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UCD3138RHAT

Texas Instruments

UCD3138RHAT by Texas Instruments

UCD3138RHAT by Texas Instruments is a Power Management IC with 8 outputs. It operates in temperatures ranging from -40 to 125°C, making it suitable for automotive applications. This chip carrier has a very thin profile and is surface mountable, with a terminal pitch of 0.5mm.

Median Price

$11.190

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,017 parts In-Stock

1+ parts

$12.512

100+ parts

$10.200

1k+ parts

$6.800

10k+ parts

-

1,017

$12.512

$10.200

$6.800

-

Mouser Electronics

USA . 199 parts In-Stock

1+ parts

$14.820

100+ parts

$10.080

1k+ parts

$9.310

10k+ parts

-

199

$14.820

$10.080

$9.310

-

Rochester

USA . 776 parts In-Stock

1+ parts

-

100+ parts

$8.500

1k+ parts

$7.610

10k+ parts

$7.160

776

-

$8.500

$7.610

$7.160

DigiKey

USA . 776 parts In-Stock

1+ parts

-

100+ parts

$11.190

1k+ parts

-

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776

-

$11.190

-

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Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$10.625

1k+ parts

$9.512

10k+ parts

$8.950

500

-

$10.625

$9.512

$8.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,560 parts In-Stock

1+ parts

$8.968

100+ parts

-

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2,560

$8.968

-

-

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Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$9.387

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-

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85

$9.387

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Vyrian

USA . 3,315 parts In-Stock

1+ parts

-

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3,315

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-

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DigiKey Marketplace

USA . 776 parts In-Stock

1+ parts

-

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776

-

-

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Inventory MP

USA . 472 parts In-Stock

1+ parts

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472

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Bristol Electronics

USA . 472 parts In-Stock

1+ parts

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472

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Distributors (Availability)

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Ampacity Inc.

Singapore . 174 parts In-Stock

1+ parts

$8.020

100+ parts

-

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174

$8.020

-

-

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Corphita

USA . 4,407 parts In-Stock

1+ parts

$8.496

100+ parts

-

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4,407

$8.496

-

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$9.199

100+ parts

-

1k+ parts

$8.831

10k+ parts

-

1,000

$9.199

-

$8.831

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Continental Prestige Electronics

USA . 518 parts In-Stock

1+ parts

$9.387

100+ parts

-

1k+ parts

-

10k+ parts

$9.199

518

$9.387

-

-

$9.199

Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

$16.246

100+ parts

-

1k+ parts

$16.558

10k+ parts

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2,091

$16.246

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$16.558

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Corohmni

South Africa . 543 parts In-Stock

1+ parts

$17.349

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543

$17.349

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DigiPath Technology Company

USA . 87 parts In-Stock

1+ parts

$17.889

100+ parts

$16.458

1k+ parts

-

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87

$17.889

$16.458

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-

ChromeModa Solutions

Germany . 2,293 parts In-Stock

1+ parts

$18.254

100+ parts

$14.968

1k+ parts

-

10k+ parts

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2,293

$18.254

$14.968

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IDEA Electronic Components Group

UK . 1,350 parts In-Stock

1+ parts

$18.254

100+ parts

$17.341

1k+ parts

$16.429

10k+ parts

-

1,350

$18.254

$17.341

$16.429

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Lixinc

USA . 17,005 parts In-Stock

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17,005

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,066 parts In-Stock

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6,066

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Perfect Parts

USA . 5,065 parts In-Stock

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5,065

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Argo Parts USA

USA . 2,602 parts In-Stock

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2,602

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Overview

Enhance your power management systems with the UCD3138RHAT from Texas Instruments. This high-quality Power Management IC offers unparalleled reliability and efficiency, making it the perfect choice for a wide range of applications in automotive and industrial settings. With advanced features and a compact design, this chip carrier package delivers exceptional performance while ensuring maximum safety and control. Upgrade your power supply management circuit today with the UCD3138RHAT and experience the difference in quality and performance that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable, this Power Management IC is easy to install and saves space on the PCB.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this Power Management IC can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity in the circuit, simplifying the design and assembly process.

Width (mm): 6 mm

With a compact width of 6mm, this Power Management IC can be easily integrated into space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this Power Management IC meets the stringent requirements for temperature and performance in vehicles.

No. of Outputs: 8

With 8 outputs, this Power Management IC can efficiently distribute power to multiple components in a system, enhancing overall functionality.

Technical Specifications

Power Management ICs UCD3138RHAT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

UCD3138RHAT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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