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TPS2044BDG4

Texas Instruments

TPS2044BDG4 by Texas Instruments

TPS2044BDG4 by Texas Instruments is a Power Management IC with 16 terminals, operating at -40 to 85°C. It supports 3.3V nominal voltage and has 4 channels for power supply applications. The package style is small outline, suitable for industrial use with a max seated height of 1.75mm.

Median Price

$5.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 304 parts In-Stock

1+ parts

$5.420

100+ parts

$3.270

1k+ parts

$1.720

10k+ parts

-

304

$5.420

$3.270

$1.720

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$1.980

100+ parts

-

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34

$1.980

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Digiode

USA . 1,131 parts In-Stock

1+ parts

$4.038

100+ parts

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1,131

$4.038

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Chip Stock

USA . 7,030 parts In-Stock

1+ parts

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7,030

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Vyrian

USA . 5,855 parts In-Stock

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5,855

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Bristol Electronics

USA . 120 parts In-Stock

1+ parts

-

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$1.430

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120

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$1.430

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Dan-Mar Components

USA . 120 parts In-Stock

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120

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Distributors (Availability)

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Corohmni

South Africa . 535 parts In-Stock

1+ parts

$1.740

100+ parts

-

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535

$1.740

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$1.792

100+ parts

$1.703

1k+ parts

$1.703

10k+ parts

-

2,000

$1.792

$1.703

$1.703

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Continental Prestige Electronics

USA . 6,308 parts In-Stock

1+ parts

$1.980

100+ parts

-

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$1.940

6,308

$1.980

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$1.940

Argo Parts USA

USA . 1,187 parts In-Stock

1+ parts

$1.980

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1,187

$1.980

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.980

100+ parts

$1.940

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100

$1.980

$1.940

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Ampacity Inc.

Singapore . 305 parts In-Stock

1+ parts

$3.610

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305

$3.610

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Semicontronic

India . 38 parts In-Stock

1+ parts

$3.620

100+ parts

$3.530

1k+ parts

$3.511

10k+ parts

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38

$3.620

$3.530

$3.511

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Corphita

USA . 4,018 parts In-Stock

1+ parts

$3.825

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4,018

$3.825

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AZTECH Wire

Italy . 598 parts In-Stock

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$6.320

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598

$6.320

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Parana Technologies

USA . 1,484 parts In-Stock

1+ parts

$9.016

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$9.686

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1,484

$9.016

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$9.686

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ChromeModa Solutions

Germany . 6,703 parts In-Stock

1+ parts

$10.130

100+ parts

$8.307

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6,703

$10.130

$8.307

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IDEA Electronic Components Group

UK . 535 parts In-Stock

1+ parts

$10.130

100+ parts

$9.624

1k+ parts

$9.117

10k+ parts

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535

$10.130

$9.624

$9.117

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Microchip USA

USA . 4,593 parts In-Stock

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4,593

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DigiPath Technology Company

USA . 1,050 parts In-Stock

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$9.133

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1,050

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$9.133

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

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150

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Perfect Parts

USA . 34 parts In-Stock

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34

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Overview

Upgrade your power management solutions with the TPS2044BDG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with efficient power supply support in a compact package. Trust in Texas Instruments to deliver cutting-edge technology and superior performance. Experience the value and benefits of the TPS2044BDG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for power management ICs as it provides good insulation and protection for the internal components.

Surface Mount: YES

Surface mount technology allows for easy and efficient automated assembly, making the product suitable for mass production.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard in many electronic devices, making this power management IC compatible with a wide range of systems.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and flexibility in design for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this power management IC can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can function in cold climates without any issues.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity, corrosion resistance, and durability for reliable electrical connections.

Width (mm): 3.9 mm

The compact width of 3.9mm allows for space-saving integration of this power management IC in tight electronic assemblies.

Temperature Grade: INDUSTRIAL

Being classified as industrial-grade ensures that this power management IC is rugged and reliable for use in industrial applications with demanding conditions.

Maximum Supply Current (Isup): 0.14 mA

The low maximum supply current helps in minimizing power consumption and heat dissipation, making the IC energy-efficient.

Technical Specifications

Power Management ICs TPS2044BDG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.14 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2044BDG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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