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TLF35584QVVS1XUMA2

Infineon Technologies

TLF35584QVVS1XUMA2 by Infineon Technologies

Infineon's TLF35584QVVS1XUMA2 is a 48-terminal Power Management IC in a square chip carrier package with tin finish. It is surface-mountable and suitable for power supply management circuits. The IC has a moisture sensitivity level of 3, making it ideal for various electronic applications.

Median Price

$7.195

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,494 parts In-Stock

1+ parts

$6.720

100+ parts

$4.570

1k+ parts

$3.460

10k+ parts

-

3,494

$6.720

$4.570

$3.460

-

Chip1Stop

Japan . 1,288 parts In-Stock

1+ parts

$7.670

100+ parts

$4.800

1k+ parts

$4.770

10k+ parts

-

1,288

$7.670

$4.800

$4.770

-

DigiKey

USA . 23 parts In-Stock

1+ parts

$8.190

100+ parts

$4.329

1k+ parts

-

10k+ parts

$3.537

23

$8.190

$4.329

-

$3.537

Newark

USA . 4,166 parts In-Stock

1+ parts

$8.400

100+ parts

$4.440

1k+ parts

-

10k+ parts

-

4,166

$8.400

$4.440

-

-

Element14

Singapore . 4,449 parts In-Stock

1+ parts

$11.580

100+ parts

$6.120

1k+ parts

$5.880

10k+ parts

-

4,449

$11.580

$6.120

$5.880

-

RS (Exports)

UK . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.975

7,500

-

-

-

$3.975

EBV Elektronik

Germany . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

Verical

USA . 2,420 parts In-Stock

1+ parts

-

100+ parts

$4.400

1k+ parts

$3.938

10k+ parts

$3.712

2,420

-

$4.400

$3.938

$3.712

Rochester

USA . 2,420 parts In-Stock

1+ parts

-

100+ parts

$3.520

1k+ parts

$3.150

10k+ parts

$2.970

2,420

-

$3.520

$3.150

$2.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$6.115

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$6.115

-

-

-

Digiode

USA . 945 parts In-Stock

1+ parts

$6.546

100+ parts

-

1k+ parts

-

10k+ parts

-

945

$6.546

-

-

-

Chip Stock

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36,000

-

-

-

-

Vyrian

USA . 5,451 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,451

-

-

-

-

NAC Semi

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.600

5,000

-

-

-

$5.600

Rutronik

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.090

2,500

-

-

-

$4.090

ComSIT Distribution GmbH

Germany . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,475 parts In-Stock

1+ parts

$3.380

100+ parts

-

1k+ parts

-

10k+ parts

-

5,475

$3.380

-

-

-

Semicontronic

India . 5,019 parts In-Stock

1+ parts

$3.380

100+ parts

$3.296

1k+ parts

$3.279

10k+ parts

-

5,019

$3.380

$3.296

$3.279

-

Modulus Dynamics

Lithuania . 3,823 parts In-Stock

1+ parts

$5.143

100+ parts

$4.937

1k+ parts

$4.732

10k+ parts

-

3,823

$5.143

$4.937

$4.732

-

Corohmni

South Africa . 1,104 parts In-Stock

1+ parts

$5.143

100+ parts

-

1k+ parts

-

10k+ parts

-

1,104

$5.143

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$5.297

100+ parts

$5.032

1k+ parts

$5.032

10k+ parts

-

10

$5.297

$5.032

$5.032

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.115

100+ parts

$5.993

1k+ parts

-

10k+ parts

-

1,000

$6.115

$5.993

-

-

Corphita

USA . 137 parts In-Stock

1+ parts

$6.201

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$6.201

-

-

-

Continental Prestige Electronics

USA . 5,589 parts In-Stock

1+ parts

$8.810

100+ parts

$5.270

1k+ parts

$5.170

10k+ parts

-

5,589

$8.810

$5.270

$5.170

-

Aztec Data Supply Inc.

USA . 4,764 parts In-Stock

1+ parts

$13.255

100+ parts

-

1k+ parts

-

10k+ parts

-

4,764

$13.255

-

-

-

GreenTree Electronics

Israel . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 10,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,111

-

-

-

-

Argo Parts USA

USA . 4,686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,686

-

-

-

-

Robosynatics

Brazil . 4,419 parts In-Stock

1+ parts

-

100+ parts

$5.040

1k+ parts

$4.937

10k+ parts

$4.937

4,419

-

$5.040

$4.937

$4.937

Lucentia Tech

USA . 4,419 parts In-Stock

1+ parts

-

100+ parts

$5.040

1k+ parts

$4.937

10k+ parts

$4.937

4,419

-

$5.040

$4.937

$4.937

Microchip USA

USA . 4,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,376

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Experience unmatched quality and reliability with the TLF35584QVVS1XUMA2 by Infineon Technologies. As a leading manufacturer in the power management ICs category, Infineon Technologies delivers cutting-edge solutions for various applications. This product offers exceptional value to customers by providing efficient power supply management circuitry in a convenient chip carrier package. Trust Infineon Technologies for superior performance and innovation in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and durability, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

Square package shape is ideal for optimizing space utilization on PCBs and provides a stable mounting platform.

No. of Terminals: 48

With 48 terminals, the Power Management IC can accommodate multiple connections and functionalities, enhancing versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The chip carrier package style combined with a heat sink/slug design ensures efficient heat dissipation, enhancing the IC's performance and reliability.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable electrical connections.

Terminal Position: QUAD

Quad terminal position allows for easy and organized wiring connections, simplifying installation and maintenance.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC is designed to efficiently regulate and control power distribution, ensuring stable and reliable performance.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of short circuits and enhances the IC's robustness against mechanical stress.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC can withstand moderate exposure to moisture, increasing its reliability in humid or damp environments.

Technical Specifications

Power Management ICs TLF35584QVVS1XUMA2 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Additional Features:

PKG SHAPE: HTTPS://WWW.INFINEON.COM/CMS/EN/PRODUCT/PACKAGES/PG-VQFN/PG-VQFN-48-31/

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Trade Compliance

TLF35584QVVS1XUMA2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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