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XAM3517ZCN

Texas Instruments

XAM3517ZCN by Texas Instruments

XAM3517ZCN by Texas Instruments is a 32-bit microprocessor with integrated cache, featuring a 16-bit address and external data bus width. It operates at a max clock frequency of 26 MHz and supports low power mode, making it ideal for applications requiring high-speed processing in compact devices.

Median Price

$19.420

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,112 parts In-Stock

1+ parts

$19.420

100+ parts

$19.030

1k+ parts

$18.640

10k+ parts

-

1,112

$19.420

$19.030

$18.640

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 140 parts In-Stock

1+ parts

$22.200

100+ parts

$19.638

1k+ parts

$18.786

10k+ parts

-

140

$22.200

$19.638

$18.786

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Vyrian

USA . 6,982 parts In-Stock

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-

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6,982

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Digiode

USA . 1,343 parts In-Stock

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1,343

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ComSIT Distribution GmbH

Germany . 8 parts In-Stock

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8

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Distributors (Availability)

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$11.140

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-

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896

$11.140

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One Stop Electronics

USA . 1,399 parts In-Stock

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$19.000

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1,399

$19.000

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Parana Technologies

USA . 1,769 parts In-Stock

1+ parts

$45.296

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-

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1,769

$45.296

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DigiPath Technology Company

USA . 1,322 parts In-Stock

1+ parts

$49.876

100+ parts

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1,322

$49.876

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ChromeModa Solutions

Germany . 4,952 parts In-Stock

1+ parts

$50.894

100+ parts

$41.733

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-

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4,952

$50.894

$41.733

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IDEA Electronic Components Group

UK . 1,711 parts In-Stock

1+ parts

$50.894

100+ parts

$48.349

1k+ parts

$45.805

10k+ parts

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1,711

$50.894

$48.349

$45.805

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 5,126 parts In-Stock

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Corphita

USA . 4,742 parts In-Stock

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4,742

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Perfect Parts

USA . 362 parts In-Stock

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362

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Microchip USA

USA . 285 parts In-Stock

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285

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Kepictronics

USA . 46 parts In-Stock

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46

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Overview

Experience the power of cutting-edge technology with the XAM3517ZCN microprocessor by Texas Instruments. With integrated cache and a 32-bit architecture, this high-performance chip offers unparalleled speed and efficiency for a wide range of applications. From IoT devices to industrial automation systems, this versatile processor delivers outstanding performance and reliability. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects to new heights with the XAM3517ZCN.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache allows for faster access to frequently used data, resulting in improved performance and efficiency.

Bit Size: 32

A 32-bit architecture allows for handling larger amounts of data in one instruction cycle, leading to faster processing speeds.

Maximum Clock Frequency: 26 MHz

A high maximum clock frequency of 26 MHz enables swift execution of instructions, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various environments.

Speed: 600 rpm

The speed of 600 rotations per minute ensures efficient operation, especially in applications requiring fast processing and data transfer.

Technical Specifications

Microprocessors XAM3517ZCN attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B491

Length:

17 mm

Low Power Mode:

YES

No. of Terminals:

491

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,1.8,1.8/3.3,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XAM3517ZCN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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