Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT29F1G16ABBEAHC:E
Micron Technology
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
R-PBGA-B63
13 mm
1073741824 bit
FLASH
16
1
63
67108864 words
64M
ASYNCHRONOUS
70 Cel
0 Cel
64MX16
PLASTIC/EPOXY
VFBGA
RECTANGULAR
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PARALLEL
1.8
1 mm
1.95 V
1.7 V
YES
CMOS
COMMERCIAL
BALL
.8 mm
BOTTOM
SLC NAND TYPE
10.5 mm
MT25TL256HBA8ESF-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
133 MHz
R-PDSO-G16
10.3 mm
268435456 bit
8
33554432 words
32M
SYNCHRONOUS
105 Cel
-40 Cel
32MX8
SOP
SMALL OUTLINE
SERIAL
NOT SPECIFIED
3
AEC-Q100
2.65 mm
3.6 V
2.7 V
INDUSTRIAL
GULL WING
1.27 mm
DUAL
7.5 mm
MTFC16GAKAENA-4MITTR
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 17179869184 words;
R-PBGA-B100
e1
18 mm
137438953472 bit
FLASH CARD
100
17179869184 words
16G
85 Cel
16GX8
TBGA
GRID ARRAY, THIN PROFILE
260
2.7
1.2 mm
Tin/Silver/Copper (Sn/Ag/Cu)
30
14 mm
MT29F4G08ABBDAH4-ITX:D
MT29F4G08ABBDAH4-ITX:D by Micron Technology is a 512Mx8 SLC NAND flash memory with 4K sectors, operating at 1.8V. It features a very thin profile grid array package, suitable for industrial applications requiring fast access times of 25ns and low standby current of 0.00005Amp.
25 ns
NO
11 mm
4294967296 bit
4K
536870912 words
512M
512MX8
BGA63,10X12,32
2K
Not Qualified
128K
.00005 Amp
Flash Memories
20 mA
9 mm
MT29F4G08ABADAH4-AITX:D
Micron Technology's MT29F4G08ABADAH4-AITX:D is a 512MX8 SLC NAND flash memory with 4294967296 bit density. Operating at 3.3V, it has a programming voltage of 1.8V and supports industrial temperature grade applications. With a compact size of 11mm x 9mm x 1mm, this flash memory features parallel interface and very thin profile package for high-speed data storage solutions.
3.3
MTFC16GKQDI-IT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
IT ALSO REQUIRES 1.65V TO 1.95V, MMC DEVICE
52 MHz
R-PBGA-B169
16 mm
169
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
.5 mm
MLC NAND TYPE
12 mm
MT29F128G08CBCCBH6-6R:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
R-PBGA-B152
152
SYNCHRONOUS/ASYNCHRONOUS
VBGA
GRID ARRAY, VERY THIN PROFILE
MT29F128G08CBECBH6-12:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Technology: CMOS;
MT29F1T08CUCCBH8-6R:C
MT29F1T08CUCCBH8-6R:C by Micron Technology is a Flash Memory with 128GX8 organization, 3.3V nominal voltage, and 1099511627776 bit memory density. It is used in applications requiring high-speed data storage and retrieval, such as smartphones, tablets, and solid-state drives (SSDs).
1099511627776 bit
137438953472 words
128G
128GX8
LBGA
GRID ARRAY, LOW PROFILE
1.4 mm
MT29F256G08CECCBH6-6R:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Type: MLC NAND TYPE;
274877906944 bit
34359738368 words
32G
32GX8
MT29F256G08CEECBH6-12:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MT29F512G08CKCCBH7-6R:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 549755813888 bit;
549755813888 bit
68719476736 words
64G
64GX8
MT29F512G08CKECBH7-12:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MTFDDAT128MBD-1AK12ITYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words: 137438953472 words; Terminal Position: SINGLE; Technology: CMOS;
R-XSMA-N
FLASH MODULE
UNSPECIFIED
MICROELECTRONIC ASSEMBLY
NO LEAD
SINGLE
TLC NAND TYPE
MTFDDAT256MBD-1AK12ITYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; Technology: CMOS; Package Style (Meter): MICROELECTRONIC ASSEMBLY; No. of Functions: 1;
2199023255552 bit
274877906944 words
256G
256GX8
MT29F1G08ABADAH4-ITX:D
MT29F1G08ABADAH4-ITX:D by Micron Technology is a 3.3V SLC NAND flash memory with 128Mx8 organization, operating from -40 to 85°C. It features a 2K word page size, 128K word sector size, and parallel interface. Ideal for industrial applications requiring fast access times and low standby current.
1K
134217728 words
128M
128MX8
.0001 Amp
35 mA
TIN SILVER COPPER
MT29F1G16ABBEAH4-IT:E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 11 mm;
MT25QU128ABA8E12-1SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;
166 MHz
R-PBGA-B24
8 mm
134217728 bit
24
128MX1
2 V
6 mm
MT29F2G16ABAEAWP-AAT:E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Functions: 1;
R-PDSO-G48
18.4 mm
2147483648 bit
48
128MX16
TSOP1
SMALL OUTLINE, THIN PROFILE
M29W320DB80ZA3E
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
80 ns
R-PBGA-B48
33554432 bit
2097152 words
2M
125 Cel
2MX16
AUTOMOTIVE
NAND512R3A2SZAXE
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Type: SLC NAND TYPE;
45 ns
512753664 bit
64094208 words
64MX8
512
1.05 mm
16K
15 mA
NAND512W3A2SNXE
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Surface Mount: YES;
35 ns
TSSOP48,.8,20
3/3.3
NAND512W3A2SZAXE
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
NAND512R3A2SZA6F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Sectors/Size: 4K;
NAND256W3A2BZAXE
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 55; Package Code: TFBGA; Package Shape: RECTANGULAR; Programming Voltage (V): 3;
R-PBGA-B55
10 mm
55
BGA55,8X12,32
NAND512R3A2SN6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Technology: CMOS;
e3
MATTE TIN
NAND512R3A2SN6F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Length: 18.4 mm;
M25P16-VMF3PB
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
75 MHz
20
100000 Write/Erase Cycles
16777216 bit
2MX8
SOP16,.4
SPI
NOR TYPE
HARDWARE/SOFTWARE
MT29F4G16ABADAH4-AIT:D
Micron's MT29F4G16ABADAH4-AIT:D is a 256MX16 SLC NAND flash memory with 3.3V programming voltage. Operating in industrial temperatures (-40 to 85°C), it offers 4294967296-bit memory density for parallel applications. The package features a grid array style with bottom terminal position, suitable for surface mount designs.
268435456 words
256M
256MX16
BGA
GRID ARRAY
M29W640GT7AN6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
70 ns
67108864 bit
4194304 words
4M
4MX16
MT25TL512HBA8ESF-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
536870912 bit
MT29F4G08ABADAWP-AATX:DTR
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Programming Voltage (V): 3.3;
PC28F128P33BF60A
Micron Technology's PC28F128P33BF60A is a 8MX16 NOR flash memory with 64 terminals. Operating at 3V, it offers 134217728 bits of memory density and supports synchronous mode. With a temperature range of -40 to 85°C, it is ideal for industrial applications requiring fast access times and low standby current.
60 ns
R-PBGA-B64
4,127
64
8388608 words
8M
8MX16
BGA64,8X8,40
2.5/3.3
16K,64K
.002 Amp
28 mA
2.3 V
MT25QL128ABB8E12-0AUT
Micron Technology's MT25QL128ABB8E12-0AUT is a 16MX8 flash memory with 133 MHz clock frequency, suitable for automotive applications. Operating at 3V, it offers 16777216 words of memory with a density of 134217728 bits. The package style is grid array, thin profile, making it ideal for space-constrained designs.
16777216 words
16M
16MX8
MTFC16GAKAEJP-4MIT
MTFC16GAKAEJP-4MIT by Micron Technology is a 16GX8 Flash Memory with 17179869184 words capacity. Operating in synchronous mode, it has a memory width of 8 and memory density of 137438953472 bit. Ideal for industrial applications, this very thin profile package offers parallel programming with a terminal pitch of 0.5 mm.
R-PBGA-B153
153
11.5 mm
MTFC32GAKAEJP-4MIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 13 mm;
MT29F256G08CMCBBH2-10:B
FLASH; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Programming Voltage (V): 3.3;
MTFC8GAMALBH-AIT
MTFC8GAMALBH-AIT by Micron Technology is a NAND flash memory with 8GX8 organization, operating at -40 to 85°C. It features a thin profile package style with 153 terminals and uses parallel programming mode. Ideal for industrial applications requiring high memory density and fast data access.
68719476736 bit
8589934592 words
8G
8GX8
NAND TYPE
MTFC4GLGDM-AITZ
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 4G;
34359738368 bit
4294967296 words
4G
4GX8
MTFC4GMWDM-3MAIT
MTFC4GMWDM-3MAIT by Micron Technology is a 4GX8 flash memory with 34359738368 bit density. Operating in synchronous mode, it has a thin profile and fine pitch package style. Ideal for industrial applications, it supports parallel programming with a voltage range of 2.7V to 3.6V.
MTFC4GMWDQ-3MAIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Words Code: 4G;
MTFC4GLMDQ-AITZ
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
OPEN-DRAIN
BGA100,10X17,40
MTFC8GLWDQ-3LAITZ
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
MT29F64G08CFACAWP-Z:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
MT29F32G08CBACAWP-ITZ:C
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Organization: 4GX8;
MT29F32G08CBACAWP-Z:C
Micron Technology's MT29F32G08CBACAWP-Z:C is a 3.3V MLC NAND Flash Memory with 4GX8 organization, operating in commercial temperature grade. It features 48 terminals, 0.5mm pitch, and offers 34359738368-bit memory density. Ideal for applications requiring high-speed data storage and retrieval in compact devices.
MT29F64G08CFACBWP-12Z:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
MT35XL01GBBA1G12-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Length: 8 mm;
1073741824 words
1G
1GX1
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