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UCD3138064ARGCR

Texas Instruments

UCD3138064ARGCR by Texas Instruments

UCD3138064ARGCR by Texas Instruments is a 64-terminal Power Management IC with 3.3V supply voltage, suitable for automotive applications. It features CMOS technology, operates b/w -40 to 125 °C, and has 8 outputs. The chip carrier package style with a very thin profile makes it ideal for surface mount assembly in compact designs.

Median Price

$8.433

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,557 parts In-Stock

1+ parts

$8.433

100+ parts

$7.366

1k+ parts

$5.080

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7,557

$8.433

$7.366

$5.080

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Distributors (In-Stock)

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Digiode

USA . 2,162 parts In-Stock

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$8.011

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2,162

$8.011

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Bristol Electronics

USA . 50 parts In-Stock

1+ parts

$9.600

100+ parts

$7.008

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50

$9.600

$7.008

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Chip Stock

USA . 9,430 parts In-Stock

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9,430

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Vyrian

USA . 8,902 parts In-Stock

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8,902

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Cyclops Electronics Ltd

UK . 245 parts In-Stock

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245

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Microfarads

USA . 48 parts In-Stock

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48

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Distributors (Availability)

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Parana Technologies

USA . 1,912 parts In-Stock

1+ parts

$4.676

100+ parts

-

1k+ parts

$5.159

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1,912

$4.676

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$5.159

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DigiPath Technology Company

USA . 114 parts In-Stock

1+ parts

$5.149

100+ parts

$4.737

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114

$5.149

$4.737

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ChromeModa Solutions

Germany . 4,926 parts In-Stock

1+ parts

$5.254

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$4.308

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4,926

$5.254

$4.308

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IDEA Electronic Components Group

UK . 167 parts In-Stock

1+ parts

$5.254

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$4.729

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167

$5.254

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$4.729

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Corphita

USA . 957 parts In-Stock

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$7.590

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957

$7.590

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AZTECH Wire

Italy . 1,031 parts In-Stock

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$8.570

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$8.570

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Microchip USA

USA . 2,977 parts In-Stock

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$30.686

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$30.686

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Lixinc

USA . 9,002 parts In-Stock

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9,002

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Overview

Experience superior power management with the UCD3138064ARGCR by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that are ideal for a wide range of applications. This chip carrier, heat sink/slug, very thin profile package offers 64 terminals and a nominal supply voltage of 3.3V. With features like a wide operating temperature range, no lead terminal form, and automotive-grade temperature grade, this Power Supply Management Circuit provides unmatched performance and efficiency. Upgrade your power management system today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

The surface mount design allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage is ideal for compatibility with a wide range of electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can function well even in challenging environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency of the product.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the product is suitable for use in automotive applications, ensuring reliability under varying temperature conditions.

Technical Specifications

Power Management ICs UCD3138064ARGCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

8

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

105 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9 mm

Trade Compliance

UCD3138064ARGCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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