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UCD3138RJAR

Texas Instruments

UCD3138RJAR by Texas Instruments

UCD3138RJAR by Texas Instruments is a Power Management IC with 3.3V supply voltage, 40 terminals, and 8 outputs. It operates in automotive-grade temperature range (-40 to 125°C) and is suitable for power supply management circuits in surface-mount applications. Package style includes chip carrier with very thin profile for compact designs.

Median Price

$7.360

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,651 parts In-Stock

1+ parts

$7.360

100+ parts

$6.000

1k+ parts

$4.000

10k+ parts

-

19,651

$7.360

$6.000

$4.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,458 parts In-Stock

1+ parts

$6.992

100+ parts

-

1k+ parts

-

10k+ parts

-

2,458

$6.992

-

-

-

Chip Stock

USA . 28,100 parts In-Stock

1+ parts

-

100+ parts

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28,100

-

-

-

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Vyrian

USA . 7,163 parts In-Stock

1+ parts

-

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-

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7,163

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 19,257 parts In-Stock

1+ parts

$6.260

100+ parts

-

1k+ parts

-

10k+ parts

-

19,257

$6.260

-

-

-

Semicontronic

India . 19,157 parts In-Stock

1+ parts

$6.260

100+ parts

$6.104

1k+ parts

$6.072

10k+ parts

-

19,157

$6.260

$6.104

$6.072

-

Corphita

USA . 4,895 parts In-Stock

1+ parts

$6.624

100+ parts

-

1k+ parts

-

10k+ parts

-

4,895

$6.624

-

-

-

Corohmni

South Africa . 125 parts In-Stock

1+ parts

$7.360

100+ parts

-

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10k+ parts

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125

$7.360

-

-

-

Parana Technologies

USA . 651 parts In-Stock

1+ parts

$7.598

100+ parts

-

1k+ parts

$8.109

10k+ parts

-

651

$7.598

-

$8.109

-

ChromeModa Solutions

Germany . 6,985 parts In-Stock

1+ parts

$8.537

100+ parts

$7.000

1k+ parts

-

10k+ parts

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6,985

$8.537

$7.000

-

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IDEA Electronic Components Group

UK . 1,346 parts In-Stock

1+ parts

$8.537

100+ parts

$8.110

1k+ parts

$7.683

10k+ parts

-

1,346

$8.537

$8.110

$7.683

-

AZTECH Wire

Italy . 611 parts In-Stock

1+ parts

$12.340

100+ parts

-

1k+ parts

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611

$12.340

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-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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Lixinc

USA . 8,331 parts In-Stock

1+ parts

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8,331

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A-Z Elektronik GmbH

Germany . 6,568 parts In-Stock

1+ parts

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6,568

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Kepictronics

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

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500

-

-

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DigiPath Technology Company

USA . 328 parts In-Stock

1+ parts

-

100+ parts

$7.697

1k+ parts

-

10k+ parts

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328

-

$7.697

-

-

Overview

Elevate your power management game with the UCD3138RJAR by Texas Instruments. Crafted with precision and expertise, this Power Management IC promises top-notch quality and reliability. Ideal for a wide range of applications, this chip carrier offers eight outputs to cater to all your power supply management needs. With a sleek and compact design, this automotive-grade IC ensures optimal performance in any environment. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Experience the difference with the UCD3138RJAR and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power Management IC, making it long-lasting and reliable.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated into PCBs, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a stable supply voltage of 3.3V ensures consistent performance and reliability in various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand demanding thermal conditions without compromising performance.

No. of Terminals: 40

Having a high number of terminals allows for multiple connections and functionalities, increasing the versatility of the Power Management IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink, and very thin profile package styles ensures efficient heat dissipation and compact design, suitable for space-constrained applications.

Width (mm): 6 mm

The compact width of 6mm enables easy integration into smaller devices or PCBs, saving valuable space and allowing for more flexible layouts.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources, making this IC versatile and adaptable to different systems.

Temperature Grade: AUTOMOTIVE

Being rated for automotive use indicates that this Power Management IC meets the stringent quality and reliability standards required for automotive applications, ensuring safety and performance in vehicles.

Maximum Seated Height: 1 mm

With a low seated height of 1mm, this IC can be easily accommodated in compact spaces, making it suitable for small electronic devices or applications with limited clearance.

Technical Specifications

Power Management ICs UCD3138RJAR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

8

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

UCD3138RJAR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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