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UCD3138064RJAR

Texas Instruments

UCD3138064RJAR by Texas Instruments

UCD3138064RJAR by Texas Instruments is a Power Management IC with 3.3V supply voltage, 40 terminals, and -40 to 125°C operating temperature range. Ideal for automotive applications, it features a square package shape and nickel palladium gold silver terminal finish.

Median Price

$9.460

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,175 parts In-Stock

1+ parts

$8.433

100+ parts

$7.366

1k+ parts

$5.080

10k+ parts

-

19,175

$8.433

$7.366

$5.080

-

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$10.487

3,000

-

-

-

$10.487

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 976 parts In-Stock

1+ parts

$8.011

100+ parts

-

1k+ parts

-

10k+ parts

-

976

$8.011

-

-

-

Vyrian

USA . 850 parts In-Stock

1+ parts

$8.433

100+ parts

-

1k+ parts

-

10k+ parts

-

850

$8.433

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,056 parts In-Stock

1+ parts

$0.949

100+ parts

-

1k+ parts

$1.854

10k+ parts

-

2,056

$0.949

-

$1.854

-

IDEA Electronic Components Group

UK . 1,581 parts In-Stock

1+ parts

$1.066

100+ parts

-

1k+ parts

$0.959

10k+ parts

-

1,581

$1.066

-

$0.959

-

ChromeModa Solutions

Germany . 688 parts In-Stock

1+ parts

$1.066

100+ parts

$0.874

1k+ parts

-

10k+ parts

-

688

$1.066

$0.874

-

-

Semicontronic

India . 10,825 parts In-Stock

1+ parts

$7.170

100+ parts

$6.991

1k+ parts

$6.955

10k+ parts

-

10,825

$7.170

$6.991

$6.955

-

Corphita

USA . 4,055 parts In-Stock

1+ parts

$7.590

100+ parts

-

1k+ parts

-

10k+ parts

-

4,055

$7.590

-

-

-

Corohmni

South Africa . 236 parts In-Stock

1+ parts

$8.433

100+ parts

-

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-

10k+ parts

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236

$8.433

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 6,720 parts In-Stock

1+ parts

-

100+ parts

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-

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6,720

-

-

-

-

DigiPath Technology Company

USA . 1,015 parts In-Stock

1+ parts

-

100+ parts

$0.961

1k+ parts

-

10k+ parts

-

1,015

-

$0.961

-

-

Lixinc

USA . 814 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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814

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-

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Overview

Discover the power of the UCD3138064RJAR by Texas Instruments, a high-quality Power Management IC that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this chip carrier is perfect for automotive applications with its wide operating temperature range and superior terminal finish. With 8 channels and outputs, this IC provides efficient power supply management while maintaining a compact design. Trust in Texas Instruments to deliver cutting-edge technology that exceeds customer expectations.

Feature Benefit Bullets

Package Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Allows for easy installation and reduces manufacturing costs.

Nominal Supply Voltage (Vsup): 3.3 V

Matches common power requirements in many electronic devices.

Maximum Operating Temperature: 125 °C

Ensures stable operation even in high-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides good conductivity and corrosion resistance for reliable connections.

Width (mm): 6 mm

Compact size allows for space-saving designs.

Minimum Supply Voltage (Vsup): 3 V

Supports a wide range of input voltages for flexibility in design.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature variations are common.

Maximum Supply Current (Isup): 100 mA

Able to handle moderate power requirements efficiently.

No. of Channels: 8

Provides multiple output channels for versatile power management capabilities.

Technical Specifications

Power Management ICs UCD3138064RJAR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

8

No. of Functions:

1

No. of Outputs:

8

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

UCD3138064RJAR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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