Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Infineon's TLF35584QVVS2XUMA1 is a Power Management IC in a 48-terminal chip carrier package. With an operating temperature range of -40 to 150°C, it is ideal for automotive applications. This IC features no-lead terminals and is designed for power supply management circuits.
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$4.570
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Ampacity Inc.
$4.090
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$3.988
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$4.329
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$6.541
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$6.950
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$12.155
Argo Parts USA
Futuretech Components
Authorized Procurement Solutions
Sternenhof Electronics (Excess)
Microchip USA
Plastic/epoxy material provides good insulation and protection for the internal components of the IC, making it durable and reliable for long-term use.
Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.
Square package shape enables efficient use of board space and aligning with modern compact electronic device designs.
Having a higher number of terminals allows for more connections and functionalities within the IC, making it versatile for various power management tasks.
Chip carrier package style is known for its compact size and good thermal performance, ensuring efficient heat dissipation for the IC.
High maximum operating temperature range of 150°C makes this IC suitable for applications where temperature fluctuation is common, such as automotive or industrial environments.
Low minimum operating temperature of -40°C ensures the IC can function reliably even in extremely cold conditions, making it suitable for various outdoor or harsh environments.
Quad terminal position allows for easy and secure connections on the PCB, ensuring stable electrical connections and reducing the risk of signal interference.
Being a power supply management circuit, this IC is specifically designed to efficiently regulate and control power distribution within a system, ensuring stable and reliable performance.
Designed for automotive applications, this IC meets strict automotive industry standards for temperature, performance, and reliability, making it a suitable choice for automotive power management systems.
No lead terminal form reduces the risk of solder joint cracking and enhances the overall reliability of the IC, making it ideal for applications where vibration or mechanical stress may be present.
Power Management ICs TLF35584QVVS2XUMA1 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies
Adjustable Threshold:
Other IC type:
JESD-30 Code:
No. of Channels:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Surface Mount:
Temperature Grade:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
TLF35584QVVS2XUMA1 Other Function Semiconductors trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
1N4148
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Gec Plessey Semiconductors
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1554216002
Molex
WIRE AND CABLE;
Daco Semiconductor
Frontier Electronics
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rectron
Micropac Industries
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
FPF2104
FPF2104 by Onsemi is a Power Management IC with 5 terminals and a supply voltage range of 1.8V to 5.5V. It has a small outline package style, dual terminal position, and can operate b/w -40°C to 85°C. Ideal for power supply support circuits in various applications requiring compact design and surface mount compatibility.
LC709203FQH-01TWG
LC709203FQH-01TWG by Onsemi is a Power Management IC with 3.6V nominal voltage, 2.5/4.5V power supplies, and -40 to 85°C operating temperature range. It comes in a small outline package suitable for industrial applications requiring power supply support circuits.
LTC4357MPMS8#PBF
Analog Devices
LTC4357MPMS8#PBF by Analog Devices is a Power Management IC with 20V nominal voltage, -55 to 125°C operating temperature range, and 80V max supply voltage. It is used in power supply support circuits for military applications due to its small outline package and dual terminal position.
LM810M3-4.63
National Semiconductor
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSP762TXUMA1
Infineon Technologies
BSP762TXUMA1 by Infineon Technologies is a Power Management IC with 8 terminals, operating voltage range of 5-34V, and AEC-Q100 screening for automotive applications. It features SIPMOS technology, small outline package style, and can operate in temperatures ranging from -40 to 150°C. Ideal for power supply support circuits in automotive electronics.
TPS65381AQDAPRQ1
Texas Instruments
TPS65381AQDAPRQ1 by Texas Instruments is a Power Management IC with 32 terminals, operating at -40 to 125°C. It offers a max output voltage of 9.5V and current of 1.3A, suitable for automotive applications requiring power supply management circuits.
TPS2052BDRBR
TPS2052BDRBR by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and dual terminal position. It is used in power supply support circuits for industrial applications due to its small outline package style and wide operating temperature range from -40°C to 85°C.
PTPS25750DRJKT
PTPS25750DRJKT by Texas Instruments is a Power Management IC with 38 terminals, operating b/w -40°C to 125°C. It supports a nominal voltage of 3.3V and has an adjustable threshold feature. Ideal for automotive applications due to its temperature grade and surface mount capability in a rectangular package shape.
MMPF0100F9ANES
NXP Semiconductors
MMPF0100F9ANES by NXP Semiconductors is a Power Management IC with 56 terminals, operating b/w -40 to 105°C. It supports 14 channels, MOS technology, and has a supply voltage range of 2.8V to 4.5V. Ideal for industrial applications requiring precise power supply support in compact spaces.
MAX14690AEWX+
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 36; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC4417IGN#PBF
Linear Technology
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC2955ITS8-1#TRMPBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC4365IDDB#TRPBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;
TPS2051BDGNR
TPS2051BDGNR by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It is designed for industrial applications requiring a small outline package with surface mount capability and dual terminal position.
PAC1720-1-AIA-TR
Microchip Technology
Microchip Technology's PAC1720-1-AIA-TR is a Power Management IC with 10 terminals, supporting 3.3/5V supplies. It features TS 16949 screening, operates b/w -40 to 85°C, and has a small outline package style. Ideal for industrial applications requiring power supply support circuits.
LTC4365IDDB-1#PBF
LTC4162EUFD-LAD#PBF
Analog Devices' LTC4162EUFD-LAD#PBF is a Power Management IC with 28 terminals, operating b/w -40 to 125 °C. It supports supply voltages from 4.5V to 35V and features an adjustable threshold. Ideal for automotive applications due to its CMOS technology and compact chip carrier package style.
LM809M3-2.93/NOPB
TPS2051BDBVT
TPS2051BDBVT by Texas Instruments is a Power Management IC with 5 terminals, operating b/w -40 to 85°C. It supports supply voltages from 2.7V to 5.5V and has a max current of 0.07mA. Ideal for industrial applications requiring low profile packaging and surface mounting capabilities.
TPS2042BDRG4
TPS2042BDRG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 8 terminals, and dual terminal position. It is used in industrial applications for power supply support circuits due to its small outline package style and peak reflow temperature of 260°C.
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TLF35584QVVS1XUMA2
Infineon's TLF35584QVVS1XUMA2 is a 48-terminal Power Management IC in a square chip carrier package with tin finish. It is surface-mountable and suitable for power supply management circuits. The IC has a moisture sensitivity level of 3, making it ideal for various electronic applications.
TLF35584QVVS1XUMA1
POWER SUPPLY MANAGEMENT CIRCUIT;
TLF35584QVVS2XUMA2
Infineon's TLF35584QVVS2XUMA2 is a Power Management IC in a 48-terminal chip carrier package. With an operating temperature range of -40 to 150°C, it's ideal for automotive applications. This IC features tin terminal finish and is surface mountable, making it suitable for various power supply management circuits.
TLF35584QKVS1XUMA2
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;
TLF35584QKVS2XUMA2
Infineon's TLF35584QKVS2XUMA2 is a 64-terminal Power Management IC with a package style of Flatpack, suitable for power supply management circuits. It operates b/w 3-40V, has 24 channels, and features adjustable threshold levels. Ideal for applications requiring precise voltage regulation in compact spaces.
TLF35584QKVS1XUMA2/SAMPLE
TLF35584QVVS2XUMA1/SAMPLE
TLF35585QVS01
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Screening Level: AEC-Q100;
TLF35584QKVS2
TLF35584QKVS2 by Infineon Technologies is a Power Management IC with 64 terminals in a square package. It operates b/w -40 to 150°C, suitable for automotive applications. With a supply voltage range of 4-35V, it features nickel gold palladium silver terminal finish and gull wing form.
TLF30682QVS01XUMA1
POWER SUPPLY MANAGEMENT CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Tin (Sn); Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; JESD-609 Code: e3; Peak Reflow Temperature (C): NOT SPECIFIED;
TLF35584QVVS1
POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES;
TLF30681QVS01
Power Management Circuits; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN;
TLF30682QVS01
POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;
TLF35584QKVS1
POWER SUPPLY MANAGEMENT CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL GOLD PALLADIUM SILVER;
TLF35584QVHS1
TLF35584QVHS2
TLF35584QVVS2
TLF35585QUS02
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