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TLF35584QKVS2

Infineon Technologies

TLF35584QKVS2 by Infineon Technologies

TLF35584QKVS2 by Infineon Technologies is a Power Management IC with 64 terminals in a square package. It operates b/w -40 to 150°C, suitable for automotive applications. With a supply voltage range of 4-35V, it features nickel gold palladium silver terminal finish and gull wing form.

Median Price

$4.140

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

TLF35584QKVS2 by Infineon Technologies
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 4,000 parts In-Stock

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Rutronik

Germany . 1,900 parts In-Stock

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$4.140

1,900

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$4.140

Cyclops Electronics Ltd

UK . 1,900 parts In-Stock

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1,900

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Vyrian

USA . 1,533 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Digiode

USA . 61 parts In-Stock

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61

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Conversion2

USA . 46 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 566 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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566

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 554 parts In-Stock

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$3.500

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554

$3.500

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Modulus Dynamics

Lithuania . 2,966 parts In-Stock

1+ parts

$16.366

100+ parts

$15.711

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$15.057

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2,966

$16.366

$15.711

$15.057

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AZTECH Wire

Italy . 563 parts In-Stock

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$16.576

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563

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Corohmni

South Africa . 198 parts In-Stock

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$17.095

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Perfect Parts

USA . 8,400 parts In-Stock

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Continental Prestige Electronics

USA . 5,592 parts In-Stock

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GreenTree Electronics

Israel . 4,301 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,800 parts In-Stock

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Argo Parts USA

USA . 1,379 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Corphita

USA . 688 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Elevate your power management solutions with the TLF35584QKVS2 by Infineon Technologies. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for automotive applications, this product is designed to optimize performance and efficiency in various electronic systems. With its innovative features and advanced technology, the TLF35584QKVS2 delivers exceptional value and benefits to customers, ensuring seamless operation and enhanced functionality. Upgrade your power management capabilities with this cutting-edge solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and reliability for long-term use.

Surface Mount

YES - Allows for easy installation and reduces overall footprint on PCB.

Package Shape

SQUARE - Offers efficient use of space for compact designs.

No. of Terminals

64 - Provides ample connectivity options for various applications.

Package Style

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH - Versatile package styles for different design requirements.

Maximum Operating Temperature

150 °C - Ensures stable performance in high temperature environments.

Minimum Operating Temperature

40 °C - Ideal for use in extreme cold conditions.

Terminal Finish

NICKEL GOLD PALLADIUM SILVER - Provides excellent conductivity and corrosion resistance.

Terminal Position

QUAD - Facilitates easy PCB layout and soldering.

Maximum Seated Height

1.6 mm - Helps in achieving a slim form factor design.

Width (mm)

10 mm - Compact size for space-constrained applications.

Other IC type

POWER SUPPLY MANAGEMENT CIRCUIT - Offers efficient power management solutions.

Minimum Supply Voltage (Vsup)

4 V - Allows operation in low voltage systems.

Length

10 mm - Compact dimensions for versatile placement options.

Temperature Grade

AUTOMOTIVE - Suitable for automotive applications with stringent temperature requirements.

Terminal Form

GULL WING - Facilitates easy soldering and PCB assembly.

Terminal Pitch

0.5 mm - Supports high-density PCB layouts for efficient use of space.

Moisture Sensitivity Level (MSL)

3 - Ensures the IC is protected from moisture during handling and storage.

Maximum Supply Voltage (Vsup)

35 V - Supports operation in systems with higher voltage requirements.

Technical Specifications

Power Management ICs TLF35584QKVS2 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

10 mm

Trade Compliance

TLF35584QKVS2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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