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UCD3138064RMHR

Texas Instruments

UCD3138064RMHR by Texas Instruments

UCD3138064RMHR by Texas Instruments is a Power Management IC with 3.3V supply voltage, 40 terminals, and 8 outputs. It is used in automotive applications due to its high operating temperature range of -40 to 125°C and compact square package design for surface mounting.

Median Price

$8.433

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,607 parts In-Stock

1+ parts

$8.433

100+ parts

$7.366

1k+ parts

$5.080

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8,607

$8.433

$7.366

$5.080

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Distributors (In-Stock)

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Digiode

USA . 3,374 parts In-Stock

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$8.011

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3,374

$8.011

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Chip Stock

USA . 21,500 parts In-Stock

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21,500

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Vyrian

USA . 4,797 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,343 parts In-Stock

1+ parts

$2.050

100+ parts

-

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$2.571

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2,343

$2.050

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$2.571

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DigiPath Technology Company

USA . 2,309 parts In-Stock

1+ parts

$2.257

100+ parts

$2.076

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2,309

$2.257

$2.076

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ChromeModa Solutions

Germany . 6,691 parts In-Stock

1+ parts

$2.303

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$1.888

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6,691

$2.303

$1.888

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IDEA Electronic Components Group

UK . 605 parts In-Stock

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$2.303

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$2.073

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605

$2.303

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$2.073

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Semicontronic

India . 8,433 parts In-Stock

1+ parts

$7.170

100+ parts

$6.991

1k+ parts

$6.955

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8,433

$7.170

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$6.955

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Ampacity Inc.

Singapore . 8,148 parts In-Stock

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$7.170

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Corphita

USA . 3,487 parts In-Stock

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$7.590

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3,487

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Corohmni

South Africa . 114 parts In-Stock

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$8.433

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114

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AZTECH Wire

Italy . 628 parts In-Stock

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$14.640

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628

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,053 parts In-Stock

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Kepictronics

USA . 3,578 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Overview

Enhance your power management capabilities with the UCD3138064RMHR by Texas Instruments. Manufactured by a trusted leader in the industry, this Power Management IC offers unrivaled quality and reliability. Ideal for a wide range of applications, this chip carrier with a very thin profile provides 8 outputs to optimize your power supply management circuit. With a nominal supply voltage of 3.3V and a wide operating temperature range, this product ensures peak performance in automotive settings. Upgrade your system with the UCD3138064RMHR and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the Power Management IC.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3 V is a common standard in many electronic devices, making this Power Management IC compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this Power Management IC can withstand high temperature environments and ensure stable performance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows this Power Management IC to function in cold conditions without any performance issues.

No. of Outputs: 8

With 8 outputs, this Power Management IC can efficiently manage and distribute power to multiple components, making it suitable for complex electronic systems.

Technical Specifications

Power Management ICs UCD3138064RMHR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

8

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

UCD3138064RMHR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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