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UCD3138064RGCT

Texas Instruments

UCD3138064RGCT by Texas Instruments

UCD3138064RGCT by Texas Instruments is a Power Management IC with 64 terminals in a square chip carrier package. Operating temperature range from -40 to 125°C, suitable for automotive applications. Features include CMOS technology, 8 outputs, and peak reflow temperature of 260°C.

Median Price

$12.978

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,228 parts In-Stock

1+ parts

$9.850

100+ parts

$9.650

1k+ parts

$9.460

10k+ parts

-

3,228

$9.850

$9.650

$9.460

-

Texas Instruments

USA . 1,730 parts In-Stock

1+ parts

$16.107

100+ parts

$14.069

1k+ parts

$9.703

10k+ parts

-

1,730

$16.107

$14.069

$9.703

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,837 parts In-Stock

1+ parts

$15.302

100+ parts

-

1k+ parts

-

10k+ parts

-

2,837

$15.302

-

-

-

Component Electronics Inc.

Canada . 63 parts In-Stock

1+ parts

$42.310

100+ parts

$31.730

1k+ parts

$27.500

10k+ parts

-

63

$42.310

$31.730

$27.500

-

Vyrian

USA . 6,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,622

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,296 parts In-Stock

1+ parts

$14.496

100+ parts

-

1k+ parts

-

10k+ parts

-

2,296

$14.496

-

-

-

Parana Technologies

USA . 1,123 parts In-Stock

1+ parts

$16.313

100+ parts

-

1k+ parts

$16.619

10k+ parts

-

1,123

$16.313

-

$16.619

-

AZTECH Wire

Italy . 135 parts In-Stock

1+ parts

$16.770

100+ parts

-

1k+ parts

-

10k+ parts

-

135

$16.770

-

-

-

DigiPath Technology Company

USA . 1,407 parts In-Stock

1+ parts

$17.962

100+ parts

$16.525

1k+ parts

-

10k+ parts

-

1,407

$17.962

$16.525

-

-

ChromeModa Solutions

Germany . 5,922 parts In-Stock

1+ parts

$18.329

100+ parts

$15.030

1k+ parts

-

10k+ parts

-

5,922

$18.329

$15.030

-

-

IDEA Electronic Components Group

UK . 2,227 parts In-Stock

1+ parts

$18.329

100+ parts

$17.413

1k+ parts

$16.496

10k+ parts

-

2,227

$18.329

$17.413

$16.496

-

Overview

Experience unrivaled quality and reliability with the UCD3138064RGCT from Texas Instruments, a leading manufacturer in Power Management ICs. This advanced chip carrier offers a wide range of applications in power supply management circuits, making it ideal for automotive use. With its compact design and high temperature grade, this product ensures optimal performance in demanding environments. Trust Texas Instruments to deliver cutting-edge technology that caters to your unique needs and provides exceptional value to customers seeking efficiency and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a durable and lightweight housing for the Power Management IC, making it suitable for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on electronic circuit boards, saving time and effort during assembly.

No. of Terminals: 64

With 64 terminals, this Power Management IC offers ample connectivity options for interfacing with other components in a system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions, making it suitable for a wide range of environments.

Technology: CMOS

The CMOS technology used in this Power Management IC provides low power consumption and high noise immunity, enhancing overall efficiency and reliability.

Technical Specifications

Power Management ICs UCD3138064RGCT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

8

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.88 mm

Maximum Supply Current (Isup):

100 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9 mm

Trade Compliance

UCD3138064RGCT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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