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UCD3138RMHR

Texas Instruments

UCD3138RMHR by Texas Instruments

UCD3138RMHR by Texas Instruments is a Power Management IC with 8 outputs. It operates b/w -40 to 125°C, suitable for automotive applications. The chip carrier package style has a very thin profile and nickel palladium gold terminal finish, making it ideal for surface mount assembly.

Median Price

$16.011

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 823 parts In-Stock

1+ parts

$16.011

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$12.969

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823

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$12.969

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Vyrian

USA . 3,790 parts In-Stock

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Digiode

USA . 1,100 parts In-Stock

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1,100

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ACDS - Activité Composants Distribution Service

France . 823 parts In-Stock

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Dan-Mar Components

USA . 823 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,463 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 869 parts In-Stock

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$8.997

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$9.666

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869

$8.997

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$9.666

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ChromeModa Solutions

Germany . 818 parts In-Stock

1+ parts

$10.109

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$8.289

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818

$10.109

$8.289

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IDEA Electronic Components Group

UK . 221 parts In-Stock

1+ parts

$10.109

100+ parts

$9.604

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$9.098

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221

$10.109

$9.604

$9.098

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AZTECH Wire

Italy . 511 parts In-Stock

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$17.018

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Microchip USA

USA . 313 parts In-Stock

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$25.340

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$24.980

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$24.800

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$24.610

313

$25.340

$24.980

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$24.610

Lixinc

USA . 12,711 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,574 parts In-Stock

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Corphita

USA . 1,658 parts In-Stock

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DigiPath Technology Company

USA . 622 parts In-Stock

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$9.114

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622

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Kepictronics

USA . 100 parts In-Stock

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Overview

Power up your applications with the UCD3138RMHR by Texas Instruments, a top-tier manufacturer of high-quality Power Management ICs. This cutting-edge product offers unmatched reliability and performance, making it ideal for a wide range of applications. From automotive to industrial settings, this chip carrier with a very thin profile provides efficient power supply management without compromising on quality. Say goodbye to subpar performance and invest in the UCD3138RMHR for superior power management solutions that truly deliver value and benefits to you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent resistance to shock and vibration, making the product durable and reliable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in demanding environments where temperature fluctuations occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold conditions without any loss in performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent conductivity, corrosion resistance, and solderability, ensuring a long-lasting and well-functioning connection.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent requirements for temperature, vibration, and moisture resistance, making it ideal for use in vehicles.

Maximum Supply Current (Isup): 100 mA

With a high maximum supply current, this product can efficiently manage and distribute power to multiple outputs without overheating or failing.

Technical Specifications

Power Management ICs UCD3138RMHR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.75 mm

Maximum Supply Current (Isup):

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

UCD3138RMHR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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