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UCD3138064RGZT

Texas Instruments

UCD3138064RGZT by Texas Instruments

UCD3138064RGZT by Texas Instruments is a Power Management IC with dimensions of 7mm x 7mm x 0.9mm. It features a terminal finish of NiPdAu and operates as a power supply management circuit. With peak reflow temperature of 260°C, it is suitable for various applications requiring compact power management solutions.

Median Price

$12.425

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

$7.090

100+ parts

$6.950

1k+ parts

$6.810

10k+ parts

-

4,000

$7.090

$6.950

$6.810

-

DigiKey

USA . 246 parts In-Stock

1+ parts

$17.760

100+ parts

$12.213

1k+ parts

-

10k+ parts

-

246

$17.760

$12.213

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,975 parts In-Stock

1+ parts

$16.710

100+ parts

-

1k+ parts

-

10k+ parts

-

2,975

$16.710

-

-

-

Vyrian

USA . 7,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,594

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 319 parts In-Stock

1+ parts

$12.610

100+ parts

-

1k+ parts

$13.068

10k+ parts

-

319

$12.610

-

$13.068

-

IDEA Electronic Components Group

UK . 2,350 parts In-Stock

1+ parts

$14.169

100+ parts

$13.461

1k+ parts

$12.752

10k+ parts

-

2,350

$14.169

$13.461

$12.752

-

ChromeModa Solutions

Germany . 1,089 parts In-Stock

1+ parts

$14.169

100+ parts

$11.619

1k+ parts

-

10k+ parts

-

1,089

$14.169

$11.619

-

-

Ampacity Inc.

Singapore . 246 parts In-Stock

1+ parts

$14.950

100+ parts

-

1k+ parts

-

10k+ parts

-

246

$14.950

-

-

-

Semicontronic

India . 246 parts In-Stock

1+ parts

$15.100

100+ parts

$14.722

1k+ parts

$14.647

10k+ parts

-

246

$15.100

$14.722

$14.647

-

Corphita

USA . 555 parts In-Stock

1+ parts

$15.831

100+ parts

-

1k+ parts

-

10k+ parts

-

555

$15.831

-

-

-

Corohmni

South Africa . 174 parts In-Stock

1+ parts

$17.590

100+ parts

-

1k+ parts

-

10k+ parts

-

174

$17.590

-

-

-

DigiPath Technology Company

USA . 2,046 parts In-Stock

1+ parts

-

100+ parts

$12.775

1k+ parts

-

10k+ parts

-

2,046

-

$12.775

-

-

Microchip USA

USA . 207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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207

-

-

-

-

Overview

Power up your projects with the UCD3138064RGZT by Texas Instruments, a high-quality Power Management IC that offers unparalleled performance and reliability. Manufactured by the trusted brand Texas Instruments, this IC is designed for a wide range of applications in power supply management circuits. With its nickel palladium gold terminal finish and compact size, this IC provides superior functionality while saving space in your designs. Experience the value and benefits of using the UCD3138064RGZT, ensuring efficiency and precision in your power management needs.

Feature Benefit Bullets

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures high-quality connections and reliable performance, extending the lifespan of the product.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9 mm allows for a compact design and efficient use of space in electronic devices.

Width (mm): 7 mm

The 7mm width offers a balance between functionality and space savings, making this power management IC suitable for a range of applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit enhances the efficiency and performance of the overall power management system, providing optimal power distribution and regulation.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow temperature time of 30 seconds, this product can withstand high-temperature soldering processes without compromising its functionality.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures the product can endure high-temperature manufacturing processes, contributing to its durability and reliability.

Length: 7 mm

The 7mm length allows for a compact and space-efficient design, making this power management IC suitable for smaller electronic devices where space is limited.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch facilitates easy and secure connections, enhancing the overall reliability and stability of the power management IC.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this power management IC can withstand moderate exposure to moisture during storage and handling, ensuring its long-term functionality and reliability.

Technical Specifications

Power Management ICs UCD3138064RGZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Pitch:

.5 mm

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

UCD3138064RGZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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