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TLF35585QVS01

Infineon Technologies

TLF35585QVS01 by Infineon Technologies

Infineon's TLF35585QVS01 is a Power Management IC with AEC-Q100 screening, operating from -40 to 175°C. It features 48 terminals in a square chip carrier package style, suitable for automotive power supply management circuits. With a voltage range of 3-40V and adjustable threshold, it offers versatile performance in compact dimensions.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Sensible Micro Corp

USA . 1,470 parts In-Stock

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1,470

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Vyrian

USA . 1,309 parts In-Stock

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1,309

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Digiode

USA . 159 parts In-Stock

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159

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Nova Conductors

Japan . 58 parts In-Stock

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58

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ComSIT Distribution GmbH

Germany . 21 parts In-Stock

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Ampacity Inc.

Singapore . 1,496 parts In-Stock

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$0.500

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1,496

$0.500

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Semicontronic

India . 595 parts In-Stock

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$4.500

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$4.388

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$4.365

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595

$4.500

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$4.365

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AZTECH Wire

Italy . 289 parts In-Stock

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$11.954

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289

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Component Connect

USA . 4,403 parts In-Stock

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4,403

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Argo Parts USA

USA . 2,548 parts In-Stock

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Continental Prestige Electronics

USA . 2,518 parts In-Stock

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Corphita

USA . 760 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Experience unmatched quality and reliability with the TLF35585QVS01 by Infineon Technologies. As a leader in Power Management ICs, Infineon Technologies brings you a product that is designed for excellence. This versatile chip carrier with very thin profile offers a wide range of applications, making it perfect for various power supply management circuits. With a temperature range from -40 to 175°C and adjustable threshold feature, this product provides customers with superior performance and flexibility. Trust Infineon Technologies for cutting-edge technology and unparalleled value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets stringent automotive industry standards for reliability and performance.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity options, making the product suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably in demanding situations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function effectively in cold environments without any issues.

Width (mm): 7 mm

The compact width of 7mm makes the product space-efficient and suitable for use in tight layouts or crowded circuit boards.

Technical Specifications

Power Management ICs TLF35585QVS01 attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

TLF35585QVS01 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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