 4123168604160 bit and operates b/w 0 to 70 °C. Ideal for microelectronic assemblies, this rectangular package measures 80mm x 22mm x 3.28mm and features a serial interface with no lead terminals.
R-XSMA-N75
80 mm
4123168604160 bit
FLASH MODULE
75
515396075520 words
480G
480GX8
SMA
MICROELECTRONIC ASSEMBLY
3.28 mm
3.46 V
3.14 V
SINGLE
TLC NAND TYPE
22 mm
MTFC16GAPALBH-ITTR
MTFC16GAPALBH-ITTR by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a thin profile and fine pitch package style suitable for industrial applications. With a temperature range of -40 to 85 °C, it offers high-speed synchronous operation in a compact form factor.
MTFC16GAPALBH-IT
MTFC16GAPALBH-IT by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a thin profile and fine pitch package style suitable for industrial applications. With a temperature range of -40 to 85 °C, this flash card offers high memory density and synchronous operation.
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