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TLF35584QVVS2XUMA1

Infineon Technologies

TLF35584QVVS2XUMA1 by Infineon Technologies

Infineon's TLF35584QVVS2XUMA1 is a Power Management IC in a 48-terminal chip carrier package. With an operating temperature range of -40 to 150°C, it is ideal for automotive applications. This IC features no-lead terminals and is designed for power supply management circuits.

Median Price

$5.388

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,388 parts In-Stock

1+ parts

$2.469

100+ parts

$2.319

1k+ parts

$2.206

10k+ parts

-

1,388

$2.469

$2.319

$2.206

-

Chip1Stop

Japan . 2,012 parts In-Stock

1+ parts

$7.116

100+ parts

-

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-

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2,012

$7.116

-

-

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DigiKey

USA . 10 parts In-Stock

1+ parts

$9.540

100+ parts

-

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10

$9.540

-

-

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Rochester

USA . 368,324 parts In-Stock

1+ parts

-

100+ parts

$4.310

1k+ parts

$3.860

10k+ parts

$3.630

368,324

-

$4.310

$3.860

$3.630

Verical

USA . 368,027 parts In-Stock

1+ parts

-

100+ parts

$5.388

1k+ parts

$4.825

10k+ parts

$4.537

368,027

-

$5.388

$4.825

$4.537

Avnet

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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1,500

-

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 379 parts In-Stock

1+ parts

$4.570

100+ parts

-

1k+ parts

-

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379

$4.570

-

-

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Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$7.316

100+ parts

-

1k+ parts

-

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37

$7.316

-

-

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Vyrian

USA . 8,141 parts In-Stock

1+ parts

-

100+ parts

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8,141

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-

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ComSIT Distribution GmbH

Germany . 2,645 parts In-Stock

1+ parts

-

100+ parts

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2,645

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Sternenhof Electronics

Switzerland . 2,470 parts In-Stock

1+ parts

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100+ parts

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2,470

-

-

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Avant Electronics Limited

UK . 1,424 parts In-Stock

1+ parts

-

100+ parts

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1,424

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Sensible Micro Corp

USA . 1,356 parts In-Stock

1+ parts

-

100+ parts

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1,356

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-

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Bristol Electronics

USA . 244 parts In-Stock

1+ parts

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244

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Lonics

Poland . 129 parts In-Stock

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129

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 93,294 parts In-Stock

1+ parts

$4.090

100+ parts

-

1k+ parts

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93,294

$4.090

-

-

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Semicontronic

India . 74,557 parts In-Stock

1+ parts

$4.090

100+ parts

$3.988

1k+ parts

$3.967

10k+ parts

-

74,557

$4.090

$3.988

$3.967

-

Corphita

USA . 316 parts In-Stock

1+ parts

$4.329

100+ parts

-

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10k+ parts

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316

$4.329

-

-

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Modulus Dynamics

Lithuania . 5,963 parts In-Stock

1+ parts

$5.143

100+ parts

$4.937

1k+ parts

$4.732

10k+ parts

-

5,963

$5.143

$4.937

$4.732

-

Corohmni

South Africa . 6 parts In-Stock

1+ parts

$5.143

100+ parts

-

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-

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6

$5.143

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$5.297

100+ parts

$5.032

1k+ parts

$5.032

10k+ parts

-

100

$5.297

$5.032

$5.032

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Continental Prestige Electronics

USA . 110 parts In-Stock

1+ parts

$6.541

100+ parts

-

1k+ parts

-

10k+ parts

$6.410

110

$6.541

-

-

$6.410

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.316

100+ parts

-

1k+ parts

$6.950

10k+ parts

$6.803

1,000

$7.316

-

$6.950

$6.803

Aztec Data Supply Inc.

USA . 2,990 parts In-Stock

1+ parts

$12.155

100+ parts

-

1k+ parts

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10k+ parts

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2,990

$12.155

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Argo Parts USA

USA . 4,952 parts In-Stock

1+ parts

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4,952

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Sternenhof Electronics (Excess)

Switzerland . 1,748 parts In-Stock

1+ parts

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1,748

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Microchip USA

USA . 420 parts In-Stock

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420

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Overview

Discover the TLF35584QVVS2XUMA1 by Infineon Technologies, a top-of-the-line Power Management IC designed for automotive applications. Crafted with precision and reliability in mind, this product offers unparalleled performance and efficiency. With a temperature grade suitable for automotive use, no lead terminal form, and a robust chip carrier package style, this Power Supply Management Circuit is the ideal choice for demanding environments. Trust Infineon Technologies to provide you with cutting-edge solutions that deliver value, benefits, and advantages to meet your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the internal components of the IC, making it durable and reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape enables efficient use of board space and aligning with modern compact electronic device designs.

No. of Terminals: 48

Having a higher number of terminals allows for more connections and functionalities within the IC, making it versatile for various power management tasks.

Package Style: CHIP CARRIER

Chip carrier package style is known for its compact size and good thermal performance, ensuring efficient heat dissipation for the IC.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range of 150°C makes this IC suitable for applications where temperature fluctuation is common, such as automotive or industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures the IC can function reliably even in extremely cold conditions, making it suitable for various outdoor or harsh environments.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections on the PCB, ensuring stable electrical connections and reducing the risk of signal interference.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC is specifically designed to efficiently regulate and control power distribution within a system, ensuring stable and reliable performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets strict automotive industry standards for temperature, performance, and reliability, making it a suitable choice for automotive power management systems.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of solder joint cracking and enhances the overall reliability of the IC, making it ideal for applications where vibration or mechanical stress may be present.

Technical Specifications

Power Management ICs TLF35584QVVS2XUMA1 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N48

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TLF35584QVVS2XUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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