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TPS3103K33DBVRG4

Texas Instruments

TPS3103K33DBVRG4 by Texas Instruments

TPS3103K33DBVRG4 by Texas Instruments is a Power Management IC with a Nominal Voltage of 3.3V, suitable for industrial applications. It features a Max Operating Temperature of 85°C and Terminal Finish in Nickel Palladium Gold, making it ideal for power supply support circuits requiring low profile packaging.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,398 parts In-Stock

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$1.080

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$1.080

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.770

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10

$1.770

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Vyrian

USA . 6,292 parts In-Stock

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Chip Stock

USA . 4,580 parts In-Stock

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Digiode

USA . 246 parts In-Stock

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Semicontronic

India . 6,309 parts In-Stock

1+ parts

$0.920

100+ parts

$0.897

1k+ parts

$0.892

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6,309

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$0.892

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Ampacity Inc.

Singapore . 6,055 parts In-Stock

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$0.920

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6,055

$0.920

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Aranea Global

USA . 100 parts In-Stock

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$1.735

100+ parts

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$1.665

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100

$1.735

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$1.665

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Continental Prestige Electronics

USA . 562 parts In-Stock

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$1.770

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$1.735

562

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$1.735

Argo Parts USA

USA . 556 parts In-Stock

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$1.770

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556

$1.770

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Modulus Dynamics

Lithuania . 300 parts In-Stock

1+ parts

$1.965

100+ parts

$1.945

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$1.886

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300

$1.965

$1.945

$1.886

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Corohmni

South Africa . 46 parts In-Stock

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$11.499

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46

$11.499

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$16.810

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$15.969

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$15.969

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$16.810

$15.969

$15.969

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Parana Technologies

USA . 254 parts In-Stock

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$18.010

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$18.165

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254

$18.010

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$18.165

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ChromeModa Solutions

Germany . 4,394 parts In-Stock

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$20.236

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$16.594

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IDEA Electronic Components Group

UK . 526 parts In-Stock

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$20.236

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$19.224

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$18.212

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526

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A-Z Elektronik GmbH

Germany . 7,435 parts In-Stock

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Microchip USA

USA . 1,695 parts In-Stock

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Corphita

USA . 1,329 parts In-Stock

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Kepictronics

USA . 706 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$7.362

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$7.362

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$7.362

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$7.362

$7.362

$7.362

DigiPath Technology Company

USA . 278 parts In-Stock

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$18.245

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278

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Overview

Enhance the performance of your power management systems with the TPS3103K33DBVRG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers cutting-edge Power Management ICs that provide efficiency and precision in various applications. This small outline, low profile IC is ideal for industrial settings, offering a nominal supply voltage of 3.3V and a wide temperature range. With features like nickel palladium gold terminal finish and CMOS technology, this IC ensures optimal performance and longevity. Upgrade your power supply support circuit with the TPS3103K33DBVRG4 and experience unmatched value and benefits in your systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the IC, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration with other components, making the IC suitable for compact and space-constrained designs.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized design for easy handling and mounting, ensuring compatibility with different PCB layouts.

Nominal Supply Voltage (Vsup): 3.3 V

With a nominal supply voltage of 3.3V, this IC is ideal for applications that require stable and consistent power delivery within this voltage range.

Power Supplies (V): 0.4/3.3

The power supply range of 0.4V to 3.3V offers flexibility in operating voltage levels, making the IC suitable for a wide range of power supply configurations.

No. of Terminals: 6

The 6 terminals provide multiple connection points for interfacing with other components, enhancing versatility and compatibility in circuit designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style ensures compactness and space efficiency, making it suitable for compact devices and designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the IC can reliably function in industrial environments with elevated temperatures, increasing its applicability in various applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows the IC to withstand colder environments, ensuring consistent performance in a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for long-term performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and layout, allowing for various connection configurations and enhancing the versatility of the IC.

Maximum Seated Height: 1.45 mm

The maximum seated height of 1.45mm ensures a low-profile design for space-saving applications, making it suitable for compact electronic devices.

Width (mm): 1.6 mm

With a width of 1.6mm, the IC is compact and suitable for applications requiring a small form factor, making it a versatile choice for space-constrained designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is designed to enhance power management capabilities, making it a reliable choice for ensuring stable and efficient power delivery.

Minimum Supply Voltage (Vsup): 0.9 V

The minimum supply voltage of 0.9V allows the IC to operate efficiently at low voltage levels, making it suitable for power-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30s ensures efficient soldering and reliable assembly processes, providing ease of use for manufacturers.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the IC can withstand high-temperature soldering processes, ensuring robust solder joints and reliable connections.

Length: 2.9 mm

The length of 2.9mm provides a compact footprint for the IC, making it suitable for applications requiring space efficiency and a small form factor.

Nominal Threshold Voltage (V): +2.941V

The nominal threshold voltage of +2.941V ensures precise voltage level detection, making the IC suitable for applications where accurate voltage monitoring is essential.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC is designed to meet the rigorous demands of industrial applications, ensuring reliable performance in harsh operating conditions.

Maximum Supply Current (Isup): 0.027 mA

The maximum supply current of 0.027mA indicates low power consumption, making the IC suitable for energy-efficient designs and battery-powered applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the IC suitable for applications where power efficiency and reliability are essential.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable solder connections, making it easy to integrate the IC into circuit boards with consistent and durable electrical connections.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95mm, the IC offers compatibility with standard PCB layouts and facilitates easy assembly, making it a convenient choice for manufacturing processes.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, the IC can tolerate temporarily higher voltage levels, providing flexibility and protection against voltage spikes in the system.

Technical Specifications

Power Management ICs TPS3103K33DBVRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.941V; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.4/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.027 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.941V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS3103K33DBVRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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