Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Micron's MT29F4G16ABADAH4-AIT:D is a 256MX16 SLC NAND flash memory with 3.3V programming voltage. Operating in industrial temperatures (-40 to 85°C), it offers 4294967296-bit memory density for parallel applications. The package features a grid array style with bottom terminal position, suitable for surface mount designs.
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$8.000
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$14.173
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$24.000
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Authorized Procurement Solutions
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Microchip USA
Bastille Electronics
This material provides durability and reliability, making it a suitable choice for various applications.
The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.
The rectangular shape optimizes space utilization, making it ideal for compact electronic devices.
The asynchronous operation mode offers flexibility and fast data access, enhancing the overall performance of the flash memory.
The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems, increasing versatility.
With a high number of terminals, this flash memory chip offers various connectivity options for integration into different devices.
The grid array package style provides a secure and stable mounting solution, minimizing the risk of damage during operation.
The high maximum operating temperature tolerance of 85°C ensures reliable performance in harsh environments.
The 256MX16 organization offers a large storage capacity and efficient data organization, suitable for data-intensive applications.
The low minimum operating temperature tolerance of -40°C ensures the flash memory chip remains functional even in extreme cold conditions.
The terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.
The bottom terminal position simplifies installation and maintenance, making it user-friendly for integration in electronic systems.
The short maximum time at peak reflow temperature of 30 seconds minimizes the risk of thermal damage during the manufacturing process.
The high peak reflow temperature tolerance of 260°C ensures proper soldering and secure connections.
The SLC NAND type offers fast read and write speeds, making it suitable for high-performance applications.
The programming voltage of 3.3V ensures efficient data programming and operations, enhancing the overall functionality of the flash memory.
The industrial temperature grade ensures reliable operation in industrial environments with varying temperature conditions.
The CMOS technology offers low power consumption and high noise immunity, extending the battery life of devices using this flash memory.
The parallel interface allows for faster data transfer rates and simultaneous access to memory, enhancing overall system performance.
The ball terminal form offers secure and reliable connections, ensuring stable data transfer and system operation.
With a high number of words, this flash memory chip offers a vast storage capacity for data-intensive applications.
The memory width of 16 bits enables efficient data processing and retrieval, enhancing system performance.
The 256M words code provides a large address space for storing and accessing a wide range of data, increasing versatility.
The high memory density of 4294967296 bits offers ample storage capacity for storing large amounts of data.
The flash memory IC type provides non-volatile storage, allowing data to be retained even when power is disconnected.
Flash Memory MT29F4G16ABADAH4-AIT:D attributes and parameters. Explore more Flash Memory devices from Micron Technology
JESD-30 Code:
JESD-609 Code:
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MT29F4G16ABADAH4-AIT:D Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Packaging - Memory 24-May-2022 Tray 05-May-2022
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
BAV99
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Renesas Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
M24308/2-1F
Souriau
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Body or Shell Style: RECEPTACLE; MIL Conformity: YES;
LM358M
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358N
Silicon Group
SS14
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
STMicroelectronics
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
ULN2803ADWR
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
BSS123-7-F
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
Unitrode
MX25V1635FM1ITR
Macronix
Macronix MX25V1635FM1ITR is a 16Mb NOR Flash Memory with SPI interface. Operating at 80MHz, it offers 100K Write/Erase cycles and supports hardware/software write protection. Ideal for applications requiring fast synchronous data transfer in compact designs.
S70FL01GSAGMFI013
Spansion
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
SST25VF080B-50-4I-S2AE-T
Microchip Technology
SST25VF080B-50-4I-S2AE-T by Microchip Technology is a NOR type Flash Memory with 8Mx1 organization, SPI serial bus type, and 50 MHz clock frequency. It is ideal for industrial applications requiring high endurance with 100000 write/erase cycles and operates in a temperature range of -40 to 85°C.
S29GL01GS10DHI013
Infineon Technologies
FLASH; No. of Terminals: 64; Package Code: LBGA; Package Shape: SQUARE; Memory Width: 8; Maximum Supply Voltage (Vsup): 3.6 V;
S29GL064S80TFV030
S29GL064S80TFV030 by Infineon Technologies is an 8MX8 Flash Memory with 67108864 bit memory density and 80 ns max access time. It operates at a nominal voltage of 3V, suitable for industrial applications requiring fast and reliable data storage in a compact form factor. The package style is small outline, thin profile, shrink pitch, making it ideal for space-constrained designs that demand high-speed performance.
MX30LF2G18AC-TI
MX30LF2G18AC-TI by Macronix is a 256MX8 SLC NAND flash memory with 2147483648 bit density. Operating at -40 to 85 °C, it has a supply voltage range of 2.7V to 3.6V for industrial applications. With a compact size of 18.4mm x 12mm and GULL WING terminals, it offers high-speed parallel operation in a small outline package.
S25FS128SDSNFI100
Cypress Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Density: 134217728 bit;
MT29F1G08ABADAWP-IT:DTR
Micron Technology
Micron Technology's MT29F1G08ABADAWP-IT:DTR is a 128MX8 SLC NAND flash memory with 1073741824-bit density. Operating at 3.3V, it has an industrial temperature grade and supports parallel mode. With a compact form factor of 18.4mm x 12mm x 1.2mm, it is ideal for high-performance embedded applications requiring reliable non-volatile storage.
AT25SF041-SSHD-T
Dialog Semiconductor
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 512K;
MX25L6433FZNI-08G
Macronix's MX25L6433FZNI-08G is a 64Mb NOR flash memory with SPI serial bus, 133MHz clock frequency, and 100K write/erase cycles. Ideal for industrial applications requiring low power consumption and high endurance in a compact package.
Adesto Technologies
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1;
S26KS512SDPBHM020
Infineon's S26KS512SDPBHM020 is a 64MX8 Flash Memory with 536870912 bit memory density. Operating at 1.8V, it offers synchronous mode and parallel interface for fast access time of 96ns. Ideal for automotive applications due to AEC-Q100 screening and TS16949 certification.
SST39VF1681-70-4C-EKE
SST39VF1681-70-4C-EKE by Microchip: NOR flash memory, 2Mx8 organization, 512 sectors of 4K words each. Ideal for commercial applications requiring fast access time (70ns) and endurance of 100k write/erase cycles. Operates at 3V with low standby current (0.00002A) and supports asynchronous mode.
AT45DB041E-SSHN-B
Renesas Electronics AT45DB041E-SSHN-B is a 4Mbit NOR Flash Memory with SPI interface, 85MHz clock frequency, and 100000 Write/Erase cycles. It operates at -40 to 85°C, has a supply voltage of 2.3-3.6V, and is suitable for industrial applications requiring high endurance non-volatile memory.
SST25VF080B-50-4C-PAE
SST25VF080B-50-4C-PAE by Microchip: 8MX1 flash memory with 8388608-bit density, SPI serial bus, and 50 MHz clock freq. Ideal for hardware/software write protection in commercial-grade applications.
SST26VF016B-104I/SN
SST26VF016B-104I/SN by Microchip: 16MX1 NOR Flash Memory with 104 MHz clock freq. Ideal for industrial applications, offers 100000 Write/Erase cycles, SPI serial bus type.
AM29F400BT-90EF
Advanced Micro Devices
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
MX25L25645GM2I-08G
Macronix MX25L25645GM2I-08G is a 32MX8 NOR flash memory with 268MB density, SPI serial bus, and 120MHz clock frequency. Ideal for industrial applications requiring high endurance, it supports hardware/software write protection and operates in a temperature range of -40 to 85°C.
MX29F040CQI-70G
MX29F040CQI-70G by Macronix is a 512Kx8 NOR flash memory chip with 100,000 write/erase cycles. Operating at 5V, it offers fast access time of 70ns and supports asynchronous mode. Ideal for industrial applications requiring reliable non-volatile memory storage in compact form factor.
MX25L51245GZ2I-10G
Macronix MX25L51245GZ2I-10G is a 512Mb Flash Memory with synchronous operation, 104 MHz clock frequency, and industrial temperature grade. It has a serial interface, 128M x 4 organization, and operates at voltage range of 2.7V to 3.6V. Ideal for applications requiring high-speed data storage in compact electronic devices.
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MT29F16G08ABACAWP-ITZ:CTR
Micron Technology's MT29F16G08ABACAWP-ITZ:CTR is a 3.3V SLC NAND Flash Memory with 2GX8 organization, operating from -40 to 85 °C. It features a small outline package, parallel interface, and industrial temperature grade suitable for embedded systems and data storage applications.
MT29F2G08ABAEAWP-IT:E
Micron Technology's MT29F2G08ABAEAWP-IT:E is a 256MX8 SLC NAND Flash Memory with 2K sectors and 100,000 Write/Erase cycles. Operating at 3.3V, it offers industrial-grade reliability for applications requiring high endurance and fast data access. With a compact form factor of 18.4mm x 12mm and low standby current of 0.0001A, it is ideal for embedded systems in harsh environments.
MT29F16G08ABACAWP-ITZ:C
MT29F16G08ABACAWP-ITZ:C by Micron Technology is a 3.3V SLC NAND Flash Memory with 2GX8 organization, operating from -40 to 85 °C. It has a memory density of 17179869184 bit and is suitable for industrial applications requiring reliable, high-speed data storage in compact devices.
MT29F2G08ABAEAWP-IT:ETR
Micron Technology's MT29F2G08ABAEAWP-IT:ETR is a 256MX8 SLC NAND flash memory with 2K sectors and 100,000 write/erase cycles. Operating at 3.3V, it offers industrial-grade temperature range (-40 to 85°C) for applications requiring high endurance and reliability in small outline packages.
MT29F1G08ABAEAWP-IT:E
Micron Technology's MT29F1G08ABAEAWP-IT:E is a 3.3V SLC NAND Flash Memory with 128Mx8 organization, operating from -40 to 85°C. It features a small outline package, parallel interface, and industrial temperature grade suitable for various embedded applications.
MT29F8G08ABABAWP-IT:B
Micron Technology's MT29F8G08ABABAWP-IT:B is a 3.3V SLC NAND flash memory with 1GX8 organization, 2K sectors, and 4K page size. It operates in industrial temperatures (-40 to 85 °C) with 100000 write/erase cycles endurance. Ideal for applications requiring high-density parallel memory storage.
MT29F8G08ABABAWP-ITX:B
Micron Technology's MT29F8G08ABABAWP-ITX:B is an 8Gb SLC NAND flash memory with 3.3V supply voltage, operating from -40 to 85°C. It has a memory density of 8.58 Gb and is suitable for industrial applications requiring high reliability and performance in a surface-mount package.
MT29F128G08AJAAAWP-ITZ:A
Micron Technology's MT29F128G08AJAAAWP-ITZ:A is a 3.3V MLC NAND Flash Memory with 16GX8 organization, operating from -40 to 85 °C. It has a memory density of 137.4Gb and is suitable for industrial applications requiring high-speed parallel data storage.
MT29F2G16ABAEAWP:ETR
Micron Technology's MT29F2G16ABAEAWP:ETR is a 3.3V SLC NAND flash memory with 128Mx16 organization and 2147483648-bit memory density. Operating in asynchronous mode, it has a temperature range of 0-70°C and is suitable for commercial applications requiring high-speed parallel memory access.
MT29F16G08ABACAWP-AAT:C
FLASH; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Screening Level: AEC-Q100; Organization: 2GX8;
MT29F1G08ABADAWP-IT:D
Micron Technology's MT29F1G08ABADAWP-IT:D is a 3.3V SLC NAND flash memory with 128Mx8 organization, operating in industrial temperature range. It features 2K page size, 128K sector size, and parallel interface. Ideal for applications requiring fast access times and high memory density.
MT29F1G08ABADAWP-ITX:D
Micron Technology's MT29F1G08ABADAWP-ITX:D is a 128Mx8 SLC NAND flash memory with 3.3V programming voltage, operating in industrial temperature range. It features 2K page size, 128K sector size, and parallel interface. Ideal for applications requiring high-speed data storage and retrieval in harsh environments.
MT29F4G08ABADAWP-IT:D
MT29F4G08ABADAWP-IT:D by Micron Technology is a 512MX8 SLC NAND flash memory with 3.3V programming voltage and 2K page size. Ideal for industrial applications, it offers fast access time of 25ns, low standby current of 0.0001A, and operates in a temperature range from -40 to 85°C.
MT29F1G08ABADAWP-ITX:DTR
Micron Technology's MT29F1G08ABADAWP-ITX:DTR is a 128MX8 SLC NAND flash memory with 1073741824 bit density. Operating at 3.3V, it has an industrial temperature grade and supports asynchronous mode. This rectangular package with 48 terminals is suitable for various applications requiring high-speed parallel memory access.
MT29F2G01ABAGDWB-IT:GTR
FLASH; Programming Voltage (V): 3.3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Type: SLC NAND TYPE;
MT29F8G08ABACAWP-IT:CTR
MT29F8G08ABACAWP-IT:CTR by Micron Technology is a 3.3V SLC NAND flash memory with 1GX8 organization, offering 8K sectors and 2K page size. Operating in industrial temperature range (-40 to 85 °C), it has a max endurance of 100k cycles. Ideal for applications requiring high-density, reliable storage solutions.
MT29F128G08AJAAAWP-ITZ:ATR
FLASH; Type: MLC NAND TYPE; Programming Voltage (V): 2.7; JESD-609 Code: e3; Terminal Finish: MATTE TIN;
MT29F2G08ABAEAH4-IT:E
MT29F2G08ABAEAH4-IT:E by Micron Technology is a 256MX8 SLC NAND flash memory with a capacity of 2GB. It operates at a voltage of 3.3V and has an industrial temperature grade. This flash memory is suitable for applications that require high-speed data storage and retrieval in harsh environments.
MT29F2G08ABAGAWP-IT:G
Micron Technology's MT29F2G08ABAGAWP-IT:G is an industrial-grade SLC NAND flash memory with 256Mx8 organization, operating from -40 to 85°C. It offers a memory density of 2147483648 bits and operates in asynchronous mode. Ideal for applications requiring high reliability and performance in harsh environments.
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