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TPS2051BDGNR

Texas Instruments

TPS2051BDGNR by Texas Instruments

TPS2051BDGNR by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It is designed for industrial applications requiring a small outline package with surface mount capability and dual terminal position.

Median Price

$0.841

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 461,673 parts In-Stock

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Arrow

USA . 11 parts In-Stock

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Mouser Electronics

USA . 18,200 parts In-Stock

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$0.662

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$0.596

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DigiKey

USA . 4,447 parts In-Stock

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$1.150

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$0.662

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$0.574

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$0.533

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Chip1Stop

Japan . 2,500 parts In-Stock

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Farnell

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Verical

USA . 873 parts In-Stock

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Element14

Singapore . 782 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

USA . 1,441 parts In-Stock

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Component Electronics Inc.

Canada . 1,570 parts In-Stock

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$0.750

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Forefront Electronics and Design

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Vyrian

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Chip Stock

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Cyclops Electronics Ltd

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Sensible Micro Corp

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Bristol Electronics

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Q Components

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ComSIT Distribution GmbH

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ComSIT USA

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Lantek

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Connector Distribution Corp

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Right Parts Inc.

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Semi Source

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LWI Electronics Inc

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Velocity Electronics

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Ampacity Inc.

Singapore . 54,926 parts In-Stock

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$0.267

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Argo Parts USA

USA . 2,543 parts In-Stock

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$0.495

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Continental Prestige Electronics

USA . 2,522 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Semicontronic

India . 55,371 parts In-Stock

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$0.580

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$0.566

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Corphita

USA . 724 parts In-Stock

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$0.647

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Modulus Dynamics

Lithuania . 2,762 parts In-Stock

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$1.856

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$1.856

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$1.856

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Microchip USA

USA . 3,979 parts In-Stock

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Corohmni

South Africa . 255 parts In-Stock

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$13.401

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Parana Technologies

USA . 1,872 parts In-Stock

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ChromeModa Solutions

Germany . 4,137 parts In-Stock

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IDEA Electronic Components Group

UK . 1,377 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Assy Fe

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Robosynatics

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Lucentia Tech

USA . 1,500 parts In-Stock

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Lixinc

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DigiPath Technology Company

USA . 903 parts In-Stock

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Authorized Procurement Solutions

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ChipstoGo Electronic ltd

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Overview

Experience the superior quality and reliability of Texas Instruments with the TPS2051BDGNR Power Management IC. Designed for a wide range of applications, this innovative IC offers unparalleled performance and efficiency. With a compact design and advanced features, it provides customers with exceptional value and benefits. Trust Texas Instruments to deliver cutting-edge technology that meets your power management needs effortlessly. Elevate your projects with the TPS2051BDGNR and experience the difference of industry-leading solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IC, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal voltage for various power management applications, ensuring stable performance.

Maximum Operating Temperature: 85 °C

Allows for reliable operation even in high temperature environments, making it suitable for industrial applications.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Width (mm): 3 mm

Compact size allows for space-efficient designs and versatile placement within electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring stable operation in challenging conditions.

Maximum Supply Current (Isup): 0.07 mA

Low power consumption helps to conserve energy and prolong battery life in portable devices.

Technical Specifications

Power Management ICs TPS2051BDGNR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.07 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS2051BDGNR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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