Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT28FW512ABA1LPC-0AAT
Micron Technology
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.4 mm;
105 ns
R-PBGA-B64
13 mm
536870912 bit
FLASH
16
1
64
33554432 words
32M
ASYNCHRONOUS
105 Cel
-40 Cel
32MX16
PLASTIC/EPOXY
LBGA
RECTANGULAR
GRID ARRAY, LOW PROFILE
PARALLEL
NOT SPECIFIED
3
AEC-Q100
1.4 mm
3.6 V
2.7 V
YES
CMOS
INDUSTRIAL
BALL
1 mm
BOTTOM
11 mm
M29W640GB70N3E
FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Boot Block: BOTTOM;
70 ns
8
R-PDSO-G48
18.4 mm
67108864 bit
48
4194304 words
4M
125 Cel
4MX16
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.2 mm
AUTOMOTIVE
GULL WING
.5 mm
DUAL
NOR TYPE
12 mm
M58LT128KSB7ZA6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Type: NOR TYPE;
134217728 bit
8388608 words
8M
SYNCHRONOUS
85 Cel
8MX16
TBGA
GRID ARRAY, THIN PROFILE
1.8
2 V
1.7 V
10 mm
M58LT128KST8ZA6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 2 V;
85 ns
TOP
N25Q032A13EF840E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;
108 MHz
20
100000 Write/Erase Cycles
R-PDSO-N8
8 mm
33554432 bit
4MX8
HVSON
SOLCC8,.3
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SERIAL
3/3.3
Not Qualified
SPI
.0001 Amp
Flash Memories
20 mA
NO LEAD
1.27 mm
6 mm
HARDWARE/SOFTWARE
N25Q032A13EF440F
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
4 mm
3-STATE
SOLCC8,.12
.6 mm
.8 mm
3 mm
MTFDDAK120MBP-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Memory Width: 8; Type: MLC NAND TYPE;
LENGTH_MAX
R-XSMA-X22
100.5 mm
1030792151040 bit
FLASH MODULE
22
128849018880 words
120G
70 Cel
0 Cel
120GX8
UNSPECIFIED
MICROELECTRONIC ASSEMBLY
5
7.2 mm
5.5 V
4.5 V
NO
COMMERCIAL
SINGLE
MLC NAND TYPE
69.85 mm
MTFDDAK240MBP-1AN16ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Command User Interface: NO;
R-XXFM-X22
100.45 mm
2061584302080 bit
257698037760 words
240G
240GX8
XFM
FLANGE MOUNT
7 mm
MTFDDAK240MBP-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Memory Width: 8;
MTFDDAK480MBP-1AN16ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Length: 100.45 mm;
4123168604160 bit
515396075520 words
480G
480GX8
MTFDDAK480MBP-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL; Package Body Material: UNSPECIFIED;
MTFDDAK800MBP-1AN16ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; No. of Words Code: 800G;
6871947673600 bit
858993459200 words
800G
800GX8
MTFDDAK960MBP-1AN16ABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Programming Voltage (V): 5;
8246337208320 bit
1030792151040 words
960G
960GX8
MTFDDAK960MBP-1AN1ZABYY
FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V; Parallel or Serial: PARALLEL;
M45PE40S-VMN6P
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
75 MHz
R-PDSO-G8
4.9 mm
2097152 bit
262144 words
256K
256KX8
SOP
SMALL OUTLINE
2.7
1.75 mm
3.9 mm
NAND512W3A2SZA6E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
35 ns
R-PBGA-B63
e2
4K
63
67108864 words
64M
64MX8
TFBGA
BGA63,10X12,32
GRID ARRAY, THIN PROFILE, FINE PITCH
512
260
1.05 mm
16K
.00005 Amp
TIN SILVER COPPER NICKEL
30
SLC NAND TYPE
9 mm
MT28EW01GABA1HPC-1SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
95 ns
1073741824 bit
64MX16
MT28EW01GABA1LPC-1SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
MT28EW512ABA1HPC-1SIT
MT28EW512ABA1LPC-1SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
MT28FW01GABA1HJS-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Width: 14 mm;
R-PDSO-G56
56
14 mm
MT28FW01GABA1HPC-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Technology: CMOS;
MT28FW01GABA1LJS-0AAT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Programming Voltage (V): 3;
RC48F4400P0TB00A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT
2.3 V
MT25QL128ABA1ESE-MSIT
Micron Technology's MT25QL128ABA1ESE-MSIT is a 16MX8 flash memory with 133 MHz clock frequency. Operating at 3.3V, it offers 16777216 words of memory density for industrial applications. With a small outline package and synchronous mode, it is ideal for high-speed data storage needs.
133 MHz
S-PDSO-G8
5.285 mm
16777216 words
16M
16MX8
SQUARE
3.3
2.16 mm
MT25QL128ABA1EW7-MSIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
5 mm
MT25QL128ABA8E12-1SIT
MT25QL128ABA8E12-1SIT by Micron Technology is a 16Mx8 NOR type flash memory with 133 MHz clock frequency. Operating at -40 to 85 °C, it offers 100000 write/erase cycles and SPI serial bus for industrial applications. With a thin profile of 1.2 mm, it has a max supply voltage of 3.6 V and supports hardware/software write protection.
R-PBGA-B24
e1
24
BGA24,5X5,40
35 mA
TIN SILVER COPPER
MT25QL128ABA8E14-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
BGA24,4X6,40
MT29F32G08AECCBH1-10:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm;
20 ns
R-PBGA-B100
18 mm
34359738368 bit
8K
100
4294967296 words
4G
4GX8
VBGA
BGA100,10X17,40
GRID ARRAY, VERY THIN PROFILE
512K
50 mA
MT29F32G08AFACAWP-IT:C
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
TSOP1
TSSOP48,.8,20
SMALL OUTLINE, THIN PROFILE
MT29F32G08AFACAWP:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
MT29F32G08AFACAWP-Z:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Words Code: 4G;
MT29F32G08AECCBH1-10Z:C
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B100;
MT29F16G08ABACAWP-Z:C
Micron Technology's MT29F16G08ABACAWP-Z:C is a 3.3V SLC NAND flash memory with 2GX8 organization, 4K page size, and 512K sector size. It operates synchronously at temperatures b/w 0-70°C and has a max access time of 20ns. Ideal for applications requiring high-speed data storage in compact devices.
17179869184 bit
2147483648 words
2G
2GX8
MT29F16G08ABCCBH1-10ITZ:C
MT29F16G08ABCCBH1-10ITZ:C by Micron Technology is a 3.3V SLC NAND flash memory with 2GX8 organization, 4K page size, and 512K sector size. It operates synchronously in industrial temperatures, featuring a parallel interface with 100 terminals. Ideal for applications requiring fast access times and high memory density.
MT29F8G08ABABAWP:B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G48;
10
8589934592 bit
2K
1073741824 words
1G
1GX8
MTFDDAK120MBD-1AK12ITYY
FLASH MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
MT25QU256ABA8ESF-MSIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 7.5 mm;
166 MHz
R-PDSO-G16
10.3 mm
268435456 bit
268435456 words
256M
256MX1
2.65 mm
7.5 mm
MTFC4GACAJCN-4MIT
MTFC4GACAJCN-4MIT by Micron Technology is a 4GX8 MLC NAND flash memory with 34359738368 bit density. Operating at -40 to 85 °C, it has a clock frequency of 52 MHz and supports parallel interface. Ideal for industrial applications requiring high-speed data storage in compact devices.
52 MHz
R-PBGA-B153
FLASH CARD
153
VFBGA
BGA153,14X14,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
11.5 mm
MTFC8GAKAJCN-4MIT
MTFC8GAKAJCN-4MIT by Micron Technology is a 8GX8 MLC NAND flash memory with 52 MHz clock frequency. It operates in industrial temperature range (-40 to 85 °C) and has a memory density of 68719476736 bit. Ideal for applications requiring high-speed data storage in compact devices.
68719476736 bit
8589934592 words
8G
8GX8
MT25QL512ABB8E12-1SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B24;
536870912 words
512M
512MX1
RC28F640P30BF65A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
65 ns
4,63
BGA64,8X8,40
1.8,1.8/3.3
16K,64K
.000055 Amp
N25Q256A81ESF40G
Micron Technology's N25Q256A81ESF40G is a 256Mbit flash memory with synchronous operation, 108MHz clock frequency, and 1.8V programming voltage. Ideal for industrial applications requiring high-speed data storage in compact devices due to its small outline package and wide operating temperature range from -40°C to 85°C.
PC28F00AG18AE
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
96 ns
128K
.000185 Amp
55 mA
MT28EW128ABA1HPC-1SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
Tin/Silver/Copper (Sn/Ag/Cu)
MT28EW128ABA1HPN-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
R-PBGA-B56
MT28EW128ABA1LPN-0SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
MT28EW256ABA1HPC-1SIT
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; No. of Words Code: 16M;
16MX16
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